Abstract: A driving circuit of a loudspeaker includes a periodic signal generation circuit, a signal processing circuit, a class-D amplifier circuit, a current sensing circuit, and a sample and hold circuit. The periodic signal generation circuit is arranged to generate a periodic signal and a control signal. The signal processing circuit is coupled to the periodic signal generation circuit, and is arranged to generate a pre-driving signal. The class-D amplifier circuit is coupled to the signal processing circuit, and is arranged to drive the loudspeaker according to the pre-driving signal. The current sensing circuit is coupled to the class-D amplifier circuit, and is arranged to generate a current sensing signal. The sample and hold circuit is coupled to the periodic signal generation circuit and the current sensing circuit, and is arranged to sample and hold the current sensing signal according to the control signal, to generate a current sampling signal.

Abstract: An electronic package is provided, in which an electronic element and a heat dissipation member are disposed on different areas of a carrier structure having a heat dissipation layer, where the electronic element is covered by an encapsulation layer, and the heat dissipation member is thermally connected to the electronic element via the heat dissipation layer, so that the heat energy generated by the electronic element can be prevented from conducting into the encapsulation layer during the heat dissipation process, such that the problem of overheating around the electronic element can be avoided.

Abstract: A method of manufacturing an electronic apparatus is described. The electronic apparatus includes an integrated fan-out package, a dielectric housing, and a plurality of conductive patterns. The dielectric housing is covering the integrated fan-out package, wherein a gap or a first dielectric layer is in between the dielectric housing and the integrated fan-out package. The plurality of conductive patterns is located on a surface of the dielectric housing, wherein the plurality of conductive patterns is located in between the dielectric housing and the integrated fan-out package.

Abstract: An electronic apparatus is provided. The electronic apparatus includes an integrated fan-out package, a dielectric housing, and a plurality of conductive patterns. The dielectric housing is covering the integrated fan-out package, wherein a gap or a first dielectric layer is in between the dielectric housing and the integrated fan-out package. The plurality of conductive patterns is located on a surface of the dielectric housing, wherein the plurality of conductive patterns is located in between the dielectric housing and the integrated fan-out package.

Abstract: Some implementations described herein provide techniques and apparatuses for forming a stacked die product including two or more integrated circuit dies. A bond interface between two integrated circuit dies that are included in the stacked die product includes a layered structure. As part of the layered structure, respective layers of a sealant material are directly on co-facing surfaces of the two integrated circuit dies. The layered structure further includes one or more bonding layers between the respective layers of the sealant material that are directly on the co-facing surfaces of the two integrated circuit dies. The layered structure may reduce lateral stresses throughout the bond interface to reduce a likelihood of warpage of the two integrated circuit dies.

Abstract: An audio amplifier with duty ratio control is provided. The audio amplifier comprises a pulse width modulation modulator, a power stage, and a voltage converter. The pulse width modulation modulator is configured to receive an input signal for generating a pulse width modulation signal. The power stage is configured to output an output signal according to a supply voltage and the pulse width modulation signal. The voltage converter is configured to adjust voltage level of the supply voltage according to the pulse width modulation signal. The audio amplifier is configured to adjust the voltage level of the supply voltage when duty ratio of the pulse width modulation signal is greater than a duty ratio threshold.

Abstract: A molding method of a support rod that first passing a plurality of long fibers through a resin bath for impregnating with resin, then passing the plurality of long fibers impregnated with resin through a bundling hole of a position-constrained vertical plate on a machine to preliminarily form a bundle end; providing a coating layer on the machine, one end of the coating layer obliquely passes through a guiding portion on the position-constrained vertical plate to downwardly contact the bundle end; then placing the one end of the coating layer and the bundle end into a mold cavity of a mold at the same time to form a long rod body; and then cutting the long rod body into multi-segment support rods through a cutting process.

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

Abstract: A motor system includes at least two motors respectively having an output power and a rotary shaft, wherein at least one coupling is provided to connected the at least two rotary shafts. A detect unit is electrically connected to each of the at least two motors and detects the currents of the at least two motors and forms detecting signals relative to the current value of each of the at least two motors. A control unit is electrically connected to the at least two motors for receiving a controlling signal and the detecting signal for adjusting an output power to the electric actuator.