Abstract: A hinge module including a first rotating shaft, a second rotating shaft, a sliding member, a first torque member, and a second torque member is provided. The sliding member coupled to the first rotating shaft and the second rotating shaft simultaneously. The first rotating shaft and the second rotating shaft are rotated synchronously via the sliding member. The first torque member and the second torque member are connected to the first rotating shaft and the second rotating shaft, and the first torque member and the second torque member are located at opposite sides of a sliding range of the sliding member. A foldable electronic device is also provided.

Abstract: An electronic device includes a first body, a second body, a hinge module and a linkage mechanism. The second body includes a main body portion and a back cover movably disposed to the main body portion. The hinge module is pivoted between the first body and the second body. The linkage mechanism is disposed in the second body, and is connected to the hinge module. The back cover is fixed to the linkage mechanism. The linkage mechanism is changed between a first state and a second state. When the linkage mechanism is in the first state, there is a first space between the back cover and the hinge module. When the linkage mechanism is in the second state, there is a second space between the back cover and the hinge module. The second space is larger than the first space.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A semiconductor substrate with gate structures formed thereon is provided. A source/drain region is formed in the semiconductor substrate and formed between the gate structures. A dielectric layer is formed on the source/drain region and located between the gate structures. An opening penetrating the dielectric layer on the source/drain region is formed. A lower portion of a first conductive structure is formed in the opening. A dielectric spacer is formed on the lower portion and on an inner wall of the opening. An upper portion of the first conductive structure is formed in the opening and on the lower portion. The dielectric spacer surrounds the upper portion of the first conductive structure. The first conductive structure is formed by two steps for forming the dielectric spacer surrounding the upper portion and improving the electrical performance of the semiconductor device.

Abstract: A dual-shaft hinge and an electronic device are provided. The dual-shaft hinge includes a first rotating shaft, a second rotating shaft, a fixing assembly, a torque element, and a first carrier plate. The fixing assembly has first via, second via, and a first locating hole. The first rotating shaft is inserted in the first via, and the second rotating shaft is inserted in the second via. The torque element has a connection portion, a first torque providing portion and a second torque providing portion extending from two opposite sides of the connection portion, and a first positioning protruding portion and a second positioning protruding portion extending from the other two opposite sides of the connection portion. The first rotating shaft is inserted in a first hole groove, and the second rotating shaft is inserted in a second hole groove. The first positioning protruding portion is inserted in the first locating hole.

Abstract: A hinge module includes a first bracket, a second bracket, a pivot assembly, a pressing component and an adjusting structure. The first bracket has at least one first sliding slot. The first bracket and the second bracket are pivoted to each other by the pivot assembly, wherein the pivot assembly has a first sliding portion that is slidably disposed in the first sliding slot. The pressing component is connected to the first bracket and the first sliding portion. The adjusting structure is connected to the pressing component that presses the first sliding portion by the adjusting structure. When the first bracket and the second bracket rotate relative to each other, the first sliding portion slides along the first sliding slot, and the hinge module generates a torsional force by continuously pressing the first sliding portion by the pressing component. In addition, an electronic device including the hinge module is provided.

Abstract: A hinge module includes a base, a torsional force providing structure, two axles, two brackets, and at least one fixing component. The base has at least one first concave. The torsional force providing structure is disposed in the base and has two torsional force providing portions. The two axles penetrate the two torsional force providing portions respectively. The two brackets are connected to the two axles respectively. The fixing component is disposed in the first concave and abuts the torsional force providing structure, such that the torsional force providing structure is fixed to the base. In addition, an electronic device including the hinge module is also provided.

Abstract: A lifting hinge module includes a first bracket, a rotating shaft rotatably connected to the first bracket, a driving bracket disposed on the rotating shaft, a first guiding bracket disposed on the first bracket, a second guiding bracket disposed on the first bracket and spaced from the first guiding bracket, a sliding link having a first end rotatably connected to the driving bracket and a second end slidably connected to the first guiding bracket, and a supporting link rotatably connected to a second end of a sliding link and slidably connected to the second guiding bracket. When the rotating shaft rotates relative to the first bracket, the driving bracket is adapted to drive the second end of the sliding link to slide relative to the first guiding bracket, and the sliding link is adapted to drive the supporting link to slide and lift relative to the second guiding bracket.

Abstract: A hinge structure including a hinge cover, a torsion element, a bracket, a fixing element and a shaft is provided. The torsion element is disposed at the hinge cover. The bracket is disposed at a side of the torsion element. The fixing element is fixed at one of the torsion element and the bracket by a fixing portion. The shaft is disposed at the hinge cover and passed through the torsion element, the bracket and the fixing element so that one of the torsion element and the bracket is adapted to rotate with the fixing element in relative to another one of the torsion element and the bracket through the shaft as an axle center. An electronic device including the aforementioned hinge structure is also provided.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A semiconductor substrate with gate structures formed thereon is provided. A source/drain region is formed in the semiconductor substrate and formed between the gate structures. A dielectric layer is formed on the source/drain region and located between the gate structures. An opening penetrating the dielectric layer on the source/drain region is formed. A lower portion of a first conductive structure is formed in the opening. A dielectric spacer is formed on the lower portion and on an inner wall of the opening. An upper portion of the first conductive structure is formed in the opening and on the lower portion. The dielectric spacer surrounds the upper portion of the first conductive structure. The first conductive structure is formed by two steps for forming the dielectric spacer surrounding the upper portion and improving the electrical performance of the semiconductor device.

