Patents by Inventor Che Wei Tu

Che Wei Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230317571
    Abstract: An electronic device with a conductive lead having an internal first section and an external second section extending outside a molded package structure, the first section having an obstruction feature extending vertically from a top or bottom side of the conductive lead and engaging a portion of the package structure to oppose movement of the conductive lead outward from the package structure.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 5, 2023
    Inventors: Hsiang Ming Hsiao, Hung-Yu Chou, Yuh-Harng Chien, Chih-Chien Ho, Che Wei Tu, Bo-Hsun Pan, Megan Chang