Patents by Inventor Chean F. Cheng

Chean F. Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple-axis sensor package and method of assembly
    Publication number: 20090056446
    Abstract: A multiple-axis sensor package and method of assembling a multiple-axis sensor package are provided. The package includes a first accelerometer for sensing acceleration in a first sensing axis. The package also includes a second substrate having a second accelerometer for sensing acceleration in a second sensing axis. The package further includes one or more bent lead connectors connecting the first substrate to the second substrate, wherein the one or more bent lead connectors are bent so that the first sensing axis is different than the second sensing axis.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 5, 2009
    Inventors: Charles A. Cluff, Chean F. Cheng, Aik Huang Chan, Joe Chua