Abstract: Embodiments of the present invention provide a die stack including a first substrate, a first die bonded to the first substrate, a second substrate having a cavity sized and shaped to fit over the first die, and a second die bonded to at least a portion of a rim of the cavity.

Abstract: In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer formed on the substrate. In some embodiments, the mold layer is substantially coplanar with the metal layer to improve package performance. Other embodiments are described and claimed.

Abstract: Some embodiments relate to an electronic assembly that includes a substrate and a plurality of pads. Each of the pads includes a lower section that is embedded in the substrate and a bowl-shaped upper section that is on top of the lower section. The bowl-shaped upper section protrudes from the substrate such that the bowl-shaped upper section is adapted to be soldered to balls or pads on another electronic assembly (e.g., an electronic package that include a die). Other embodiments relate to a method that includes forming a plurality of pads on a substrate such that each of the pads includes a lower section that is embedded in the substrate and an upper section that protrudes from the substrate. The method further includes heating the plurality of pads and engaging a member with the plurality of pads to form the upper section of each pad into a bowl shape.

Abstract: An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part. The first metallic layer is directly placed on top of an exterior surface of the ceiling wall of the integrated heat spreader as well as the back surface of the integrated circuit.