Abstract: A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, such that the groove is located between the package substrate and the functional element. Therefore, when a cladding layer covering a chip is formed on the package substrate, the groove can accommodate a glue material overflowing from the cladding layer to prevent the glue material from contaminating the functional element.

Abstract: In a method of manufacturing an attenuated phase shift mask, a photo resist pattern is formed over a mask blank. The mask blank includes a transparent substrate, an etch stop layer on the transparent substrate, a phase shift material layer on the etch stop layer, a hard mask layer on the phase shift material layer and an intermediate layer on the hard mask layer. The intermediate layer is patterned by using the photo resist pattern as an etching mask, the hard mask layer is patterned by using the patterned intermediate layer as an etching mask, and the phase shift material layer is patterned by using the patterned hard mask layer as an etching mask. The intermediate layer includes at least one of a transition metal, a transition metal alloy, or a silicon containing material, and the hard mask layer is made of a different material than the intermediate layer.

Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a substrate with opposing first and second surfaces, a first radiating element with a first radiating portion and a second radiating portion, a third radiating portion, a feeding portion, and a grounding portion that are connected to the first radiating portion, a second radiating element separate from but coupling with the first radiating portion, a grounding element connected to the grounding portion, and a feeding element. The first radiating portion, the feeding portion, and the grounding portion are disposed on the first surface. The second radiating portion and the third radiating portion are disposed on the second surface. A projected area of the second radiating portion onto the first surface partially overlaps with the feeding portion. A projected area of the third radiating portion onto the first surface partially overlaps with the grounding portion.

Abstract: A communication device includes a dielectric substrate, a first coil antenna, a second coil antenna, and a switch circuit. The first coil antenna has a hollow region. The second coil antenna is disposed inside the hollow region of the first coil antenna. The dielectric substrate is configured to carry the first coil antenna and the second coil antenna. The switch circuit selectively enables at least one of the first coil antenna and the second coil antenna according to a power signal.

Abstract: A communication device includes a dielectric substrate, a first coil antenna, a second coil antenna, and a switch circuit. The first coil antenna has a hollow region. The second coil antenna is disposed inside the hollow region of the first coil antenna. The dielectric substrate is configured to carry the first coil antenna and the second coil antenna. The switch circuit selectively enables at least one of the first coil antenna and the second coil antenna according to a power signal.

Abstract: A cable structure and a manufacturing method thereof are provided. The cable structure includes a transmission component and a protection component. The transmission component includes at least one first intermedium unit, and the least one first intermedium unit includes at least one first transmission cable and a first barrier layer covering the at least one first transmission cable. The protection component includes at least one shielding layer covering the at least one first intermedium unit and an insulating layer covering the at least one shielding layer. The at least one shielding layer includes a metal foil layer covering the at least one first intermedium unit and at least one conducting layer formed on a surface of the metal foil layer.

Abstract: A packing system comprises a database and a server coupled thereto. The database stores a first software package comprising an original version of files comprising a first portion and a second portion. The server receives a new version of the first portion via a network, automatically produces a copy of the second portion, and automatically integrates the new version of the first portion and the copy of the second portion into a second software package.