Patents by Inventor Che-chun KUO

Che-chun KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12118925
    Abstract: A display device includes a multiple of light-emitting elements and a multiple of driving circuits. Each of the multiple of driving circuits is configured to generate a driving current flowing through one of the multiple of light-emitting elements. Each of the multiple of driving circuits includes a first transistor, a second transistor, a reset circuit, a first control circuit and a second control circuit. The driving current flows from a first system high voltage terminal through the first transistor, the second transistor and one of the multiple of light-emitting elements to a system low voltage terminal. The first control circuit is configured to control the first transistor to modulate pulse amplitude of the driving current. The second control circuit is configured to control the second transistor to modulate pulse width of the driving current.
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: October 15, 2024
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Che-Chia Chang, Shang-Jie Wu, Yu-Chieh Kuo, Hsien-Chun Wang, Sin-An Lin, Mei-Yi Li, Yu-Hsun Chiu, Ming-Hung Chuang, Yi-Jung Chen
  • Publication number: 20240336726
    Abstract: A copolyester is formed by reacting 100 parts by weight of a polyester elastomer and 0.01 to 0.29 parts by weight of a compound having multi-functional groups. The polyester elastomer is formed by reacting polyethylene terephthalate, diol, and poly(alkylene ether)glycol. The polyethylene terephthalate and the diol have a weight ratio of 1:0.6 to 1:3, and the polyethylene terephthalate and the poly(alkylene ether) glycol have a weight ratio of 1:0.05 to 1:3.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 10, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Che-Tseng LIN, Kai-Chuan KUO, Jen-Chun CHIU
  • Publication number: 20240291446
    Abstract: A single-pole single-throw (SPST) radio frequency (RF) switch is provided that includes one or more switches stacked in series, and a first capacitor disposed at an input side of the SPST RF switch, in series, before the one or more switches. The SPST RF switch also includes a second capacitor disposed, in parallel, across the one or more switches, and an inductor disposed at an output side of the SPST RF switch, in series, after the one or more switches.
    Type: Application
    Filed: May 15, 2023
    Publication date: August 29, 2024
    Inventors: Ying CHEN, Che-Chun KUO, Tienyu CHANG
  • Publication number: 20240239986
    Abstract: A copolyester is formed by copolymerizing a depolymerized polyester and succinic acid. The depolymerized polyester includes depolymerized polyethylene terephthalate (PET), and the depolymerized PET is formed by depolymerizing PET with ethylene glycol. The repeating unit of PET and the succinic acid have a molar ratio of 40:60 to 50:50. The repeating unit of PET and the ethylene glycol have a molar ratio of 100:100 to 100:500. The copolyester has a storage modulus of 1*104 Pa to 1*106 Pa at 80° C. The copolyester can be used in a hot melt adhesive.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Che-Tseng LIN, Meng-Hsin CHEN, Jen-Chun CHIU, Kai-Chuan KUO, Yu-Lin CHU, Po-Hsien HO, Ke-Hsuan LUO, Chih-Hsiang LIN, Hui-Ching HSU
  • Publication number: 20230318539
    Abstract: A wide band matching network for power amplifier impedance matching, the wide band matching network comprising: a power amplifier transistor connected to an output network; the output network including: a series capacitor; an on-chip transformer connected to the capacitor in series, wherein the transformer and the capacitor act as a second order filter; and a port connected to the capacitor and a receiver switch.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Inventors: Che-Chun Kuo, Siu-Chuang Ivan Lu, Sang Won Son, Xiaohua Yu
  • Patent number: 11689162
    Abstract: A wide band matching network for power amplifier impedance matching, the wide band matching network comprising: a power amplifier transistor connected to an output network; the output network including: a series capacitor; an on-chip transformer connected to the capacitor in series, wherein the transformer and the capacitor act as a second order filter; and a port connected to the capacitor and a receiver switch.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: June 27, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Che-Chun Kuo, Siu-Chuang Ivan Lu, Sang Won Son, Xiaohua Yu
  • Publication number: 20220060155
    Abstract: A wide band matching network for power amplifier impedance matching, the wide band matching network comprising: a power amplifier transistor connected to an output network; the output network including: a series capacitor; an on-chip transformer connected to the capacitor in series, wherein the transformer and the capacitor act as a second order filter; and a port connected to the capacitor and a receiver switch.
