Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.

Abstract: Provided are an apparatus, method for separating a chip and a method for fabricating the apparatus. An apparatus for separating a chip, according to example embodiments, may include a suction holder. The suction holder may include an upper surface with at least one suction hole to suction and fix an adhesive tape to which a plurality of semiconductor chips may be attached. The apparatus for separating a chip may also include a rotatable plunger in the suction holder. The rotatable plunger may include an upper end configured to pass through the at least one suction hole and to project over the suction holder upon rotation of the rotatable plunger. The apparatus for separating a chip may also include a vertically movable plunger lifter. The vertically movable plunger lifter may be configured to rotate the rotatable plunger by contacting and raising a lower end of the rotatable plunger.

Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip a parallel state with a lead frame when applying a bonding load.

Abstract: A bonding apparatus for a semiconductor package determines whether a bottom of a bonding head is contaminated, and may include a contamination detecting unit for a bonding head attached to a body to apply pressure to the semiconductor package. The contamination detecting unit is below the bonding head to detect contamination on the bottom of the bonding head, a bonding block, and a bonding stage.