Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: An automated optical double-sided inspection apparatus includes a first image-capturing portion, a second image-capturing portion, a platform, a first light-blocking portion, a second light-blocking portion, and a processing portion. The platform carries an external object. When the processing portion operates in a first capturing mode, the second light-blocking portion blocks visible light from passing therethrough, while the first light-blocking portion allows visible light to pass therethrough, so that the first image-capturing portion shoots a first side of the external object through the first light-blocking portion to obtain a first image.

Abstract: A leather defect detection system comprises a worktable, a conveying mechanism, an image capture module, a model training computing device and an embedded computing device, the worktable is used to place a to-be-detected leather; the conveying mechanism is movably disposed on the worktable; the image capture module is disposed on the conveying mechanism, when the conveying mechanism is actuated, relative positions of the image capture module and the to-be-detected leather change synchronously to capture a plurality of to-be-detected images respectively; the model training computing device uses a plurality of historical leather images captured by the image capture module to perform calculation to establish a defect identification model, and the defect identification model is transcoded into the embedded computing device, so that the embedded computing device is capable of directly using the transcoded defect identification model to perform defect identification on the to-be-detected images.