    Type: Application
    Filed: December 3, 2020
    Publication date: February 24, 2022
    Inventors: Che-Chun Kuo, Siu-Chuang Ivan Lu, Sang Won Son, Xiaohua Yu
  • Patent number: 10778200
    Abstract: An RF frontend IC device includes an RF transceiver to transmit and receive RF signals and a frequency synthesizer to perform frequency synthetization to operate within a predetermined frequency band. The frequency synthesizer generates an LO signal to the RF transceiver to enable the RF transceiver to transmit and receive RF signals within the predetermined frequency band. The frequency synthesizer includes a QPG circuit to generate signals shifted in phases based on the LO signal and a phase shifting circuit to generate quadrant signals based on the signals shifted in phases. Each of the quadrant signals corresponds to one of the four quadrants in phases in the respective quadrant spaces. The phase shifting circuit includes multiple phase switches operable in a collaboration manner to further shift in phase based on the signal shifted in phases to generate the quadrant signals in proper quadrant spaces.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: September 15, 2020
    Assignee: SWIFTLINK TECHNOLOGIES INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10756432
    Abstract: An RF antenna includes a first substrate having a first top surface and a first bottom surface and a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon. The RF antenna further includes a low-band (LB) radiation element disposed on the first top surface of the first substrate. The LB radiation element is to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band. The RF antenna further includes multiple high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate. Each HB radiation element is to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: August 25, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD.
    Inventors: Robert Hill, Zhanyi Qian, Che-Chun Kuo, Bin Yu
  • Patent number: 10553551
    Abstract: A flip chip IC device utilized in RF transceivers includes a bare die having a number of metalized pads and each metalized pad has a solder ball deposited thereon. The flip chip IC device further includes a substrate having a number of connector pads corresponding to the metalized pads. The connector pads are connected to one or more electronic components disposed on the substrate via a number of connector strips. The bare die is flipped up-side-down such that the metalized solder pads are aligned and connected with the connector pads of the substrate via the solder balls. At least one of the connector strips includes a strip section having an uneven strip width configured to compensate an impedance of a transmission line formed based on a connection between a metalized pad of the bare die and a connector pad of the substrate to match predetermined impedance.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: February 4, 2020
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Publication number: 20190363702
    Abstract: An RF frontend IC device includes an RF transceiver to transmit and receive RF signals and a frequency synthesizer to perform frequency synthetization to operate within a predetermined frequency band. The frequency synthesizer generates an LO signal to the RF transceiver to enable the RF transceiver to transmit and receive RF signals within the predetermined frequency band. The frequency synthesizer includes a QPG circuit to generate signals shifted in phases based on the LO signal and a phase shifting circuit to generate quadrant signals based on the signals shifted in phases. Each of the quadrant signals corresponds to one of the four quadrants in phases in the respective quadrant spaces. The phase shifting circuit includes multiple phase switches operable in a collaboration manner to further shift in phase based on the signal shifted in phases to generate the quadrant signals in proper quadrant spaces.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 28, 2019
    Inventors: Che-Chun KUO, Taiyun CHI, Thomas CHEN
  • Publication number: 20190348379
    Abstract: A flip chip IC device utilized in RF transceivers includes a bare die having a number of metalized pads and each metalized pad has a solder ball deposited thereon. The flip chip IC device further includes a substrate having a number of connector pads corresponding to the metalized pads. The connector pads are connected to one or more electronic components disposed on the substrate via a number of connector strips. The bare die is flipped up-side-down such that the metalized solder pads are aligned and connected with the connector pads of the substrate via the solder balls. At least one of the connector strips includes a strip section having an uneven strip width configured to compensate an impedance of a transmission line formed based on a connection between a metalized pad of the bare die and a connector pad of the substrate to match predetermined impedance.
