Patents by Inventor Che-Lun LIN

Che-Lun LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113203
    Abstract: A method includes providing a fin extending from a substrate, the fin including a plurality of semiconductor channel layers, and where a gate is disposed over the fin. A first spacer layer is deposited over the gate and over the fin in a source/drain region. The first spacer layer has a first etch rate. A second spacer layer is deposited over the first spacer layer. The second spacer layer has a second etch rate less than the first etch rate. The plurality of semiconductor channel layers are removed from the source/drain region to form a trench having a funnel shape. After forming the trench, inner spacers are formed along a sidewall surface of the trench. In various embodiments, lateral sidewall surfaces of each semiconductor channel layer of the plurality of semiconductor channel layers is substantially free of an inner spacer material.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 4, 2024
    Inventors: Che-Lun CHANG, Wei-Yang LEE, Chia-Pin LIN
  • Patent number: 11935781
    Abstract: An integrated circuit (IC) structure includes a gate structure, a source epitaxial structure, a drain epitaxial structure, a front-side interconnection structure, a backside dielectric layer, and a backside via. The source epitaxial structure and the drain epitaxial structure are respectively on opposite sides of the gate structure. The front-side interconnection structure is on a front-side of the source epitaxial structure and a front-side of the drain epitaxial structure. The backside dielectric layer is on a backside of the source epitaxial structure and a backside of the drain epitaxial structure and has an air gap therein. The backside via extends through the backside dielectric layer to a first one of the source epitaxial structure and the drain epitaxial structure.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Che-Lun Chang, Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng
  • Patent number: 11388007
    Abstract: A mobile device includes a biological information detecting device and a wireless communication interface. The mobile device uploads the biological characteristic to the server. The server generates a token that corresponds to the biological characteristic and transmits the token to the mobile device. The mobile device transmits the token to the verification terminal device. The verification terminal device can confirm the identity of the user by verifying the token. This modularizes the process of identity verification, replacing the verification process of applications that need to verify identity, so that these applications do not need to bear the cost of identity verification after interfacing with the identity verification system.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: July 12, 2022
    Assignee: WISTRON CORP.
    Inventor: Che-Lun Lin
  • Publication number: 20210211289
    Abstract: A mobile device includes a biological information detecting device and a wireless communication interface. The mobile device uploads the biological characteristic to the server. The server generates a token that corresponds to the biological characteristic and transmits the token to the mobile device. The mobile device transmits the token to the verification terminal device. The verification terminal device can confirm the identity of the user by verifying the token. This modularizes the process of identity verification, replacing the verification process of applications that need to verify identity, so that these applications do not need to bear the cost of identity verification after interfacing with the identity verification system.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 8, 2021
    Inventor: Che-Lun LIN