Abstract: A method including the following steps is provided. A seed layer is formed. Conductive material is formed on the seed layer by performing an electrolytic plating process with an electrolytic composition comprising: a source of copper ions; an accelerator agent; and a suppressor agent, by structure represented (1) or (2): wherein x is between 2 and 50, y is between 5 and 75, and R1 is an alkyl group of 1 to 3 carbon atoms. A portion of the seed layer exposed by the conductive material is removed.

Abstract: According to one embodiment, a semiconductor device is provided. The semiconductor device includes a first semiconductor module, a redistribution layer (RDL) module and a second semiconductor module. The RDL module is disposed on the first semiconductor module. The RDL module includes a plurality of polymer layers and a plurality of vias. The polymer layers are stacked on the first semiconductor module. The vias are disposed within the polymer layers. The second semiconductor module is disposed on the RDL module. A height difference of a top surface of at least one of the polymer layers ranges from 0 um to 1 um; or an angle between a sidewall and a bottom surface of at least one of the vias ranges from 90° to 95°; or a glass transition temperature (Tg) of at least one of the polymer layers is larger than 260° C.

Abstract: A method includes the following steps. A photoresist is exposed to a first light-exposure through a first mask, wherein the first mask includes a first stitching region, and a first portion of the photoresist corresponding to a first opaque portion of the first stitching region is unexposed. The photoresist is exposed to a second light-exposure through a second mask, wherein the second mask includes a second stitching region, and a second portion of the photoresist corresponding to a second opaque portion of the second stitching region is unexposed and is overlapping with the first portion of the photoresist.

Abstract: Semiconductor package includes substrate, first barrier layer, second barrier layer, routing via, first routing pattern, second routing pattern, semiconductor die. Substrate has through hole with tapered profile, wider at frontside surface than at backside surface of substrate. First barrier layer extends on backside surface. Second barrier layer extends along sidewalls of through hole and on frontside surface. Routing via fills through hole and is separated from sidewalls of through hole by at least second barrier layer. First routing pattern extends over first barrier layer on backside surface and over routing via. First routing pattern is electrically connected to end of routing via and has protrusion protruding towards end of routing via in correspondence of through hole. Second routing pattern extends over second barrier layer on frontside surface. Second routing pattern directly contacts another end of routing via. Semiconductor die is electrically connected to routing via by first routing pattern.

Abstract: In an embodiment, a device includes: an integrated circuit die; a through via adjacent the integrated circuit die; a molding compound encapsulating the integrated circuit die and the through via; and a redistribution structure including: a first conductive via extending through a first dielectric layer, the first conductive via electrically connected to the integrated circuit die, the first dielectric layer being over the integrated circuit die, the through via, and the molding compound; and a first conductive line over the first dielectric layer and the first conductive via, the first conductive via extending into the first conductive line.

Abstract: A semiconductor structure includes a semiconductor die, a redistribution circuit structure, and a terminal. The redistribution circuit structure is disposed on and electrically coupled to the semiconductor die. The terminal is disposed on and electrically coupled to the redistribution circuit structure, where the redistribution circuit structure is disposed between the semiconductor die and the terminal, and the terminal includes an under-bump metallization (UBM) and a capping layer. The UBM is disposed on and electrically coupled to the redistribution circuit structure, where the UBM includes a recess. The capping layer is disposed on and electrically coupled to the UBM, where the UBM is between the capping layer and the redistribution circuit structure, and the capping layer fills the recess of the UBM.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: Provided herein are engineered Coronavirus S proteins, such as engineered SARS-CoV-2 S proteins. In some aspects, the engineered S proteins exhibit enhanced conformational stability and/or antigenicity. Methods are also provided for use of engineered proteins as diagnostics, in screening platforms and/or in vaccine compositions.

Abstract: A cell manipulation panel includes a pixel array defining multiple pixels, an insulating layer forming multiple vias, and a cell gap provided with a fluid medium having cells therein. Each pixel has a TFT and corresponds to a corresponding via. The TFT includes a gate electrode, a first electrode, and a second electrode partially exposed to the fluid medium through the corresponding via. For each pixel, in an operational mode, when the gate electrode is provided with an OFF signal and the first electrode is not grounded, the TFT is turned off, allowing one of the cells in the fluid medium to be captured in the corresponding via by a dielectrophoresis (DEP) force. When the gate electrode is provided with an ON signal and the first electrode is grounded, the TFT is turned on, and the second electrode is grounded to release the captured cell to the fluid medium.

Abstract: Systems and processes for gas phase-phase synthesis of trisilylamine. One system includes a reactor vessel having a top, bottom, and sidewall having an inner surface. The reactor vessel includes inlets for gaseous reactants, and a gas inlet for an inert gas. In certain reactors the gas inlets are positioned near the top of the reactor vessel and configured to inject the reactant gases in the reactor substantially vertically and downward therefrom. Other reactors are cyclonic-shaped with tangential feeding of the gases. One or more baffles having a peripheral edge and substantially horizontally positioned in the reactor to define a reaction zone above the baffles and a separation zone below the baffles. The baffles are positioned in the reactor vessel such that there is a gap between the baffle peripheral edge and the inner surface of the reactor vessel. Certain systems and processes include mechanical or static mixers.

