Abstract: A die structure is described, including a device area and a contact test area. The device area has therein a device structure including a first contact plug. The contact test area has therein a contact test structure that includes a second contact plug and is different from the device structure. The contact test structure is also described, including a well, a heavily doped region in the well, and a contact plug, wherein the heavily doped region and the well are both of N-type or are both of P-type, and the contact plug is disposed over the heavily doped region.

Abstract: Present example embodiments relate generally to methods, logic, systems, and devices for inspecting a semiconductor device. Example methods comprise applying an initial energy from an energy source to a first location of a conductive layer of the semiconductor device. Example methods further comprise measuring a resultant energy passing through the conductive layer using a probe at a second location of the conductive layer and analyzing the measured resultant energy passing through the conductive layer. Example methods further comprise determining a presence of an inconsistency in the conductive layer based on the analyzing.

Abstract: Methods and systems for the detection of defects in semiconductors, semiconductor devices, or substrates are provided. Semiconductors, semiconductor devices or substrates having novel test patterns and or designs are also provided. The semiconductors, semiconductor devices or substrates have a plurality of line patterns, which, in response to a responsive stimulus such as electron beam irradiation, produces a response. The responsive stimulus may include an electron beam irradiation, and the image data can be collected and processed to produce an image or images that indicate the presence or absence of surface and/or internal defects.

Abstract: A method and a manager physical machine (PM) for virtual machine (VM) consolidation are provided. The method is performed by the manager PM. A network connects the manager PM and a plurality of server PMs. A plurality of VMs is running on the server PMs. The method includes the following steps. The manager PM classifies the server PMs into redundant PMs and surviving PMs. The manager PM determines migration paths of the VMs running on the redundant PMs to the surviving PMs. The manager PM determines a parallel migration sequence of the VMs running on the redundant PMs based on the migration paths. The manager PM migrates the VMs running on the redundant PMs to the surviving PMs in parallel according to the parallel migration sequence.

Abstract: A method of predicting product yield may include determining defect characteristics for a product based at least in part on inspection data associated with critical layers of the product, determining yield loss for each of the critical layers, and estimating product yield based on the determined yield loss of the critical layers. A corresponding apparatus is also provided.

Abstract: A method of detecting manufacturing defects at a memory array may include disposing an active area of a first width in communication with a first conductive member of the memory array to define a grounded conductive member, disposing an isolation structure of a second width in communication with a second conductive member of the memory array to define a floating conductive member, and providing an alternating arrangement of floating and grounded conductive members including arranging a plurality of the grounded and floating conductive members adjacent to each other to define a sequence of alternating floating and grounded conductive members. A corresponding test device is also provided.

Abstract: A method and a manager physical machine (PM) for virtual machine (VM) consolidation are provided. The method is performed by the manager PM. A network connects the manager PM and a plurality of server PMs. A plurality of VMs is running on the server PMs. The method includes the following steps. The manager PM classifies the server PMs into redundant PMs and surviving PMs. The manager PM determines migration paths of the VMs running on the redundant PMs to the surviving PMs. The manager PM determines a parallel migration sequence of the VMs running on the redundant PMs based on the migration paths. The manager PM migrates the VMs running on the redundant PMs to the surviving PMs in parallel according to the parallel migration sequence.

Abstract: A method of detecting manufacturing defects at a memory array may include disposing an active area of a first width in communication with a first conductive member of the memory array to define a grounded conductive member, disposing an isolation structure of a second width in communication with a second conductive member of the memory array to define a floating conductive member, and providing an alternating arrangement of floating and grounded conductive members including arranging a plurality of the grounded and floating conductive members adjacent to each other to define a sequence of alternating floating and grounded conductive members. A corresponding test device is also provided.

Abstract: A method of predicting product yield may include determining defect characteristics for a product based at least in part on inspection data associated with critical layers of the product, determining yield loss for each of the critical layers, and estimating product yield based on the determined yield loss of the critical layers. A corresponding apparatus is also provided.