Patents by Inventor Chee C. Wong

Chee C. Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making an article comprising solder bump bonding
    Patent number: 5307983
    Abstract: The present invention is embodied in a technique for precise and accurate height control in fabricating solder bumps or joints formed from a solder bump or bumps. A solder bump is formed by reflow of a conical solder body having base diameter D, height H and cone angle .theta., and has truncated sphere shape, with height h and truncation diameter d. We have found that D, H, and d can be selected such that .differential.h/.differential.H is small (typically .ltoreq.0.5), indicative of relative insensitivity of the bump height to variation in the height of the conical solder body. The inventive process is also applicable to a component (e.g., a laser) solder-bonded to a substrate, and can provide previously unattainable control of the spacing between component and substrate.
    Type: Grant
    Filed: April 27, 1993
    Date of Patent: May 3, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Thomas D. Dudderar, Chee C. Wong