Patents by Inventor Chee Chew Hiong

Chee Chew Hiong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball-less clip bonding
    Patent number: 6479893
    Abstract: A semiconductor component includes a semiconductor chip (120, 1120), an electrically conductive adhesive located over the semiconductor chip, and a clip bond (231, 232, 1231, 1232) located over the electrically conductive adhesive. The clip bond has at least one burr to retain the electrically conductive adhesive.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: November 12, 2002
    Assignee: Semiconductor Components Industries LLC
    Inventors: Saat Shukri Embong, Chee Chew Hiong
  • Ball-less clip bonding
    Publication number: 20020066963
    Abstract: A semiconductor component includes a semiconductor chip (120, 1120), an electrically conductive adhesive located over the semiconductor chip, and a clip bond (231, 232, 1231, 1232) located over the electrically conductive adhesive. The clip bond has at least one burr to retain the electrically conductive adhesive.
    Type: Application
    Filed: December 4, 2000
    Publication date: June 6, 2002
    Applicant: Semiconductor Components Industries, LLC
    Inventors: Saat Shukri Embong, Chee Chew Hiong