Patents by Inventor Che-Hsi Lin

Che-Hsi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MEASURING THICKNESS OF THERMAL GREASE AND MEASURING SYSTEM AND MEASURING MODULE USING THE SAME
    Publication number: 20070242721
    Abstract: A method for measuring the thickness of the thermal grease is provided. A heat dissipation module, suitable for dissipating heat from a chip, is provided. The heat dissipation module has a surface provided with a chip bonding area. A layer of thermal grease is coated on the chip bonding area. A first measuring point is selected from an area of the surface outside the chip bonding area, and a second measuring point is selected from the top surface of the thermal grease. A non-contact measuring device is provided. Then the non-contact measuring device is disposed above the thermal grease, and the first measuring point and the second measuring point are measured by using the non-contact measuring device to respectively obtain a first measuring value and a second measuring value. The first measuring value is compared with the second measuring value, so as to obtain the thickness of the thermal grease.
    Type: Application
    Filed: April 14, 2007
    Publication date: October 18, 2007
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Che-Hsi Lin, Teng-Nan Lo