Abstract: An electromagnetic lock securely-mounting structure includes an electromagnetic lock having two end portions each of which is formed with a through hole is which a fastening member is arranged and a penetrating aperture in communication with the through hole; a plurality of secure mounting devices each having a first end that is formed with a protruded portion and a second end that is formed with a holed portion, a securing hole being formed in one side of each of the secure mounting devices, the plurality of secure mounting devices being received in the through holes with the protruded portions abutting against the fastening members; and a plurality of fixing members respectively penetrating through the penetrating apertures in the two end portions of the electromagnetic lock and screwed into the securing holes of the secure mounting devices.

Abstract: An electromagnetic lock securely-mounting structure includes an electromagnetic lock having two end portions each of which is formed with a through hole is which a fastening member is arranged and a penetrating aperture in communication with the through hole; a plurality of secure mounting devices each having a first end that is formed with a protruded portion and a second end that is formed with a holed portion, a securing hole being formed in one side of each of the secure mounting devices, the plurality of secure mounting devices being received in the through holes with the protruded portions abutting against the fastening members; and a plurality of fixing members respectively penetrating through the penetrating apertures in the two end portions of the electromagnetic lock and screwed into the securing holes of the secure mounting devices.

Abstract: A data collection system that performs data collection of human-driven robot actions for robot learning. The data collection system includes: i) a wearable computation subsystem that is worn by a human data collector and that controls the data collection process and ii) a human-machine operation interface subsystem that allows the human data collector to use the human-machine operation interface to operate an attached robotic gripper to perform one or more actions. A user interface subsystem receives instructions from the wearable computation subsystem that direct the human data collector to perform the one or more actions using the human-machine operation interface subsystem. A visual sensing subsystem includes one or more cameras that collect raw visual data related to the pose and movement of the robotic gripper while performing the one or more actions. A data collection subsystem receives collected data related to the one or more actions.

Abstract: An electronic device includes a casing, a heat source and a heat-dissipation unit. The casing has an accommodation space and a first surface. The heat source is arranged in the accommodation space. The heat-dissipation unit is disposed on the first surface. A part of the casing is located between the heat source and the heat-dissipation unit. The heat-dissipation unit has multiple tubular spaces with open ends. These tubular spaces respectively extend in a first direction parallel to the first surface and are arranged side by side on the first surface. The heat-dissipation unit has a height in a second direction perpendicular to the first surface, and at least one of the tubular spaces has a width in a third direction parallel to the first surface and perpendicular to the first direction. The ratio of the height to the width is between 1.4 and 5.2.

Abstract: A data collection system that performs data collection of human-driven robot actions for robot learning. The data collection system includes: i) a wearable computation subsystem that is worn by a human data collector and that controls the data collection process and ii) a human-machine operation interface subsystem that allows the human data collector to use the human-machine operation interface to operate an attached robotic gripper to perform one or more actions. A user interface subsystem receives instructions from the wearable computation subsystem that direct the human data collector to perform the one or more actions using the human-machine operation interface subsystem. A visual sensing subsystem includes one or more cameras that collect raw visual data related to the pose and movement of the robotic gripper while performing the one or more actions. A data collection subsystem receives collected data related to the one or more actions.

Abstract: A data collection system that performs data collection of human-driven robot actions for robot learning. The data collection system includes: i) a wearable computation subsystem that is worn by a human data collector and that controls the data collection process and ii) a human-machine operation interface subsystem that allows the human data collector to use the human-machine operation interface to operate an attached robotic gripper to perform one or more actions. A user interface subsystem receives instructions from the wearable computation subsystem that direct the human data collector to perform the one or more actions using the human-machine operation interface subsystem. A visual sensing subsystem includes one or more cameras that collect raw visual data related to the pose and movement of the robotic gripper while performing the one or more actions. A data collection subsystem receives collected data related to the one or more actions.

Abstract: A data collection system that performs data collection of human-driven robot actions for robot learning. The data collection system includes: i) a wearable computation subsystem that is worn by a human data collector and that controls the data collection process and ii) a human-machine operation interface subsystem that allows the human data collector to use the human-machine operation interface to operate an attached robotic gripper to perform one or more actions. A user interface subsystem receives instructions from the wearable computation subsystem that direct the human data collector to perform the one or more actions using the human-machine operation interface subsystem. A visual sensing subsystem includes one or more cameras that collect raw visual data related to the pose and movement of the robotic gripper while performing the one or more actions. A data collection subsystem receives collected data related to the one or more actions.

Abstract: A material property rating method and a material property rating system are provided, which analyze the reliability of a target information of a target object provided by a target source through an analysis module, and then calculates the credibility of the target source based on the reliability of the target information through a credit rating module. Therefore, when the material property rating system is applied to a material information platform, the material property rating system can effectively avoid false information, and can save time and effort for the verification process, and can be trusted by consumers browsing the material information platform.

Abstract: A material recommendation system and a material recommendation method are provided, which use an analysis module to analyze at least one image to generate reference information, and then a recommendation module receives the reference information to provide target information corresponding to the reference information. By analyzing the image, target information including suitable materials can be quickly provided, thereby greatly accelerating the timeline of product development.

Abstract: A sound absorbing material according to the present disclosure is provided, which includes a polymeric body having a first end, a second end opposed to the first end, and a plurality of branched passages connected to the first end and extending toward a direction of the second end. The plurality of branched passages have an average spacing of 5 ?m to 50 ?m therebetween and an average width of 5 ?m to 50 ?m.

