Abstract: A memory device includes a memory cell array, a write/read circuit, a control circuit and an anti-fuse array. The memory cell array includes a plurality of nonvolatile memory cells. The write/read circuit performs a write operation to write write data in a target page of the memory cell array, verifies the write operation by comparing read data read from the target page with the write data and outputs a pass/fail signal indicating one of a pass or a fail of the write operation based on a result of the comparing. The control circuit controls the write/read circuit and selectively outputs an access address of the target page as a fail address in response to the pass/fail signal. The anti-fuse array in which the fail address is programmed, outputs a repair address that replaces the fail address.

Abstract: An integrated circuit memory device includes an array of resistive memory cells and a programming circuit, which is electrically coupled by a plurality of word lines and plurality of bit lines to corresponding rows and columns of the resistive memory cells. The programming circuit includes a control circuit and word line driver that are collectively configured to generate word line program voltages having magnitudes that vary as a function of the row and/or column addresses of the resistive memory cells in the array, during operations to program the array with write data. According to the function, the magnitude of a word line program voltage associated with a first resistive memory cell having a first parasitic resistance is less than a magnitude of a word line program voltage associated with a second resistive memory cell having a second parasitic resistance, which is greater than the first parasitic resistance.

Abstract: A resistive memory element or device includes: a first, main, memory cell area including a plurality of first resistive memory cells; and a second, buffer, memory cell area including a plurality of second resistive memory cells. The first resistive memory cells of the main memory cell area are configured to store data therein, and the second resistive memory cells of the buffer memory cell area are configured to temporarily store portions of the data therein for at least a stabilization time period while the portions of the data stabilize in the main memory cell area.

Abstract: A memory device includes: a memory cell array including a plurality of memory cells, wherein each of the plurality of memory cells includes a switching element, and a data storage element connected to the switching element, wherein the data storage element includes a phase change material; and a memory controller configured to perform a control operation with respect to a first memory cell of the plurality of memory cells by inputting an operating current to the first memory cell, and inputting a compensation current flowing from the data storage element to the switching element in the first memory cell before or after inputting the operating current to the first memory cell.

Abstract: A memory device includes a memory cell array, a write/read circuit, a control circuit and an anti-fuse array. The memory cell array includes a plurality of nonvolatile memory cells. The write/read circuit performs a write operation to write write data in a target page of the memory cell array, verifies the write operation by comparing read data read from the target page with the write data and outputs a pass/fail signal indicating one of a pass or a fail of the write operation based on a result of the comparing. The control circuit controls the write/read circuit and selectively outputs an access address of the target page as a fail address in response to the pass/fail signal. The anti-fuse array in which the fail address is programmed, outputs a repair address that replaces the fail address.

Abstract: A memory device includes a memory cell array, a write/read circuit, a control circuit and an anti-fuse array. The memory cell array includes a plurality of nonvolatile memory cells. The write/read circuit performs a write operation to write write data in a target page of the memory cell array, verifies the write operation by comparing read data read from the target page with the write data and outputs a pass/fail signal indicating one of a pass or a fail of the write operation based on a result of the comparing. The control circuit controls the write/read circuit and selectively outputs an access address of the target page as a fail address in response to the pass/fail signal. The anti-fuse array in which the fail address is programmed, outputs a repair address that replaces the fail address.

Abstract: An integrated circuit memory device includes an array of resistive memory cells and a programming circuit, which is electrically coupled by a plurality of word lines and a plurality bit lines to corresponding rows and columns of resistive memory cells in the array. The programming circuit includes a control circuit and word line driver that are collectively configured to generate word line program voltages having magnitudes that vary as a function of the row and/or column addresses of the resistive memory cells in the array, during operations to program the array with write data. According to the function, the magnitude of a word line program voltage associated with a first resistive memory cell having a first parasitic resistance associated therewith is less than a magnitude of a word line program voltage associated with a second resistive memory cell having a second parasitic resistance associated therewith, which is greater than the first parasitic resistance.