    Type: Application
    Filed: May 8, 2018
    Publication date: November 14, 2019
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10439575
    Abstract: According to one embodiment, a differential power amplifier includes a pair of transistors, a transformer coupled to the drain terminals of the transistors, and an output transmission line. The differential power amplifier operates in a range of frequencies from a lower operating frequency to an upper operating frequency to provide a relatively linear gain between the lower operating frequency and the higher operating frequency. The drains of the transistors are coupled to the primary winding of the transformer. The output transmission line is coupled to the secondary winding of the transformer. The output transmission line further includes at least one inductor-capacitor (LC) circuit that is configured to match predetermined output impedance in view of the lower and upper operating frequencies of the differential power amplifier.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 8, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Publication number: 20190252776
    Abstract: An RF antenna includes a first substrate having a first top surface and a first bottom surface and a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon. The RF antenna further includes a low-band (LB) radiation element disposed on the first top surface of the first substrate. The LB radiation element is to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band. The RF antenna further includes multiple high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate. Each HB radiation element is to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.
    Type: Application
    Filed: February 13, 2018
    Publication date: August 15, 2019
    Inventors: Robert Hill, Zhanyi Qian, Che-Chun Kuo, Bin Yu
  • Patent number: 10374558
    Abstract: A power amplifier includes a transistor operating in a range of frequencies from a lower operating frequency to a higher operating frequency to provide a relatively linear gain between the lower operating frequency and the higher operating frequency, an input transmission line circuit coupled to a gate terminal of the transistor, and an output transmission line circuit coupled to a drain terminal of the transistor. The input transmission line includes an inductor-capacitor (LC) circuit that resonates at a first resonant frequency equaled to or higher than the higher operating frequency. The output transmission line includes an inductor-capacitor-inductor (LCL) circuit and a capacitor-inductor-capacitor (CLC) circuit. The LCL circuit resonates at a second resonant frequency equaled to or lower than the lower operating frequency. The CLC circuit resonates at a third resonant frequency equaled to or higher than the higher operating frequency.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: August 6, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10326636
    Abstract: An RF frontend circuit includes an RF transceiver and a frequency synthesizer to perform frequency synthetization in a wide frequency spectrum. The frequency synthesizer generates an LO signal to the RF transceiver. The frequency synthesizer includes a quadrature signal generator to generate a quadrature LO signal based on the LO signal. The quadrature signal generator includes a first transformer. A first primary winding of the first transformer is disposed on a first substrate layer of the IC and a secondary winding of the first transformer is disposed on a second substrate layer of an IC. A second transformer is coupled to the first transformer in series. A second primary winding of the second transformer is disposed on the first substrate layer of the IC and a secondary winding of the second transformer is disposed on the second substrate layer of the IC.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 18, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 9160065
    Abstract: The present invention provides a substrate-embedded antenna and an antenna array constituted by said antennas. An antenna of the present invention comprises a plurality of substrates, a metal fill and a feed line. Each of the substrates has at least one through-hole. The metal fill is placed within each through-hole, and each metal fill placed therein connects one another to form a columnar metal conductor which acts as a radiating body of the antenna. The feed line is electrically coupled to the metal conductor to input and output electrical signals. A plurality of said antennas may constitute an antenna array.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: October 13, 2015
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Hsin-Chia Lu, Che-Chun Kuo, Chen-Fang Tai
  • Publication number: 20140028515
    Abstract: The present invention provides a substrate-embedded antenna and an antenna array constituted by said antennas. An antenna of the present invention comprises a plurality of substrates, a metal fill and a feed line. Each of the substrates has at least one through-hole. The metal fill is placed within each through-hole, and each metal fill placed therein connects one another to form a columnar metal conductor which acts as a radiating body of the antenna. The feed line is electrically coupled to the metal conductor to input and output electrical signals. A plurality of said antennas may constitute an antenna array.
    Type: Application
    Filed: March 7, 2013
    Publication date: January 30, 2014
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Hsin-chia LU, Che-chun KUO, Chen-fung TAI