Abstract: A bio-sensing semiconductor structure is provided. A transistor includes a channel region and a gate underlying the channel region. A first dielectric layer overlies the transistor. A first opening extends through the first dielectric layer to expose the channel region. A bio-sensing layer lines the first opening and covers an upper surface of the channel region. A second dielectric layer lines the first opening over the bio-sensing layer. A second opening within the first opening extends to the bio-sensing layer, through a region of the second dielectric layer overlying the channel region. A method for manufacturing the bio-sensing semiconductor structure is also provided.

Abstract: Small cell deployment may be provided. First, access point data may be captured by a technician device from an access point. Next, the access point data may be transmitted from the technician device to a backend server. The technician device may then receive post-check results corresponding to the access point from the backend server. The post-check results may be based on the transmitted access point data.

Abstract: The present disclosure relates to an integrated chip having an integrated bio-sensor with a sensing well having one or more sensing well spacers that reduce a size of the sensing well after its formation. In some embodiments, the integrated bio-sensor has a sensing device disposed within a semiconductor substrate. A dielectric structure is disposed onto a first side of the semiconductor substrate. The dielectric structure has an opening with a first width, which is exposed to an ambient environment and that overlies the sensing device. One or more sensing well spacers are arranged on sidewalls of the opening. The one or more sensing well spacers expose a bottom surface of the opening to define a sensing well having a second width that is smaller than the first width.

Abstract: A bio-sensing semiconductor structure is provided. A transistor includes a channel region and a gate underlying the channel region. A first dielectric layer overlies the transistor. A first opening extends through the first dielectric layer to expose the channel region. A bio-sensing layer lines the first opening and covers an upper surface of the channel region. A second dielectric layer lines the first opening over the bio-sensing layer. A second opening within the first opening extends to the bio-sensing layer, through a region of the second dielectric layer overlying the channel region. A method for manufacturing the bio-sensing semiconductor structure is also provided.

Abstract: The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by increasing an area in which a getter layer is deposited, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having one or more residual gases. A cavity is formed within a top surface of the substrate. The cavity has a bottom surface and sidewalls extending from the bottom surface to the top surface. A getter layer, which absorbs the one or more residual gases, is deposited over the substrate at a position extending from the bottom surface of the cavity to a location on the sidewalls. By depositing the getter layer to extend to a location on the sidewalls of the cavity, the area of the substrate that is able to absorb the one or more residual gases is increased.

Abstract: A bio-sensing semiconductor structure is provided. A transistor includes a channel region and a gate underlying the channel region. A first dielectric layer overlies the transistor. A first opening extends through the first dielectric layer to expose the channel region. A bio-sensing layer lines the first opening and covers an upper surface of the channel region. A second dielectric layer lines the first opening over the bio-sensing layer. A second opening within the first opening extends to the bio-sensing layer, through a region of the second dielectric layer overlying the channel region. A method for manufacturing the bio-sensing semiconductor structure is also provided.

Abstract: Among other things, one or more semiconductor arrangements comprising isolation trenches, and techniques for forming such isolation trenches are provided. A substrate comprises a front side surface and a backside surface. One or more devices are formed over the front side surface. A wet etch is performed to form a tapered portion of an isolation trench. A dry etch is performed to form a non-tapered portion of the isolation trench. Because both the wet etch and the dry etch are performed, etching time is reduced compared to merely using the dry etch due to the wet etch having a relatively faster etch rate than the dry etch. In an embodiment, the isolation trench provides isolation for a current leakage path associated with a device or other material formed over the front side surface. In an embodiment, metal is formed within the isolation trench for backside metallization.

Abstract: In one embodiment, a method includes identifying an active traffic flow at a first FHRP (First Hop Redundancy Protocol) network device, the first FHRP network device associated with a second FHRP network device operating in a standby mode for the traffic flow, automatically setting a routing metric for the traffic flow based on an active state at the first FHRP network device, advertising the routing metric, and receiving a return traffic flow at the first FHRP network device based on the routing metric. An apparatus and logic are also disclosed herein.

Abstract: A bio-sensing semiconductor structure is provided. A transistor includes a channel region and a gate underlying the channel region. A first dielectric layer overlies the transistor. A first opening extends through the first dielectric layer to expose the channel region. A bio-sensing layer lines the first opening and covers an upper surface of the channel region. A second dielectric layer lines the first opening over the bio-sensing layer. A second opening within the first opening extends to the bio-sensing layer, through a region of the second dielectric layer overlying the channel region. A method for manufacturing the bio-sensing semiconductor structure is also provided.

Abstract: The present disclosure relates to a wafer transfer robot having a robot blade that can be used to handle substrates that are patterned on both sides without causing warpage of the substrates. In some embodiments, the wafer transfer robot has a robot blade coupled to a transfer arm that varies a position of the robot blade. The robot blade has a wafer reception area that receives a substrate. Two or more spatially distinct contact points are located at positions along a perimeter of the wafer reception area that provide support to opposing edges of the substrate. The two or more contact points are separated by a cavity in the robot blade. The cavity mitigates contact between a backside of the substrate and the robot blade, while providing support to opposing sides of the substrate to prevent warpage of the substrate.