Patents by Inventor Che-Yu Yeh
Che-Yu Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230369189Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.Type: ApplicationFiled: July 24, 2023Publication date: November 16, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng
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Patent number: 11756870Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.Type: GrantFiled: April 29, 2021Date of Patent: September 12, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng
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Publication number: 20220352060Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.Type: ApplicationFiled: April 29, 2021Publication date: November 3, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng
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Patent number: 10213986Abstract: An electric connection is provided, and has a first copper (Cu) layer, a second Cu layer, and a composite metal layer disposed between the first Cu layer and the second Cu layer. The composite metal layer has 0.01 wt. %?gallium (Ga)?20 wt. %, 0.01 wt. %?copper (Cu)?50 wt. %, and 30 wt. %?nickel (Ni)?99.98 wt. %. Moreover, a method of manufacturing the electric connection is provided, and has the steps of: (1) providing a first Cu layer and a second Cu layer; (2) forming a first Ni layer on the first Cu layer; (3) forming a second Ni layer on the second Cu layer; (4) forming a Ga layer on the first Ni layer; and (5) keeping the second Ni layer in contact with the Ga layer and carrying out a thermo-compress bonding therebetween to form the electric connection.Type: GrantFiled: November 3, 2015Date of Patent: February 26, 2019Assignee: National Cheng Kung UniversityInventors: Shih-Kang Lin, Hao-Miao Chang, Mei-Jun Wang, Cheng-Liang Cho, Che-Yu Yeh
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Patent number: 10002820Abstract: A semiconductor device comprises a substrate with a first side and a second side, wherein a plurality of active circuits are formed adjacent to the first side of the substrate and a plurality of through silicon vias arranged in a polygon shape and extending from the first side of to the second side, wherein the polygon shape has more than six sides, and wherein each through silicon via is placed at a corresponding apex of the polygon shape.Type: GrantFiled: May 23, 2012Date of Patent: June 19, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sun-Rong Jan, Che-Yu Yeh, Chee Wee Liu, Chien-Hua Huang, Bing J. Sheu
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Patent number: 9997615Abstract: Methods for forming semiconductor structures are provided. The method for manufacturing a semiconductor structure includes forming a hard mask structure over a substrate and etching the substrate through an opening of the hard mask structure to form a trench. The method for manufacturing a semiconductor structure further includes removing a portion of the hard mask structure to enlarge the opening and forming an epitaxial-growth structure in the trench and the opening.Type: GrantFiled: November 30, 2015Date of Patent: June 12, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Che-Yu Yeh, Chung-Cheng Wu, Cheng-Long Chen, Gwan-Sin Chang, Pang-Yen Tsai, Yen-Ming Chen, Yasutoshi Okuno, Ying-Hsuan Wang
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Publication number: 20170154978Abstract: Methods for forming semiconductor structures are provided. The method for manufacturing a semiconductor structure includes forming a hard mask structure over a substrate and etching the substrate through an opening of the hard mask structure to form a trench. The method for manufacturing a semiconductor structure further includes removing a portion of the hard mask structure to enlarge the opening and forming an epitaxial-growth structure in the trench and the opening.Type: ApplicationFiled: November 30, 2015Publication date: June 1, 2017Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Che-Yu YEH, Chung-Cheng WU, Cheng-Long CHEN, Gwan-Sin CHANG, Pang-Yen TSAI, Yen-Ming CHEN, Yasutoshi OKUNO, Ying-Hsuan WANG
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Publication number: 20160121582Abstract: An electric connection is provided, and has a first copper (Cu) layer, a second Cu layer, and a composite metal layer disposed between the first Cu layer and the second Cu layer. The composite metal layer has 0.01 wt. %?gallium (Ga)?20 wt. %, 0.01 wt. %?copper (Cu)?50 wt. %, and 30 wt. %?nickel (Ni)?99.98 wt. %. Moreover, a method of manufacturing the electric connection is provided, and has the steps of: (1) providing a first Cu layer and a second Cu layer; (2) forming a first Ni layer on the first Cu layer; (3) forming a second Ni layer on the second Cu layer; (4) forming a Ga layer on the first Ni layer; and (5) keeping the second Ni layer in contact with the Ga layer and carrying out a thermo-compress bonding therebetween to form the electric connection.Type: ApplicationFiled: November 3, 2015Publication date: May 5, 2016Inventors: Shih-Kang LlN, Hao-Miao CHANG, Mei-Jun WANG, Cheng-Liang CHO, Che-Yu YEH
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Publication number: 20130221534Abstract: A semiconductor device comprises a substrate with a first side and a second side, wherein a plurality of active circuits are formed adjacent to the first side of the substrate and a plurality of through silicon vias arranged in a polygon shape and extending from the first side of to the second side, wherein the polygon shape has more than six sides, and wherein each through silicon via is placed at a corresponding apex of the polygon shape.Type: ApplicationFiled: May 23, 2012Publication date: August 29, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Sun-Rong Jan, Che-Yu Yeh, Chee Wee Liu, Chien-Hua Huang, Bing J. Sheu