Abstract: A molding die structure for forming oblique teeth on a rivet nut includes a mold seat, a first forging die, a second forging die, and a retaining member. The mold seat is provided with a mold cavity and a threaded portion. The first forging die is inserted into the mold cavity and provided with a die cavity and a nut cavity. The second forging die is inserted into the die cavity and has an inner face provided with an oblique toothed portion and a guide hole. The oblique toothed portion includes a plurality of oblique teeth. The retaining member is screwed into the threaded portion and limits the first forging die and the second forging die in the mold cavity. The second forging die and the die cavity of the first forging die form a low friction contact.

Abstract: A transmission mechanism with monitoring function includes a shaft, a moving part, a circulating device, a plurality of rollers and a monitoring module. The shaft has a roller groove. The moving part is movably disposed on the shaft. The moving part has a roller slot corresponding to the roller groove. The roller slot has an effective thread section and an ineffective thread section. The effective thread section and the roller groove together form a load path. The circulating device is disposed on the moving part. The circulating device has a return channel communicated with the load path. The return channel and the load path together form a circulating path. The plurality of rollers are disposed in the circulating path. The monitoring module includes a gathering body and a sensor. The sensor is for detecting a metal content of the lubricant in the gathering channel.

Abstract: A low-power CMOS reference voltage generating with enhanced power supply rejection ratio (PSRR) and fast start-up time is disclosed. The reference voltage generating is generated by the stacked diode-connected MOS transistors (SDMT) architecture to reduce the dependence on process, voltage and temperature. The self-biased and capacitor coupled architecture can shorten the start-up time without increasing power consumption and improve the bandwidth of the power supply rejection ratio. This design is implemented using a CMOS process, which can achieve stabilization time of 0.2 ms. Under the same power consumption, this design is 274 times better than a design without a start-up time enhancement. The power supply rejection ratio measured at 100 Hz is ?73.5 dB. In the temperature range of ?40 to 130° C., the average temperature coefficient is 62 ppm/° C.

Abstract: A low-power CMOS reference voltage generating with enhanced power supply rejection ratio (PSRR) and fast start-up time is disclosed. The reference voltage generating is generated by the stacked diode-connected MOS transistors (SDMT) architecture to reduce the dependence on process, voltage and temperature. The self-biased and capacitor coupled architecture can shorten the start-up time without increasing power consumption and improve the bandwidth of the power supply rejection ratio. This design is implemented using a CMOS process, which can achieve stabilization time of 0.2 ms. Under the same power consumption, this design is 274 times better than a design without a start-up time enhancement. The power supply rejection ratio measured at 100 Hz is ?73.5 dB. In the temperature range of ?40 to 130° C., the average temperature coefficient is 62 ppm/° C.

Abstract: A transparent display includes a first transparent substrate, pixel structures, first electrodes, and second electrodes. The pixel structures are located on the first transparent substrate. Each pixel structure includes light-emitting elements. A pitch of adjacent light emitting elements in each pixel structure is 0.17 mm to 0.34 mm. A pitch of adjacent pixel structures is 3.4 mm to 15.4 mm. The first electrodes and the second electrodes are electrically connected to the pixel structures.

Abstract: A molding die structure for forming oblique teeth on a rivet nut includes a mold seat, a first forging die, a second forging die, and a retaining member. The mold seat is provided with a mold cavity and a threaded portion. The first forging die is inserted into the mold cavity and provided with a die cavity and a nut cavity. The second forging die is inserted into the die cavity and has an inner face provided with an oblique toothed portion and a guide hole. The oblique toothed portion includes a plurality of oblique teeth. The retaining member is screwed into the threaded portion and limits the first forging die and the second forging die in the mold cavity. The second forging die and the die cavity of the first forging die form a low friction contact.

Abstract: A transmission mechanism with monitoring function includes a shaft, a moving part, a circulating device, a plurality of rollers and a monitoring module. The shaft has a roller groove. The moving part is movably disposed on the shaft. The moving part has a roller slot corresponding to the roller groove. The roller slot has an effective thread section and an ineffective thread section. The effective thread section and the roller groove together form a load path. The circulating device is disposed on the moving part. The circulating device has a return channel communicated with the load path. The return channel and the load path together form a circulating path. The plurality of rollers are disposed in the circulating path. The monitoring module includes a gathering body and a sensor. The sensor is for detecting a metal content of the lubricant in the gathering channel.

Abstract: A magnetochromatic display including a first substrate, first magnetic field modulating devices, a second substrate, and a magnetochromatic layer is provided. The first substrate has first pixel regions. The first magnetic field modulating devices are respectively disposed on the first pixel regions. The second substrate is disposed opposite to the first substrate. The magnetochromatic layer is disposed between the first substrate and the second substrate.

Abstract: A magnetochromatic display including a first substrate, first magnetic field modulating devices, a second substrate, and a magnetochromatic layer is provided. The first substrate has first pixel regions. The first magnetic field modulating devices are respectively disposed on the first pixel regions. The second substrate is disposed opposite to the first substrate. The magnetochromatic layer is disposed between the first substrate and the second substrate.

Abstract: A door with a buffer device including a door frame; at least one door plate pivotally installed to a lateral side of the door frame, or two lateral sides of door frame, or the door plate; at least buffer device installed to a lateral side of the door plate. When the door plate is closed, the movable press plate will compress by the door frame so that the elastomers are compressed; as a result, in closing the door plate, the movable press plate will resist against the door frame or the door plate and the elastomers provide buffer force therebetween; when the door plate is closed, the movable press plate will tightly press the door frame or the door plate so that the door plate is completely attached to the door frame.