Abstract: A memory device including: a memory cell array, including a memory cell having a switch element and a data storage element connected to the switch element, wherein the data storage element has a phase change material; and a memory controller for inputting a first read current to the memory cell to detect a first read voltage, inputting a second read current to the memory cell to detect a second read voltage, and inputting a compensation current to the memory cell, wherein the compensation current lowers a resistance value of the data storage element, the compensation current is input when a first state of the memory cell is different from a second state of the memory cell, the first state is determined using the first read voltage and the second state is determined using the second read voltage.

Abstract: A memory device including: a memory cell array, including a memory cell having a switch element and a data storage element connected to the switch element, wherein the data storage element has a phase change material; and a memory controller for inputting a first read current to the memory cell to detect a first read voltage, inputting a second read current to the memory cell to detect a second read voltage, and inputting a compensation current to the memory cell, wherein the compensation current lowers a resistance value of the data storage element, the compensation current is input when a first state of the memory cell is different from a second state of the memory cell, the first state is determined using the first read voltage and the second state is determined using the second read voltage.

Abstract: A memory device includes a memory cell array, a write/read circuit, a control circuit and an anti-fuse array. The memory cell array includes a plurality of nonvolatile memory cells. The write/read circuit performs a write operation to write write data in a target page of the memory cell array, verifies the write operation by comparing read data read from the target page with the write data and outputs a pass/fail signal indicating one of a pass or a fail of the write operation based on a result of the comparing. The control circuit controls the write/read circuit and selectively outputs an access address of the target page as a fail address in response to the pass/fail signal. The anti-fuse array in which the fail address is programmed, outputs a repair address that replaces the fail address.

Abstract: A memory device includes: a memory cell array including a plurality of memory cells, wherein each of the plurality of memory cells includes a switching element, and a data storage element connected to the switching element, wherein the data storage element includes a phase change material; and a memory controller configured to perform a control operation with respect to a first memory cell of the plurality of memory cells by inputting an operating current to the first memory cell, and inputting a compensation current flowing from the data storage element to the switching element in the first memory cell before or after inputting the operating current to the first memory cell.

Abstract: A resistive memory element or device includes: a first, main, memory cell area including a plurality of first resistive memory cells; and a second, buffer, memory cell area including a plurality of second resistive memory cells. The first resistive memory cells of the main memory cell area are configured to store data therein, and the second resistive memory cells of the buffer memory cell area are configured to temporarily store portions of the data therein for at least a stabilization time period while the portions of the data stabilize in the main memory cell area.

Abstract: A resistive memory element or device includes: a first, main, memory cell area including a plurality of first resistive memory cells; and a second, buffer, memory cell area including a plurality of second resistive memory cells. The first resistive memory cells of the main memory cell area are configured to store data therein, and the second resistive memory cells of the buffer memory cell area are configured to temporarily store portions of the data therein for at least a stabilization time period while the portions of the data stabilize in the main memory cell area.

Abstract: A memory device having a resistance change material and an operating method of the memory device are provided. A memory device includes a memory cell array including first and second resistive memory cells, which store different data according to the change of their resistance; a buffer including first and second storage regions corresponding to the first and second resistive memory cells, respectively; and a control circuit receiving program data to be programmed to the memory cell array, comparing first data stored in the first storage region and second data stored in the first resistive memory cell, and as a result of the comparison determining one of the first and second storage regions as a storage region to which to write the program data.

Abstract: A resistive memory element or device includes: a first, main, memory cell area including a plurality of first resistive memory cells; and a second, buffer, memory cell area including a plurality of second resistive memory cells. The first resistive memory cells of the main memory cell area are configured to store data therein, and the second resistive memory cells of the buffer memory cell area are configured to temporarily store portions of the data therein for at least a stabilization time period while the portions of the data stabilize in the main memory cell area.

Abstract: A memory device having a resistance change material and an operating method of the memory device are provided. A memory device includes a memory cell array including first and second resistive memory cells, which store different data according to the change of their resistance; a buffer including first and second storage regions corresponding to the first and second resistive memory cells, respectively; and a control circuit receiving program data to be programmed to the memory cell array, comparing first data stored in the first storage region and second data stored in the first resistive memory cell, and as a result of the comparison determining one of the first and second storage regions as a storage region to which to write the program data.