Abstract: The present disclosure describes a semiconductor device with a rare earth metal oxide layer and a method for forming the same. The method includes forming fin structures on a substrate and forming superlattice structures on the fin structures, where each of the superlattice structures includes a first-type nanostructured layer and a second-type nanostructured layer. The method further includes forming an isolation layer between the superlattice structures, implanting a rare earth metal into a top portion of the isolation layer to form a rare earth metal oxide layer, and forming a polysilicon structure over the superlattice structures. The method further includes etching portions of the superlattice structures adjacent to the polysilicon structure to form a source/drain (S/D) opening and forming an S/D region in the S/D opening.

Abstract: A device includes a device layer comprising a first transistor; a first interconnect structure on a front-side of the device layer, and a second interconnect structure on a backside of the device layer. The second interconnect structure includes a power rail. The device further includes a carrier substrate bonded to the first interconnect structure and a first heat dissipation layer contacting the carrier substrate.

Abstract: The present disclosure describes a semiconductor device with a rare earth metal oxide layer and a method for forming the same. The method includes forming fin structures on a substrate and forming superlattice structures on the fin structures, where each of the superlattice structures includes a first-type nanostructured layer and a second-type nanostructured layer. The method further includes forming an isolation layer between the superlattice structures, implanting a rare earth metal into a top portion of the isolation layer to form a rare earth metal oxide layer, and forming a polysilicon structure over the superlattice structures. The method further includes etching portions of the superlattice structures adjacent to the polysilicon structure to form a source/drain (S/D) opening and forming an S/D region in the S/D opening.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A data report rate adjustment method for use between a computer host and a peripheral device is provided. According to the actual workload level of the computer host and/or the amount of the input data of the peripheral device, the priority or the report rate of the data to be transmitted from the peripheral device can be dynamically adjusted or set. More especially, the unnecessary data report can be avoided. Consequently, the workload of the computer host can be effectively reduced, and the power consumption of the peripheral device can be saved.

Abstract: A wideband antenna system includes a first metal radiation portion, having a coupling distance with a second metal radiation portion; a first feeding contact and a second feeding contact, electrically connected to the first metal radiation portion and the second metal radiation portion respectively, and close to the coupling distance; a first ground contact, electrically connected to the second metal radiation portion; a second ground contact, electrically connected to the first metal radiation portion; an impedance tuner, electrically connected to the first feeding contact, the second feeding contact, the first ground contact, the second ground contact, and a radio frequency signal source, to switch the first metal radiation portion and the second metal radiation portion; an aperture contact, electrically connected to the first metal radiation portion; and an aperture tuner, electrically connected to the aperture contact.

Abstract: An antenna structure includes a feed section, a ground section, a first radiator, a second radiator, and a third radiator. The first radiator and the second radiator are both connected to the feed section. The third radiator is connected to the ground section. The first radiator defines a first slot. A second slot is defined between the second radiator and the third radiator. The third radiator defines a third slot. The third slot communicates with the second slot. Current is coupled from the first radiator and the second radiator to the third radiator via the first slot, the second slot, and the third slot.

Abstract: A multiband antenna includes a feed end, a first ground end, a second ground end, a ground path, parasitic member, a first resonating member, and a second resonating member. The ground path is connected between the feed end and the first ground end. The first resonating member operates at a low frequency resonating mode. The second resonating member operates at a high frequency resonating mode. The second resonating member includes a first bent portion and a second bent portion. The first bent portion is coupled with the parasitic member to widen a bandwidth of the second resonating member at the high frequency resonating mode. The second bent portion is coupled with the first resonating member to reduce an electrical length of the first resonating member.

Abstract: An exemplary wireless communication device includes a circuit board, a metal board, and a display module. The circuit board includes two groups of connecting terminals. The metal board is located on the circuit board and includes two metal bodies. The display module is located on the metal board. One metal body is electronically connected to one group of connecting terminals. The other metal body is electronically connected to the other group of connecting terminals.

Abstract: An antenna structure includes a feed section, a ground section, a first radiator, a second radiator, and a third radiator. The first radiator and the second radiator are both connected to the feed section. The third radiator is connected to the ground section. The first radiator defines a first slot. A second slot is defined between the second radiator and the third radiator. The third radiator defines a third slot. The third slot communicates with the second slot. Current is coupled from the first radiator and the second radiator to the third radiator via the first slot, the second slot, and the third slot.

Abstract: An exemplary wireless communication device includes a circuit board, a metal board, and a display module. The circuit board includes two groups of connecting terminals. The metal board is located on the circuit board and includes two metal bodies. The display module is located on the metal board. One metal body is electronically connected to one group of connecting terminals. The other metal body is electronically connected to the other group of connecting terminals.

Abstract: A multiband antenna includes a feed end, a first ground end, a second ground end, a ground path, parasitic member, a first resonating member, and a second resonating member. The ground path is connected between the feed end and the first ground end. The first resonating member operates at a low frequency resonating mode. The second resonating member operates at a high frequency resonating mode. The second resonating member includes a first bent portion and a second bent portion. The first bent portion is coupled with the parasitic member to widen a bandwidth of the second resonating member at the high frequency resonating mode. The second bent portion is coupled with the first resonating member to reduce an electrical length of the first resonating member.

Abstract: An exemplary hearing aid compatibility (HAC) module includes an insulative substrate and a ground member. The substrate includes a first mounting surface, and a second mounting surface at opposite sides thereof, and a third mounting surface between the first mounting surface and the second mounting surface. The ground member includes two ground portions respectively attached to the first mounting surface and the second mounting surface, and a connecting portion attached to the third mounting surface. The connecting portion comprises two or more parts. One of the parts connects one of the ground portions, and another of the parts connects the other ground portion.

Abstract: An exemplary hearing aid compatibility (HAC) module includes an insulative substrate and a ground member. The substrate includes a first mounting surface, and a second mounting surface at opposite sides thereof, and a third mounting surface between the first mounting surface and the second mounting surface. The ground member includes two ground portions respectively attached to the first mounting surface and the second mounting surface, and a connecting portion attached to the third mounting surface. The connecting portion comprises two or more parts. One of the parts connects one of the ground portions, and another of the parts connects the other ground portion.

Abstract: A contact image sensor is received and held in a holder slidably mounted on a rectangular lower frame and is disposed in parallel to the two short sides of the lower frame to pick up the image of a detection object placed on the transparent plate mounted on a rectangular upper frame. A rod-like guiding member having two ends respectively mounted on the center of the two short sides of the lower frame, disposed orthogonal to the longitudinal holder, for guiding the movement of the holder is provided. A connecting member slidably mounted on the guiding member and detachably connected to the holder near the center thereof is provided. A biasing member for biasing the holder upwardly, disposed between the connecting member and the holder is also provided.