Abstract: An optical transceiver includes a printed circuit board, a transceiver module, a plurality of filtering capacitors and a noise absorber. The printed circuit board is provided with a plurality of signal lines and a plurality of gold fingers each connecting one of the plurality of signal lines. The transceiver module is disposed on the printed circuit board and connecting the plurality of signal lines. Each of the plurality of filtering capacitors is located on one of the plurality of signal lines. The noise absorber covers at least one surface of the plurality of filtering capacitors opposite to the printed circuit board.

Abstract: An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.

Abstract: An optical module includes a housing and a release mechanism. The housing includes an outer lateral surface. The release mechanism includes an arm and a releasing component. The arm is disposed on the outer lateral surface and movable relative to the housing. The releasing component is disposed on the outer lateral surface and includes a pivot, a releasing portion and a pressed portion. The pivot is between the releasing portion and the pressed portion. The pivot is disposed on the housing. The arm pushes the pressed portion to pivot the releasing component. At an idle state of the release mechanism, a movement of the housing is restricted by an interference between a flexible counterpart of a cage and the housing. At a releasing state of the release mechanism, the releasing portion deforms the flexible counterpart, thereby removing the interference between the flexible counterpart and the housing.

Abstract: An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.

Abstract: An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.

Abstract: An optical transceiver includes a housing, an optical communication module and a heat dissipation module. The optical communication module includes a substrate, a first optical communication component and a second optical communication component located at opposite sides of the substrate, respectively. The heat dissipation module includes a first heat conductive component and a second heat conductive component disposed on the substrate. The first heat conductive component is spatially spaced apart from the second heat conductive component. The first optical communication component is supported on and in thermal contact with the first heat conductive component. The second optical communication component is mounted on the substrate, and the second optical communication component is in thermal contact with the second heat conductive component through the substrate.

Abstract: An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.

Abstract: An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.

Abstract: A network switch system includes a switch box and an optical communication device. The optical communication device is at least partially disposed in the switch box. The optical communication device includes a housing, a first light emitter and a ROSA. The first light emitter is disposed in the housing without any ROSA therein. The ROSA is disposed in the switch box and located outside the housing, and the first light emitter is optically coupled to the ROSA.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: An optical transceiver includes a housing, a fastening component and a latch. The fastening component is disposed on the housing. The fastening component is movable with respect to the housing in a releasing direction from an electrical port of the optical transceiver toward a fiber optic port of the optical transceiver. The latch is movably disposed on the housing to be at either an unlocking position or a locking position. The fastening component is allowed to be moved with respect to the housing in the releasing direction when the latch is at the unlocking position, and a movement of the fastening component in the releasing direction is confined by the latch when the latch is at the locking position.

Abstract: An optical transceiver includes a housing, an optical communication module and a heat dissipation module. The optical communication module includes a substrate, a first optical communication component and a second optical communication component located at opposite sides of the substrate, respectively. The heat dissipation module includes a first heat conductive component and a second heat conductive component disposed on the substrate. The first heat conductive component is spatially spaced apart from the second heat conductive component. The first optical communication component is supported on and in thermal contact with the first heat conductive component. The second optical communication component is mounted on the substrate, and the second optical communication component is in thermal contact with the second heat conductive component through the substrate.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: An optical transceiver includes a housing, a mother board, an optical communication module and a daughter board. The mother board is accommodated in the housing. The optical communication module is disposed on a top surface of the mother board, and the optical communication module includes a first electrical interface. The daughter board is disposed on the top surface of the mother board, and the daughter board includes a second electrical interface electrically connected with the first electrical interface. The optical communication module is disposed on a flat region of the top surface of the mother board.

Abstract: A multilayer PCB structure includes a core layer, a first layer on a first surface of the core layer, a second layer on a second surface of the core layer, and a thermally conductive material in the core layer. The first surface and the second surface of the core layer are opposite to each other, and a window is formed on the second layer by removing part of the second layer. The window of the second layer exposes part of the core layer below the thermally conductive material.

Abstract: An optical transceiver includes a housing, a heat source accommodated in the housing, and a thermal interface material accommodated in the housing. The housing is in thermal contact with the heat source through the thermal interface material, and the thermal interface material is in physical contact with an uneven surface of the housing.

Abstract: An optical communication system includes a light source module, a circuit board, a light emitter and a ROSA. The circuit board is disposed in the light source module. The light emitter is disposed in the light source module and electrically connected to the circuit board. The ROSA is located outside the light source module, and the ROSA is optically coupled to the light emitter.

Abstract: An optical transceiver includes a housing, a mother board, an optical communication module and a daughter board. The mother board is accommodated in the housing. The optical communication module is disposed on a top surface of the mother board, and the optical communication module includes a first electrical interface. The daughter board is disposed on the top surface of the mother board, and the daughter board includes a second electrical interface electrically connected with the first electrical interface. The optical communication module is disposed on a flat region of the top surface of the mother board.

Abstract: An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module.

Abstract: An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module.