Patents by Inventor Chebrolu Srinivas

Chebrolu Srinivas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BGA footprint pattern for increasing number of routing channels per PCB layer
    Patent number: 8273994
    Abstract: A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, where the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and where a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: September 25, 2012
    Assignee: Juniper Networks, Inc.
    Inventors: Boris Reynov, Ping Yue, Shreeram Siddhaye, John Cleveland, Chebrolu Srinivas, Srinivas Venkataraman
  • BGA FOOTPRINT PATTERN FOR INCREASING NUMBER OF ROUTING CHANNELS PER PCB LAYER
    Publication number: 20110155434
    Abstract: A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, where the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and where a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via.
    Type: Application
    Filed: December 28, 2009
    Publication date: June 30, 2011
    Applicant: Juniper Networks Inc.
    Inventors: Boris REYNOV, Ping Yue, Shreeram Siddhaye, John Cleveland, Chebrolu Srinivas, Srinivas Venkataraman