Abstract: The present invention provides a method for preparing an activated carbon, which includes impregnating a carbonaceous material with carbonated water; and exposing the carbonaceous material to microwave radiation to produce the activated carbon.

Abstract: The present disclosure provides a smart pole charging system and a monitoring method. The database system initiates a configuration according to an original environmental status. The charging module is connected with an electric vehicle and provides the electrical energy to the electric vehicle. The monitoring module monitors a real-time environmental status around corresponding smart pole. The calculating module recognizes the real-time environmental status and outputs a calculation result. The router receives the calculation result. The cloud platform is communicated with the router and the database system. The router transmits the calculation result to the cloud platform through an open charge point protocol.

Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: A wiper connection structure, comprising a connection body and an upper cover. The connection body is mounted on a wiper blade; an accommodating cavity is formed on the connection body; the accommodating cavity is opened on an upper surface and a side vertical surface of the connection body respectively to correspondingly form an upper opening and an inlet for the head of a wiper to insert into the accommodating cavity; the upper cover is hingedly connected to the upper opening, and the upper cover can sealably close and open the upper opening; in addition, at least one of the accommodating cavity and the upper cover is provided with a limiting member capable of stopping and limiting the head of the wiper, so as to ensure that the head of the wiper does not fall off from the accommodating cavity.

Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.

Abstract: The present disclosure relates to a system and a method for accessing streaming data. The method includes: obtaining, from a first user terminal and via a network, a first request for streaming data; transmitting the first request to a server for accessing the streaming data; recording identification information included in the first request to be corresponding to the server in a table; obtaining, from a second user terminal and via a network, a second request for the streaming data; and transmitting the second request to the server for accessing the streaming data. Identification information included in the second request is the same as the identification information included in the first request.

Abstract: A boneless wiper structure (10) for a wiper arm (3) includes a wiper blade (1) and a connection base assembly (2). The wiper blade (1) is provided with two positioning holes. The connection base assembly (2) includes a fixing base (21) and a joint base (22). The fixing base (21) is assembled to the wiper blade (1). Two positioning feet (211) extend from a bottom of the fixing base (21) for engagement with the two positioning holes (11). A top of the fixing base (21) includes a containing groove (212) and a first engagement groove (213) and a second engagement groove (214) arranged on a front side and a rear side of the containing groove (212). The joint base (22) is engaged with the containing groove (212). A block (221) extends from one end of the joint base (22) to engage with the first engagement groove (213).

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, in which the MTJ includes a pinned layer on the substrate, a reference layer on the pinned layer, a barrier layer on the reference layer, and a free layer on the barrier layer. Preferably, the free layer and the barrier layer have same width and the barrier layer and the reference layer have different widths.

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

Abstract: A wiper connection structure, comprising a connection body and an upper cover. The connection body is mounted on a wiper blade; an accommodating cavity is formed on the connection body; the accommodating cavity is opened on an upper surface and a side vertical surface of the connection body respectively to correspondingly form an upper opening and an inlet for the head of a wiper to insert into the accommodating cavity; the upper cover is hingedly connected to the upper opening, and the upper cover can sealably close and open the upper opening; in addition, at least one of the accommodating cavity and the upper cover is provided with a limiting member capable of stopping and limiting the head of the wiper, so as to ensure that the head of the wiper does not fall off from the accommodating cavity.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.

Abstract: The present disclosure provides an optical element driving mechanism, which includes a first movable part, a fixed assembly, a first driving assembly, a second movable part, a second driving assembly and a locking assembly. The first movable part is configured to connect an optical element. The first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly, and the second driving assembly is configured to drive the second movable part to move relative to the first movable part and the fixed assembly. The locking assembly is configured to fix the first movable part at a first position relative to the fixed assembly.

Abstract: A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.

Abstract: A method for fabricating semiconductor device includes the steps of first forming a magnetic tunneling junction (MTJ) stack on a substrate, in which the MTJ stack includes a pinned layer on the substrate, a barrier layer on the pinned layer, and a free layer on the barrier layer. Next, a top electrode is formed on the MTJ stack, the top electrode, the free layer, and the barrier layer are removed, a first cap layer is formed on the top electrode, the free layer, and the barrier layer, and the first cap layer and the pinned layer are removed to form a MTJ and a spacer adjacent to the MTJ.

Abstract: The disclosure provides a positive photoresist composition, comprising: a (A) polyimide resin, a (B) photo active compound and a (C) solvent. The (A) polyimide resin is obtained by a polymerization reaction of a (a) diamine and a (b) tetracarboxylic dianhydride, and has a structural unit of formula (1); wherein, Ar1 in the formula (1) is a tetravalent organic group, Ar2 is a bivalent organic group, and Ar1 is a group of formula (B-1), formula (B-2), formula (B-3) or a combination thereof, and Ar2 is at least a group of formula (A-1), formula (A-2) or a combination thereof. Furthermore, Ar2 can further be a group of formula (A-3), formula (A-4), formula (A-5) or a combination thereof. The present disclosure further provides a negative photoresist pattern lithography process method and a photoresist pattern thereof.

Abstract: An auxiliary power circuit of a conversion module is used to supply power to a control unit, and an input end of the conversion module includes an even number of energy storage units coupled in series. The auxiliary power circuit includes an even number of primary-side circuits and a secondary-side circuit. Each primary-side circuit includes a first switch unit, a second switch unit, and a resonance tank. The first switch unit is connected to the second switch unit in series, and is correspondingly connected to one of the energy storage units in parallel. The resonance tank is connected to the second switch unit in parallel. The secondary-side circuit is coupled to the resonance tanks of two of the primary-side circuits to acquire power and supply power to the control unit.

Abstract: A method for converting lower alkanes to higher liquid products, comprising reacting one or more C2 to C12 alkanes with a bifunctional catalyst comprising platinum (Pt) or palladium (Pd) and at least one other metal (M) to provide an alloy (Pt-M or Pd-M) containing at least 0.1 wt % of the platinum (Pt) or palladium (Pd), based on a total weight of the catalyst; a silica or alumina support; and an acidic zeolite, at a temperature of about 350° C. to 700° C. to provide a liquid product having a boiling point of 38° C. to 205° C.

Abstract: A method for fabricating a semiconductor device includes the steps of providing a substrate comprising a magnetic random access memory (MRAM) region and a logic region, forming a first magnetic tunneling junction (MTJ) on the MRAM region, forming a first inter-metal dielectric (IMD) layer around the first MTJ, and then forming a first metal interconnection extending from the MRAM region to the logic region on the first MTJ. Preferably, the first metal interconnection on the MRAM region and the first metal interconnection on the logic region have different heights.