Che-Wei Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
Abstract: A successive approximation register analog-to-digital converter includes a comparator circuit, a capacitor group, an additional capacitor and a control circuit. The comparator circuit compares voltages at first and second input terminals thereof to generate a comparison result. The capacitor group and the additional capacitor are coupled to the first input terminal. The control circuit controls voltages of capacitors of the capacitor group according to the comparison result. In a first period, the control circuit provides a first voltage to the first input terminal and the additional capacitor, and provides an analog signal to the capacitors. In a second period, the control circuit stops providing the first voltage and controls a specific capacitor of the capacitor group to enter into a floating state. In a third period, the control circuit provides a second voltage to the additional capacitor. The second voltage is lower than the first voltage.
Abstract: A semiconductor device includes: a substrate comprising a magnetic tunneling junction (MTJ) region and a logic region; a first MTJ on the MTJ region; a first metal interconnection on the logic region; and a cap layer extending from a sidewall of the first MTJ to a sidewall of the first metal interconnection. Preferably, the cap layer on the MTJ region and the cap layer on the logic region comprise different thicknesses.
Abstract: A material recommendation system and a material recommendation method are provided, which use an analysis module to analyze at least one image to generate reference information, and then a recommendation module receives the reference information to provide target information corresponding to the reference information. By analyzing the image, target information including suitable materials can be quickly provided, thereby greatly accelerating the timeline of product development.
Abstract: A material property rating method and a material property rating system are provided, which analyze the reliability of a target information of a target object provided by a target source through an analysis module, and then calculates the credibility of the target source based on the reliability of the target information through a credit rating module. Therefore, when the material property rating system is applied to a material information platform, the material property rating system can effectively avoid false information, and can save time and effort for the verification process, and can be trusted by consumers browsing the material information platform.
Abstract: A successive approximation register (SAR) analog-to-digital converter (ADC) includes a first digital-to-analog converter (DAC) coupled to receive a first input voltage to generate a first output voltage; a second DAC coupled to receive a second input voltage to generate a second output voltage; a comparator having a positive input node coupled to receive the first output voltage of the first DAC, and a negative input node coupled to receive the second output voltage of the second DAC; a SAR controller that controls switching of the first DAC and the second DAC according to a comparison output of the comparator, thereby generating an output code; a first calibration circuit coupled between the positive input node of the comparator and a ground voltage; and a second calibration circuit coupled between the negative input node of the comparator and the ground voltage.
July 29, 2020
Date of Patent:
March 2, 2021
NCKU Research and Development Foundation, Himax Technologies Limited
Abstract: An optical system is provided and includes a fixed assembly, a movable element and a driving module. The fixed assembly has a main axis. The movable element is movable relative to the fixed assembly, and the movable element is connected to a first optical element. The driving module is configured to drive the movable element to move relative to the fixed assembly.
Abstract: The present disclosure describes expansion card interfaces for a printed circuit board and methods of making the same. The methods include forming electrical pads of the expansion card interface on a substrate, and dividing at least one electrical pad into a first portion and a second portion. The resulting expansion card interfaces have the first portion conductively coupled to a circuit on the printed circuit board, and the second portion conductively isolated from the first portion.
Abstract: A vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.
Abstract: A flexible vapor chamber for an electronic device includes an upper cover, a lower cover, an accommodation space, a capillary structure, plural support structures and a working fluid. The upper cover is made of a first flexible material. The lower cover is made of a second flexible material. The accommodation space is arranged between the upper cover and the lower cover. The capillary structure is disposed on the lower cover and accommodated within the accommodation space. The plural support structures are disposed on the upper cover and accommodated within the accommodation space. The plural support structures are contacted with the capillary structure. The working fluid is accommodated within the accommodation space. The flexible vapor chamber is permitted to be subjected to a flexural action in a flexible range. Consequently, the installation of the flexible vapor chamber complies with a shape of the electronic device.
Abstract: A vapor chamber includes an upper plate, a lower plate and a fixing frame. The lower plate is attached on the upper plate. The lower plate includes a raised structure. The fixing frame is attached on the lower plate. The fixing frame includes a hollow portion and at least one fastening part. The raised structure is accommodated within the hollow portion. The fixing frame is helpful for facilitating the manufacturer or the user to directly assemble and fix the vapor chamber on a supporting plate with a heat source. Moreover, due to the fixing frame, the possibility of causing deformation of the vapor chamber is minimized.
Abstract: An injection molding apparatus including an injection device, a mold, a gas supply device, and a temperature control device is provided. The mold has a mold cavity, wherein the injection device is adapted to inject a material into the mold cavity. The gas supply device is adapted to supply a gas to the mold cavity such that the pressure in the mold cavity is increased. The temperature control device is adapted to control the temperature in the mold cavity. In addition, an injection molding method is also provided.
