Abstract: A method and a system for the enhancement of the sensitivity in surface plasmon resonance (SPR) sensors based metallic grating by exploiting the conical configuration is presented. We consider the propagation of surface plasmon polaritons (SPPs) excited by light from the visible to infrared spectrum range, incident on a plasmonic grating at different directions by varying both the zenith and azimuthal angles. For specific azimuthal angles, SPPs propagate in the grating plane perpendicular to the incident light momentum. This is the condition that allows increasing the number of different excited SPPs modes largely. We exploit this effect to increase the sensor sensitivity with the change of refractive index of thin film on the plasmonic grating surface. Polarization effects also contribute to a further modes enhancement and increase the sensitivity. A scheme for a lab-on-chip implementation of a system that allows a parallel detection in microfluidic channels has been shown.

Abstract: A method and a system for the enhancement of the sensitivity in surface plasmon resonance (SPR) sensors based metallic grating by exploiting the conical configuration is presented. We consider the propagation of surface plasmon polaritons (SPPs) excited by light from the visible to infrared spectrum range, incident on a plasmonic grating at different directions by varying both the zenith and azimuthal angles. For specific azimuthal angles, SPPs propagate in the grating plane perpendicular to the incident light momentum. This is the condition that allows increasing the number of different excited SPPs modes largely. We exploit this effect to increase the sensor sensitivity with the change of refractive index of thin film on the plasmonic grating surface. Polarization effects also contribute to a further modes enhancement and increase the sensitivity. A scheme for a lab-on-chip implementation of a system that allows a parallel detection in microfluidic channels has been shown.

Abstract: A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating (118) on a first metallic surface (116) to form a first passivation layer thereon, the first nanostructured organic coating (118) comprising an organic phase with nanoparticles dispersed within the organic phase, contacting the first nanostructured organic coating (118) with a second metallic surface (126), and applying on the first and second metallic surfaces (116, 126) at least a bonding temperature of at least room temperature and/or a bonding pressure for a bonding period to bond the first and second metallic surfaces (116, 126) thereby forming the direct metal-metal bond therebetween. A second nanostructured organic coating (128) comprising an organic phase with nanoparticles dispersed within the organic phase may also be deposited on the second metallic surface (126).

Abstract: A method of facilitating wafer level burn-in testing. The method may utilize a rerouting process to connect input and output connections of each chip on the wafer to a bus network. The bus network may be used to conduct wafer level burn-in testing and does not change the AC/DC operating characteristics of the chips.