Abstract: Embodiments of the invention provide a transformer comprising: a first coil element having a transverse axis along a transverse direction, the first coil element having p turns where p is greater than or equal to 1; and a second coil element having a transverse axis generally parallel to the transverse axis of the first coil element, the second coil element having n turns, where n is greater than or equal to 5p; wherein the first and second coil elements are arranged to provide electromagnetic coupling between the coil elements along a portion of a length of the second coil element in both a transverse direction parallel to the transverse axes and a lateral direction, wherein the lateral direction is a direction normal to the transverse axes.

Abstract: A dual-contact battery pack comprises a housing, a plurality of battery cells located within the housing, a first set of contacts and a second set of contacts coupled to the housing and to the plurality of battery cells. The dual-contact battery further comprises a first control circuit coupled between the plurality of battery cells and the first set of contacts and a second control circuit coupled between the plurality of battery cells and the second set of contacts. The first and second sets of contacts enable the dual-contact battery pack to selectively switch from a first state which prevents current from flowing from the plurality of battery cells to the respective first and second set of contacts to a second state in which current flows from the plurality of battery cells to the respective first and second set of contacts in response to the respective first and second control circuits.

Abstract: A battery pack includes a cover coupled to a housing, wherein the cover and the housing are hermetically sealed to enclose one or more batteries. A wire is integrally molded within a perimeter of the cover to allow for the removal of the cover from the housing upon application of current to the wire. The wire is molded within the cover so as to be co-located along an edge of the housing. First and second contacts are coupled to the wire and remain exposed on the cover. The cover can be separated from the housing in response to current being applied to the first and second contacts and pulling of the wire.

Abstract: A battery pack (200) includes a power limiting apparatus (230) comprising a power limiting resistor (232) in series with an overcurrent protection device (234). A switch (236) under the control of a data line (202) is placed in parallel with the series coupled power limiting resistor (232) and overcurrent protection device (234). When the switch (236) is enabled via the data line (202), current limiting is provided via the switch and a fuse. When the switch (236) is disabled via the data line (202) current limiting is provided via the overcurrent protection device (234) which limits the maximum battery system current.

Abstract: A method of forming a device is presented. The method includes providing a wafer having an active surface and dividing the wafer into a plurality of portions. The wafer is selectively processed by localized heating of a first of the plurality of portions. The wafer is then repeatedly selectively processed by localized heating of a next of the plurality of portions until all plurality of portions have been selectively processed.

Abstract: An integrated transformer structure includes a first coil element associated with a transverse axis, the first coil element having at least one turn. The first coil element includes a first portion provided on a first lateral level, and a second portion provided on a second lateral level. The first and second lateral levels being mutually spaced apart along said transverse axis. The first and second portions being displaced laterally from said axis by different respective distances. At least one crossover portion of the first coil element, in which the first coil element being configured to provide a conducting path through at least a portion of the first portion of the first coil element to the crossover portion, through the crossover portion and subsequently through at least a portion of the second portion of the first coil element, in which any change of flow direction along said path is less than 90° in a lateral direction.

Abstract: Embodiments of the invention provide a transformer comprising: a first coil element having a transverse axis along a transverse direction, the first coil element having p turns where p is greater than or equal to 1; and a second coil element having a transverse axis generally parallel to the transverse axis of the first coil element, the second coil element having n turns, where n is greater than or equal to 5 p; wherein the first and second coil elements are arranged to provide electromagnetic coupling between the coil elements along a portion of a length of the second coil element in both a transverse direction parallel to the transverse axes and a lateral direction, wherein the lateral direction is a direction normal to the transverse axes.

Abstract: An integrated transformer structure includes a first coil element associated with a transverse axis, the first coil element having at least one turn. The first coil element includes a first portion provided on a first lateral level, and a second portion provided on a second lateral level. The first and second lateral levels being mutually spaced apart along said transverse axis. The first and second portions being displaced laterally from said axis by different respective distances. At least one crossover portion of the first coil element, in which the first coil element being configured to provide a conducting path through at least a portion of the first portion of the first coil element to the crossover portion, through the crossover portion and subsequently through at least a portion of the second portion of the first coil element, in which any change of flow direction along said path is less than 90° in a lateral direction.

Abstract: An optical encoder utilizes a photodetector array having at least two photodetectors with different surface areas that generate different amounts of photocurrent when they are simultaneously lit by an LED. Because the photodetectors generate different amounts of photocurrent when simultaneously lit, the photodetectors produce unambiguous results that can be used to index a coding element such as a codewheel. Another optical encoder utilizes one index photodetector that is aligned with an index track and another index photodetector that is aligned with a position track of a coding element to index the coding element.

