Abstract: An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.

Abstract: An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.

Abstract: A network switch system includes a switch box and an optical communication device. The optical communication device is at least partially disposed in the switch box. The optical communication device includes a housing, a first light emitter and a ROSA. The first light emitter is disposed in the housing without any ROSA therein. The ROSA is disposed in the switch box and located outside the housing, and the first light emitter is optically coupled to the ROSA.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: An optical transceiver includes a housing, a fastening component and a latch. The fastening component is disposed on the housing. The fastening component is movable with respect to the housing in a releasing direction from an electrical port of the optical transceiver toward a fiber optic port of the optical transceiver. The latch is movably disposed on the housing to be at either an unlocking position or a locking position. The fastening component is allowed to be moved with respect to the housing in the releasing direction when the latch is at the unlocking position, and a movement of the fastening component in the releasing direction is confined by the latch when the latch is at the locking position.

Abstract: An optical transceiver includes a housing, an optical communication module and a heat dissipation module. The optical communication module includes a substrate, a first optical communication component and a second optical communication component located at opposite sides of the substrate, respectively. The heat dissipation module includes a first heat conductive component and a second heat conductive component disposed on the substrate. The first heat conductive component is spatially spaced apart from the second heat conductive component. The first optical communication component is supported on and in thermal contact with the first heat conductive component. The second optical communication component is mounted on the substrate, and the second optical communication component is in thermal contact with the second heat conductive component through the substrate.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: An optical transceiver includes a housing, a mother board, an optical communication module and a daughter board. The mother board is accommodated in the housing. The optical communication module is disposed on a top surface of the mother board, and the optical communication module includes a first electrical interface. The daughter board is disposed on the top surface of the mother board, and the daughter board includes a second electrical interface electrically connected with the first electrical interface. The optical communication module is disposed on a flat region of the top surface of the mother board.

Abstract: A multilayer PCB structure includes a core layer, a first layer on a first surface of the core layer, a second layer on a second surface of the core layer, and a thermally conductive material in the core layer. The first surface and the second surface of the core layer are opposite to each other, and a window is formed on the second layer by removing part of the second layer. The window of the second layer exposes part of the core layer below the thermally conductive material.

Abstract: An optical transceiver includes a housing, a heat source accommodated in the housing, and a thermal interface material accommodated in the housing. The housing is in thermal contact with the heat source through the thermal interface material, and the thermal interface material is in physical contact with an uneven surface of the housing.

Abstract: An optical communication system includes a light source module, a circuit board, a light emitter and a ROSA. The circuit board is disposed in the light source module. The light emitter is disposed in the light source module and electrically connected to the circuit board. The ROSA is located outside the light source module, and the ROSA is optically coupled to the light emitter.

Abstract: An optical transceiver includes a housing, a mother board, an optical communication module and a daughter board. The mother board is accommodated in the housing. The optical communication module is disposed on a top surface of the mother board, and the optical communication module includes a first electrical interface. The daughter board is disposed on the top surface of the mother board, and the daughter board includes a second electrical interface electrically connected with the first electrical interface. The optical communication module is disposed on a flat region of the top surface of the mother board.

Abstract: An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module.

Abstract: An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module.

Abstract: A network switch system includes a switch box and an optical communication device. The optical communication device includes a housing, a first light emitter disposed in the housing, a TOSA component set selectively disposed in the housing or within the switch box, and a ROSA disposed in the switch box. The first light emitter is optically coupled to the ROSA.

Abstract: An optical communication system includes a light source module, a circuit board, a light emitter and a ROSA. The circuit board is disposed in the light source module. The light emitter is disposed in the light source module and electrically connected to the circuit board. The ROSA is located outside the light source module, and the ROSA is optically coupled to the light emitter.

Abstract: An optical transceiver includes a housing, a fastening component, and a bail. The fastening component is movably disposed on the housing and configured to be detachably fastened with the cage. The bail is pivoted on the fastening component and includes a holding portion. The holding portion is configured to abut the housing to maintain a pivot angle between the bail and the fastening component.

Abstract: An optical transceiver includes a casing, a fastening member, a pivotal member and a driving member. The driving member is disposed on the casing, and the driving member is movable relative to the casing in a press direction. The pivotal member includes a pivoting shaft and a pressed portion connected to each other. The pivoting shaft of the pivotal member is pivoted on the casing. The pressed portion has a pressed point, and a virtual line passing through the pressed portion and the pivoting shaft is non-parallel to the press direction. When the driving member is moved in the press direction to press the pressed point, the pivotal member is pivoted. The fastening member is movably disposed on the casing to be either in a fastened position or a released position. The pivotal member is pivotable to move the fastening member from the fastened position to the released position.

Abstract: An optical transceiver includes a main body, an elastic component and a fastening component. The main body includes two lateral surfaces and an outer surface between the two lateral surfaces, and the outer surface defines a confined groove. The elastic component is disposed in the confined groove. The fastening component is movably disposed on the main body. The fastening component includes a linkage arm, two extending arms and a confined portion. The linkage arm is disposed on the outer surface of the main body, and the two extending arms are connected with the linkage arm. The two extending arms are respectively disposed on the two lateral surfaces. The confined portion is connected with the linkage arm and extends into the confined groove in order to press the elastic component. The two extending arms are detachably fasten-able with the cage.

Abstract: An optical transceiver includes a housing, a fastening component, a bail and an optical connector. The fastening component is movably disposed on the housing and configured to be detachably fastened with the cage. The bail includes a first connecting portion and a second connecting portion. The first connecting portion is pivoted with respect to the fastening component at a first pivot joint, and the second connecting portion is pivoted with respect to the fastening component at a second pivot joint. The optical connector is disposed in the housing and located between the first pivot joint and the second pivot joint.