Abstract: A successive approximation register analog-to-digital converter including a first capacitor group, a second capacitor group and a control circuit is provided. Each of the first and second capacitor groups includes a plurality of capacitors coupled to a common node. In a sampling mode, the control circuit provides an analog signal to the first capacitor group and provides a first voltage to the common node and the second capacitor group. In a sampling mode, the control circuit stops providing the first voltage to the common node and provides a second voltage to the second capacitor group. In a data converting mode, the control circuit reads voltage values of the capacitors of the first capacitor group in sequence. Each when the voltage of at least one specific capacitor in the first capacitor group is read, one capacitor of the second capacitor group is electrically floated.
August 6, 2019
Date of Patent:
September 29, 2020
NUVOTON TECHNOLOGY CORPORATION
Szu-Wei Chang, Che-Hao Chiang, Tu-Hsiu Wang
Abstract: Herein disclosed is a device for testing batteries as subjects and a method thereof. The battery testing device comprises a power supply module and a short-circuit sensing module. The power supply module is configured to provide a first testing voltage or a first testing current. The short-circuit sensing module, coupled with the power supply module, is configured to integrate the first testing voltage or current during a first testing period, thereby calculating a first output energy provided by the power supply module. The short-circuit sensing module also determines whether the first output energy exceeds a predetermined energy range; when the range is exceeded, the same module generates an error signal. Wherein the short-circuit sensing module generates an error count by calculating during a second testing period the number of times the short-circuit sensing module generates the error signal.
Abstract: A gaming device and a gaming device recognition method are provided. The method is applicable to an electronic device having an image capturing device, a storage device and a processor, and includes following steps. A captured image of the gaming device is captured by the image capturing device, wherein the gaming device includes a recognition code having anchor grids and recognition grids. Then, a first image is generated by performing image processing on the captured image, and the anchor grids of the first image are recognized. Next, a recognition template is decided according to the anchor grids, wherein the recognition template including code grids and grid numbers of each code grid. Finally, a filled status of each code grid is determined according to the first image, and a tag code corresponding to the recognition code is generated according to the filled status of each code grid and the grid numbers.
Abstract: A gaming system for card games is provided. The gaming system includes a plurality of gaming cards and a processor. Each of the gaming cards has a recognition code. The processor is configured to: generate a correspondence between the recognition codes of the gaming cards and a plurality of card faces; obtain an image of the gaming card placed in a recognition area captured by an image capturing device; recognize the recognition code in the image to generate game data according to a recognition result and the correspondence; and generate a game screen to be displayed by a display according to the game data. In addition, a gaming table is also provided.
Abstract: An injection molding apparatus including a mold, an injection device and a gas supply device is provided. The injection device is adapted to inject a ceramic powder material into the mold. The gas supply device is adapted to provide a gas into the mold to form a cavity in the ceramic powder material by the gas. In addition, an injection molding method is also provided.
Abstract: A semiconductor device includes a first semiconductor die, a second semiconductor die, a dielectric layer, a first redistribution layer and a second redistribution layer. The first semiconductor die includes a first bonding pad and a second bonding pad. The second semiconductor die includes a third bonding pad and a fourth bonding pad. The dielectric layer covers the first semiconductor die and the second semiconductor die, and defines a first opening exposing the first bonding pad and the second bonding pad and a second opening exposing the third bonding pad and the fourth bonding pad. The first redistribution layer is disposed on the dielectric layer, and electrically connects the first bonding pad and the third bonding pad. The second redistribution layer is disposed on the dielectric layer, and electrically connects the second bonding pad and the fourth bonding pad.
January 30, 2019
July 30, 2020
Advanced Semiconductor Engineering, Inc.
Yuan-Ting LIN, Che Wei CHANG, Chi-Yu WANG
Abstract: An injection molding apparatus including a ceramic powder material injection device, a supercritical fluid providing device, and a mold is provided. The ceramic powder material injection device is adapted to contain a ceramic powder material. The supercritical fluid providing device is adapted to provide a supercritical fluid to the ceramic powder material injection device. The mold has a molding concavity, wherein the ceramic powder material injection device is adapted to mix the ceramic powder material and the supercritical fluid to form a mixed material and inject the mixed material into the molding concavity. In addition, an injection molding method is also provided.
Abstract: An injection molding apparatus including a ceramic powder material injection device, a mold, and a gas providing device is provided. The ceramic powder material injection device is adapted to contain a ceramic powder material. The mold has a molding concavity, wherein the ceramic powder material injection device is adapted to inject at least the ceramic powder material into the molding concavity. The gas providing device is adapted to provide a gas into the molding concavity to increase a pressure in the molding concavity to increase a density of the ceramic powder material in the molding concavity. In addition, an injection molding method is also provided.