Patents by Inventor Che-Kai Yeh
Che-Kai Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240218856Abstract: A force measurement apparatus adapted to be installed on a pile includes at least one pressing ring and a plurality of force sensors. The pressing ring includes a ring body and at least one pressing part. The ring body has at least one end and an inner surface facing the pile. The pressing part is disposed at the end. The force sensor is disposed between the inner surface of the ring body and the pile so as to sense a radial deformation and the degree of eccentricity of the pile.Type: ApplicationFiled: April 25, 2023Publication date: July 4, 2024Applicant: Industrial Technology Research InstituteInventors: Yu-Hsuan Shih, Che-Kai Yeh, Tzung-Ching Lee, Chao-Ta Huang
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Publication number: 20240192063Abstract: An electric signal reconstruction system includes a signal generator and a computing element. The signal generator has a time constant and is configured to generate a plurality of signal value corresponding to a plurality of time points within a time period, wherein the signal values include a designated value, the time points include a designated time point, and the designated value corresponds to the designated time point. The computing element is electrically connected to the signal generator and is configured to perform operations including: performing a differential calculation or an integral calculation according to the time points and the signal values to generate a fundamental value; calculating a correction constant associated with the time constant; calculating a product of the correction constant and the fundamental value as a correction value; calculating a sum of the correction value and the designated value as a reconstruction value; and outputting the reconstruction value.Type: ApplicationFiled: June 2, 2023Publication date: June 13, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Che-Kai YEH, Chih-Che LIN, Chao-Ta HUANG, Shih-Ting LIN
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Patent number: 11630020Abstract: A pressure sensor with calibration device includes a casing, a diaphragm, a sensing element, a medium, and at least one calibration element. The diaphragm is disposed on the casing, wherein the casing and the diaphragm define an accommodating space. The sensing element is disposed in the casing. The medium is filled in the accommodating space and in contact with the sensing element. The at least one calibration element is adjustably disposed at the casing and extended into the accommodating space to be in contact with the medium, wherein when the at least one calibration element is moved relative to the casing in a direction toward the accommodating space or in a direction away from the accommodating space, the at least one calibration element changes the pressure applied to the medium. The pressure sensor with calibration device adjusts the pressure value sensed by the sensing element via the calibration element.Type: GrantFiled: July 9, 2021Date of Patent: April 18, 2023Assignee: Industrial Technology Research InstituteInventors: Che-Kai Yeh, Tzung-Ching Lee, Yu-Wen Hsu, Chao-Ta Huang
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Publication number: 20220196505Abstract: A pressure sensor with calibration function includes a casing, a diaphragm, a sensing element, a medium, and at least one calibration element. The diaphragm is disposed on the casing, wherein the casing and the diaphragm define an accommodating space. The sensing element is disposed in the casing. The medium is filled in the accommodating space and in contact with the sensing element. The at least one calibration element is adjustably disposed at the casing and extended into the accommodating space to be in contact with the medium, wherein when the at least one calibration element is moved relative to the casing, the at least one calibration element changes the pressure applied to the medium.Type: ApplicationFiled: July 9, 2021Publication date: June 23, 2022Applicant: Industrial Technology Research InstituteInventors: Che-Kai Yeh, Tzung-Ching Lee, Yu-Wen Hsu, Chao-Ta Huang
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Patent number: 10730744Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.Type: GrantFiled: December 28, 2018Date of Patent: August 4, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Wen Hsu, Che-Kai Yeh, Chin-Fu Kuo, Chao-Ta Huang
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Publication number: 20200212826Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.Type: ApplicationFiled: December 28, 2018Publication date: July 2, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Wen HSU, Che-Kai YEH, Chin-Fu KUO, Chao-Ta HUANG
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Patent number: 10622996Abstract: An adjustable sensing capacitance microelectromechanical system (MEMS) apparatus includes an ASIC and a sensing component. The ASIC includes a top surface, a readout circuit and a plurality of electrical switches. The sensing component, configured to sensing physical quantity, includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode is able to be moved relative to the fixed electrode. The electrical switches are respectively and electrically coupled to the electrode units so as to control a working status of each of the electrode units, thereby changing a sensing capacitance of the MEMS sensor.Type: GrantFiled: March 29, 2019Date of Patent: April 14, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Wen Hsu, Chao-Ta Huang, Chin-Fu Kuo, Che-Kai Yeh