Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: The present disclosure provides a UV-blocking silicone hydrogel composition including a hydrophilic silicone macromer, a UV-blocking monomer, a first hydrophilic monomer, a crosslinker and a polymerization initiator. The hydrophilic silicone macromer has a general formula: V-L-S-(L?-V?)x, wherein V and V? are independently ethylenically-based polymerizable groups, L and L? are independently a covalent bond or a linkage group, S is a siloxane group having a chemical structure such as and x is 0 or 1. A silicone contact lens containing the UV-blocking silicone hydrogel composition is also provided herein.

Abstract: The present disclosure provides a UV-blocking silicone hydrogel composition including a hydrophilic silicone macromer, a UV-blocking monomer, a first hydrophilic monomer, a crosslinker and a polymerization initiator. The hydrophilic silicone macromer has a general formula: V-L-S-(L?-V?)x, wherein V and V? are independently ethylenically-based polymerizable groups, L and L? are independently a covalent bond or a linkage group, S is a siloxane group having a chemical structure such as and x is 0 or 1. A silicone contact lens containing the UV-blocking silicone hydrogel composition is also provided herein.

Abstract: A plug and play unit is provided. The plug and play unit includes a unit housing, a joint, a substrate and a heat conductive member. The joint is connected to the unit housing. The substrate is disposed in the unit housing and the joint, wherein the substrate includes a heat conductive layer and a USB connection port. The heat conductive member thermally connects the joint to the heat conductive layer to transmit heat from the heat conductive layer to the joint.