Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A manufacturing method of artificial graphite sheet and a product thereof. The artificial graphite sheet manufactured by means of the manufacturing method can be rolled up to minimize the occupied space and facilitate transfer and delivery. The manufacturing method includes steps of: selecting graphite powder (granules) and polymer and mixing the graphite powder with polymer; heating, compounding and homogenizing the mixture to form a graphite (mixture) subassembly with a basic thickness; calendering the graphite subassembly to form a graphite (mixture) sheet assembly with a purposed thickness; thermostatically maturing the graphite sheet assembly and gradually cooling the graphite sheet assembly to room temperature to form a flexible sheet body; and rolling up the flexible sheet body into a roll form with a rolling apparatus. The manufacturing equipment and process of the artificial graphite sheet are simplified and the manufacturing time is shortened.

Abstract: A complex heat dissipation assembly for electronic case, which includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly having a contact face in contact with a surface of the case; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. Each heat spreader has a proximal-to-heat-source section and a distal-from-heat-source section. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat of the case in different directions so as to uniformly and quickly dissipate the heat. Accordingly, the heat is prevented from accumulating around the case and the temperature will not locally abnormally rise.

Abstract: A complex heat dissipation assembly, which includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly having a contact face in contact with the heat source; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. Each heat spreader has a proximal-to-heat-source section and a distal-from-heat-source section. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat of the heat source in different directions so as to uniformly and quickly dissipate the heat. Accordingly, the heat is prevented from accumulating around the heat source. In this case, the temperature will not locally abnormally rise.

Abstract: A complex heat dissipation assembly for backlight module, which is applicable to the backlight module of a screen of an electronic product for dissipating heat. The complex heat dissipation assembly includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly being disposed on a rear surface of the backlight module; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat generated by the backlight module in different directions so as to prevent the heat from accumulating around the backlight module. In this case, the temperature will not locally abnormally rise.

Abstract: A heat dissipation structure of electronic shield cover, which is applicable to a heat-conductive and magnetically conductive isolation case that encloses a preset heat source for dissipating heat. The heat dissipation structure includes: an electroconductive heat conduction plate assembly having at least one contact face in contact with a surface of the isolation case; and a heat spreader, which is able to transversely conduct heat. The heat spreader has an area smaller than that of the heat conduction plate assembly and is disposed on the heat conduction plate assembly in contact therewith. The heat spreader has a proximal-to-heat-source section proximal to the heat source and a distal-from-heat-source section extending in a direction away from the heat source. The heat conduction plate assembly and the heat spreader cooperate with each other to quickly dissipate the heat and avoid accumulation of the heat around the heat source.

Abstract: A heat dissipation device of electronic apparatus, which is applicable to an electronic apparatus with a heat source for dissipating heat. The heat dissipation device includes: at least one electroconductive heat conduction plate assembly having a contact face in contact with a grounding surface and a heat conduction face facing the heat source; and a heat spreader with an area smaller than that of the heat conduction plate assembly. The heat spreader is able to transversely conduct heat. The heat spreader is attached to the heat conduction plate assembly. The heat spreader has a proximal-to-heat-source section proximal to the heat source and a distal-from-heat-source section extending in a direction away from the heat source. The heat conduction plate assembly and the heat spreader cooperate with each other to conduct and spread the heat of the heat source in different directions.

Abstract: A heat dissipation structure of tablet display member, which is applicable to an electronic product. The heat dissipation structure includes: at least one heat conduction plate assembly partially positioned beside a light source assembly of the display member, the heat conduction plate assembly having a heat conduction face adjacent to the light source assembly; and a heat spreader able to quickly transversely conduct heat. The heat spreader is attached to the heat conduction plate assembly. The heat spreader has a proximal-to-heat-source section proximal to the light source assembly and a distal-from-heat-source section distal from the light source assembly. The heat conduction plate assembly and the heat spreader cooperate with each other to conduct and spread the heat of the heat source in different directions so as to uniformly dissipate the heat and avoid accumulation of the heat around the heat source.

Abstract: A heat conduction structure mounted in a casing of an electronic product includes a main heat conduction module and at least one secondary heat conduction module between a heat source and the casing. The main heat conduction module includes a first heat conduction member located close to the heat source to conduct the heat of the heat source, a first heat resistant member to stop the heat from diffusing, and a heat radiation member contact with the first heat conduction member to radiate the heat. The secondary heat conduction module includes a second heat conduction member parallel to the first heat conduction member, a second heat resistant member between the first heat resistant member and the casing, a first heat radiation member and a second heat radiation member contact with the second heat conduction member to radiate the heat of the second heat conduction member.