Patents by Inventor Che-Wei YU

Che-Wei YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12211776
    Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: January 28, 2025
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
  • Publication number: 20240421023
    Abstract: An electronic package is provided, in which an electronic element and a heat dissipation member are disposed on different areas of a carrier structure having a heat dissipation layer, where the electronic element is covered by an encapsulation layer, and the heat dissipation member is thermally connected to the electronic element via the heat dissipation layer, so that the heat energy generated by the electronic element can be prevented from conducting into the encapsulation layer during the heat dissipation process, such that the problem of overheating around the electronic element can be avoided.
    Type: Application
    Filed: September 12, 2023
    Publication date: December 19, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chin-Chiang HE, Wan-Chin CHUNG, Che-Wei YU
  • Publication number: 20230223322
    Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 13, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
  • Publication number: 20180306180
    Abstract: A motor system includes at least two motors respectively having an output power and a rotary shaft, wherein at least one coupling is provided to connected the at least two rotary shafts. A detect unit is electrically connected to each of the at least two motors and detects the currents of the at least two motors and forms detecting signals relative to the current value of each of the at least two motors. A control unit is electrically connected to the at least two motors for receiving a controlling signal and the detecting signal for adjusting an output power to the electric actuator.
    Type: Application
    Filed: October 4, 2017
    Publication date: October 25, 2018
    Inventors: Ching-Chung CHAN, Chun-Hsiang CHENG, Kuan-Pang LIN, Che-Wei YU