Patents by Inventor Che M. Cheung

Che M. Cheung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Notched finned heat sink structure
    Publication number: 20030079862
    Abstract: A heat sink structure having a pipe attached to a plurality of fins for dissipating heat into an environment. Each fin in the plurality is constructed of a thermally conductive material and has a cavity formed therein dimensioned for seating about the pipe exterior surface. An opening or notch extends from the edge of each of the fins to the cavity to facilitate the spread of an adhesive or solder to the fin/pipe interface for providing thermal and physical coupling of the plurality of fins to the pipe.
    Type: Application
    Filed: December 11, 2002
    Publication date: May 1, 2003
    Applicant: Aavid Thermalloy, LLC
    Inventors: Marvin F. Moore, David W. Gailus, Che M. Cheung
  • Channel connection for pipe to block joints
    Publication number: 20010050165
    Abstract: A heat sink assembly having a heat plate with a channel formed therein which is accessible through a surface of the heat plate via a slot. A heat pipe is disposed in the channel and is bound to the heat plate with a bonding material disposed through the slot and into the channel.
    Type: Application
    Filed: May 3, 2001
    Publication date: December 13, 2001
    Applicant: Aavid Thermalloy, LLC
    Inventors: Che M. Cheung, Marvin F. Moore, Roberto Prosperi
  • Notched finned heat sink structure
    Publication number: 20010042615
    Abstract: A heat sink structure having a pipe attached to a plurality of fins for dissipating heat into an environment. Each fin in the plurality is constructed of a thermally conductive material and has a cavity formed therein dimensioned for seating about the pipe exterior surface. An opening or notch extends from the edge of each of the fins to the cavity to facilitate the spread of an adhesive or solder to the fin/pipe interface for providing thermal and physical coupling of the plurality of fins to the pipe.
    Type: Application
    Filed: April 16, 2001
    Publication date: November 22, 2001
    Applicant: Aavid Thermalloy, LLC
    Inventors: Marvin F. Moore, David W. Gailus, Che M. Cheung