Abstract: Described are systems and methods for printing that use an optical sensor that is moveable relative to a print medium, and a mark that is visible to the optical sensor within the range of movement of the optical sensor. The mark provides a fixed and known location that can be used to establish a position of the optical sensor relative to the print medium.

Abstract: A coding element such as a codewheel includes first and second surfaces that are configured with respect to each other and with respect to a light beam such that the light beam is reflected at the two surfaces using the optical phenomenon of total internal reflection. The coding element also includes a coding pattern that is aligned in an optical path of the light beam after the light beam has reflected off of both of the surfaces. A coding element with surfaces that reflect a light beam as a result of total internal reflection can be utilized in an encoding system that operates in transmission while the light source and the photodetector array are located on the same side of the coding element.

Abstract: An optical encoder includes a coding element having a track with multiple transparent sections, a light source positioned to output light to the track, and a photodetector array, positioned to detect light that passes through the transparent sections of the track. The photodetectors of the photodetector array have larger width dimensions than the width dimensions of the transparent sections of the track. Resolution of the optical encoder may be adjusted by changing the resolution of the coding element.

Abstract: In one embodiment, an optical encoder device is provided with an optical encoder to detect codewheel/codestrip positions; a housing to accommodate the optical encoder; a first tapered guidepost protruding from a sidewall of the optical encoder housing; and a second tapered guidepost protruding from the sidewall of the optical encoder housing and extending substantially parallel to the first tapered guidepost. Other embodiments are also disclosed.

Abstract: A print mechanism and method for printing are disclosed. The print mechanism includes a print head assembly, an actuator for moving the same, and a controller. The print head assembly includes a position detector and a marking device. The position detector includes an imaging device for periodically forming an image of a portion of a print medium. The actuator moves the print head assembly relative to the print medium in a predetermined direction. The controller compares first and second images formed by the imaging device at first and second times, respectively, while the print head assembly moves relative to the print medium and determines a displacement of the print head assembly between the first and second times from the images. The controller causes the marking device to mark the print medium at locations determined by the determined displacement.

Abstract: A polaroid encoder system for detecting movement is disclosed. The system includes a movable polarizing code element. A detector module detects an amplitude based on how much illumination passes through one portion of the movable polarizing code element. A quadrant of the movable polarizing code element is determined based on how much illumination passes through another portion of the movable polarizing code element. The angular position of the movable polarizing code element can then be determined by using amplitude and the quadrant information.

Abstract: A code disk, an optical encoder using such a disk and a method thereof are described. The code disk includes a first region on the disk and a second region that is adjacent to the first region. The first region increases continuously in size in a radial direction from a minimum at a first angular position to a maximum that occurs 360 degrees from the first angular position. One of the first and second regions allows light to be transmitted therethrough to a detector, and the other of the first and second regions prevents light from being transmitted therethrough. The detector generates an output that corresponds to the amount of light transmitted through the code disk.

Abstract: A new method of fabricating solder bumps in the manufacture of an integrated circuit device has been achieved. Contact pads are provided overlying a semiconductor substrate. A passivation layer is provided overlying the contact pads. The passivation layer has openings that expose a top surface of the contact pads. A sacrificial layer is deposited overlying the passivation layer and the exposed top surface of the contact pads. The sacrificial layer is not wettable to solder. Under bump metallurgy (UBM) caps may be formed either by deposition and patterning of a UBM layer stack or by selective electroless deposition of a material such as nickel and gold. An aperture mask is formed overlying the sacrificial layer. The aperture mask has openings that expose a part of the sacrificial layer overlying the contact pads. A solder layer is printed into the openings in the aperture mask. The solder layer is reflowed to form solder bumps overlying the contact pads. The aperture mask is stripped away.

Abstract: A new method of fabricating solder bumps in the manufacture of an integrated circuit device has been achieved. Contact pads are provided overlying a semiconductor substrate. A passivation layer is provided overlying the contact pads. The passivation layer has openings that expose a top surface of the contact pads. A sacrificial layer is deposited overlying the passivation layer and the exposed top surface of the contact pads. The sacrificial layer is not wettable to solder. Under bump metallurgy (UBM) caps may be formed either by deposition and patterning of a UBM layer stack or by selective electroless deposition of a material such as nickel and gold. An aperture mask is formed overlying the sacrificial layer. The aperture mask has openings that expose a part of the sacrificial layer overlying the contact pads. A solder layer is printed into the openings in the aperture mask. The solder layer is reflowed to form solder bumps overlying the contact pads. The aperture mask is stripped away.