Abstract: An expansion hinge including a torque module, two first brackets, two sliding brackets, two second brackets and two elastic modules is provided. The torque module is configured to provide torques. The two first brackets are rotatably connected to two opposite ends of the torque module. The two sliding brackets are rotatably connected to the two opposite ends of the torque module. The two second brackets are slidably disposed in the two sliding brackets respectively. Each of the two elastic modules is disposed between the respective sliding bracket and the respective second bracket. The two sliding brackets are adapted to synchronously slide with respect to the two second brackets, and each of the elastic modules is configured to push the respective sliding bracket and the respective second bracket to form a pulled-out state or a pushed-in state.

Abstract: The present invention provides a static random access memory (SRAM), the SRAM includes a substrate, a SRAM pattern disposed on the substrate, wherein the SRAM pattern at least includes a first gate structure, a second gate structure and a third gate structure, arranged along a first direction, wherein the second gate structure and the third gate structure are parallel to the first gate structure, and a gap is disposed between the second gate structure and the third gate structure, and wherein the first gate structure is composed of a first elongated structure, a second elongated structure and a curved structure disposed between the first elongated structure and the second elongated structure, and wherein the curved structure is aligned with the gap along a second direction, and an interconnection contact structure disposed between the first gate structure and the second gate structure, and arranged along the first direction.

Abstract: A semiconductor structure includes a semiconductor substrate, at least a silicon germanium (SiGe) epitaxial region disposed in the semiconductor substrate, and a contact structure disposed on the SiGe epitaxial region. The contact structure includes a titanium nitride (TiN) barrier layer and a metal layer surrounded by the TiN barrier layer. A crystalline titanium germanosilicide stressor layer is disposed in the SiGe epitaxial region and between the TiN barrier layer and the SiGe epitaxial region.

Abstract: A foldable electronic device includes a first body, a second body, a pivot module, a linkage mechanism, and an input module. The pivot module is connected to the first body and the second body. The second body is pivoted on the first body through the pivot module. The linkage mechanism is disposed in the first body and is connected to the pivot module. The input module is movably disposed on the first body through the linkage mechanism. The linkage mechanism is configured to be driven by the pivot module to cause the input module to move to be close to or away from the pivot module and cause the input module to be inclined or parallel to the first body.

Abstract: A hidden hinge includes a first fixing assembly, a second fixing assembly, a first rotating part and a second rotating part, a first bearing frame, a second bearing frame, and at least one torque member. The first rotating part and the second rotating part are rotatably disposed through the first fixing assembly and the second fixing assembly. The first rotating part and the second rotating part are parallel to each other and respectively have a first teeth portion and a second teeth portion. The first teeth portion and the second teeth portion are arranged in a vertically-staggered manner. The first bearing frame is slidably disposed on the first fixing assembly and has a first rack portion engaged with the first teeth portion. The second bearing frame is slidably disposed on the second fixing assembly and has a second rack portion engaged with the second teeth portion. The at least one torque member is sleeved around the first rotating part and the second rotating part.

Abstract: A hinge assembly and an electronic device using the hinge assembly are provided. The hinge assembly includes a pair of gear brackets coaxially staggered in an axial direction, wherein each gear bracket has a plate portion and an arc portion, and the arc portion has an inner gear; a shaft holder, which is provided between the arc portion of the gear bracket, wherein the shaft holder has a pair of first fixing holes; a pair of gear shafts, which passes through the first fixing hole and is fixed to the shaft holder in parallel to the axial direction, each of the gear shafts has an outer gear portion, the outer gear portion has an outer gear, and the outer gear and the inner gear of the arc portion are engaged with each other; and a pair of torque elements, which are respectively sleeved on opposite ends of the gear shaft; a plurality of gears, which are sleeved on the ends of the gear shaft in a one-to-one manner, and the gears disposed on the same side of the gear shaft are engaged with each other.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A semiconductor substrate with gate structures formed thereon is provided. A source/drain region is formed in the semiconductor substrate and formed between the gate structures. A dielectric layer is formed on the source/drain region and located between the gate structures. An opening penetrating the dielectric layer on the source/drain region is formed. A lower portion of a first conductive structure is formed in the opening. A dielectric spacer is formed on the lower portion and on an inner wall of the opening. An upper portion of the first conductive structure is formed in the opening and on the lower portion. The dielectric spacer surrounds the upper portion of the first conductive structure. The first conductive structure is formed by two steps for forming the dielectric spacer surrounding the upper portion and improving the electrical performance of the semiconductor device.

Abstract: The present invention provides a hinge structure, which comprises a first pivoting assembly, a second pivoting assembly and a first bracket. The first pivoting assembly comprises multiple first piston components, multiple first pivoting arms and a first sliding shaft. Each of the first pivoting arms has a first elastic slot. A diameter of the first sliding shaft is greater than an aperture of the first elastic slot so as to generate a first torque. The first bracket has multiple first grooves separated from each other, and the first piston components are respectively disposed in the first grooves. When the first pivoting assembly pivots relative to the second pivoting assembly to an angle, the first grooves respectively press the first piston components so as to generate a second torque.