Patents by Inventor Cheah Bok Eng

Cheah Bok Eng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked-die packages with silicon vias and surface activated bonding
    Publication number: 20080150155
    Abstract: A system may include a first integrated circuit die including a plurality of silicon vias and a first surface activated bonding site coupled to the plurality of silicon vias, and a second integrated circuit die including a second surface activated bonding site coupled to the first surface activated bonding site. A system may further include an integrated circuit package substrate coupled to the plurality of silicon vias, and a plurality of wirebonds coupled to the integrated circuit package substrate and to the first integrated circuit die.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Inventors: Shanggar Periaman, Ooi Kooi Chi, Cheah Bok Eng