Patents by Inventor Chee Fong

Chee Fong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9433090
    Abstract: An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers within a multi-layer PCB are configured to physically extend to an edge of the PCB, which is plated using copper electroplating, so that copper ground strips disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: August 30, 2016
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Peter Atkinson, Chee Fong, Mark Casebolt, Ying Liang
  • Publication number: 20150282298
    Abstract: An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers within a multi-layer PCB are configured to physically extend to an edge of the PCB, which is plated using copper electroplating, so that copper ground strips disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 1, 2015
    Applicant: Microsoft Corporation
    Inventors: Peter Atkinson, Chee Fong, Mark Casebolt, Ying Liang
  • Patent number: 8009388
    Abstract: The present invention provides a method for increasing storage capacity of a disc drive by physically skewing a transducer in relation to a slider supporting the transducer. The physical skew angle of the transducer is configured to provide a predetermined zero skew position on the medium, which is capable of providing an increased storage capacity to the medium. To ascertain this zero skew position, a storage density or storage capacity of the medium may be ascertained for each of various zero skew positions on the medium. A desired storage density or capacity level is selected according to storage capacity requirements and the corresponding zero skew position is ascertained. The corresponding zero skew position may be implemented by physically skewing a transducer relative to a slider.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: August 30, 2011
    Assignee: Seagate Technology LLC
    Inventors: Chee Fong Oh, Swee Chuan Gan, Lihong Zhang
  • Publication number: 20080084636
    Abstract: The present invention provides a method for increasing storage capacity of a disc drive by physically skewing a transducer in relation to a slider supporting the transducer. The physical skew angle of the transducer is configured to provide a predetermined zero skew position on the medium, which is capable of providing an increased storage capacity to the medium. To ascertain this zero skew position, a storage density or storage capacity of the medium may be ascertained for each of various zero skew positions on the medium. A desired storage density or capacity level is selected according to storage capacity requirements and the corresponding zero skew position is ascertained. The corresponding zero skew position may be implemented by physically skewing a transducer relative to a slider.
    Type: Application
    Filed: October 10, 2006
    Publication date: April 10, 2008
    Applicant: Seagate Technology LLC
    Inventors: Chee Fong Oh, Swee Chuan Gan, Lihong Zhang
  • Publication number: 20080036481
    Abstract: A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end.
    Type: Application
    Filed: July 24, 2007
    Publication date: February 14, 2008
    Applicant: Microsoft Corporation
    Inventors: Chee Fong, Harjit Singh, Jelena Larsen, Raul Rodriquez-Montanez, Rodney Amen
  • Publication number: 20070255496
    Abstract: Various embodiments of the present invention are directed to methods and systems for incorporating global-positioning-system information into a data recording. In one embodiment of the present invention, a data encoder encodes received data and outputs the encoded data to a data track. A global-positioning-system encoder encodes received global-positioning-system data and outputs the encoded global-positioning-system-data to a global-positioning-system track. Interconnected decision logic selects which global-positioning-system data is output.
    Type: Application
    Filed: April 30, 2006
    Publication date: November 1, 2007
    Inventors: Chee Fong, Wai-tlan Tan
  • Publication number: 20070177364
    Abstract: A printed wiring assembly comprising, a printed wiring board, a ball grid array coupled to the printed wiring board, and a high density surface mount part array disposed on the printed wiring board.
    Type: Application
    Filed: January 31, 2006
    Publication date: August 2, 2007
    Applicant: Microsoft Corporation
    Inventors: Jelena Larsen, Chee Fong, Peter Atkinson, Raul Rodriguez-Montanez
  • Publication number: 20070068701
    Abstract: A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end.
    Type: Application
    Filed: September 26, 2005
    Publication date: March 29, 2007
    Applicant: Microsoft Corporation
    Inventors: Chee Fong, Harjit Singh, Jelena Larsen, Raul Rodriguez-Montanez, Rodney Amen
  • Publication number: 20060255773
    Abstract: An external AC power adaptor having an additional compartment for cooling. The adaptor has a housing that defines a first compartment having power circuitry for converting an AC input to a DC output and a second compartment that has an opening formed in the adaptor housing. A heat transfer plate is disposed between the first and second compartments.
    Type: Application
    Filed: May 11, 2005
    Publication date: November 16, 2006
    Applicant: Microsoft Corporation
    Inventors: Chee Fong, Daniel Neal, J. Egner, Roy Askeland
  • Publication number: 20040015393
    Abstract: The present system facilitates delivery of goods by providing a locker module at a location near a customer's residential site. For a vendor to deliver a good to the customer, the vendor leases a unit in the locker module from the system controller by accessing the system controller's web site and providing details of the customer and a delivery agent. The vendor then modifies the delivery agent to make the delivery. The delivery agent provides the system controller the particulars of its delivery person. The designated delivery person accesses the leased locker unit using a registered smart card. The delivery person then places the goods in the designated locker unit. The system controller notifies the customer of the delivered good by sending an SMS message to the customer's mobile phone, the SMS message providing the location of the locker module and a unique pin number. The customer accesses the locker unit by entering the pin number.
    Type: Application
    Filed: August 14, 2003
    Publication date: January 22, 2004
    Inventors: Fatt Chee Fong, Hon Chew Lee, Xiao Feng Zhang, Gunawan Lauw, Guangquan Mo, Yu Pern Yeh