Patents by Inventor Chee Hong Lee
Chee Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11949053Abstract: A light emitting diode (LED) device comprises: an interposer comprising: an interposer body, a plurality of pillars on a first surface of the interposer body, and two or more local fiducials on the first surface of the interposer body; an LED die comprising a die body and a first die surface comprising a plurality of light emitting diodes (LEDs), the LED die being mounted on the plurality of pillars; and a flux material located between each of the pillars and a second die surface of the die body, the second die surface of the die body being opposite the first die surface, there being no flux material on a fiducial surface of each of the local fiducials. Methods of manufacturing a light emitting diode (LED) devices comprise: printing a flux material onto the pillars of the interposer, attaching an LED die to the pillars, and washing away excess flux material.Type: GrantFiled: March 24, 2021Date of Patent: April 2, 2024Assignee: Lumileds LLCInventors: Chee-Jong Loh, Khar Kheng Tok, Chew-Hong Lee
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Publication number: 20240006260Abstract: A package is disclosed. In one example, the package includes an electronic component and an encapsulant encapsulating at least part of the electronic component. A first electrically conductive structure is arranged on one side of the electronic component, a second electrically conductive structure arranged on an opposing other side of the electronic component and being electrically coupled with the electronic component, and at least one sidewall recess at the encapsulant. The first electrically conductive structure and the second electrically conductive structure are configured to be at different electric potentials during operation of the package. The first electrically conductive structure and the second electrically conductive structure are exposed at opposing main surfaces of the encapsulant.Type: ApplicationFiled: May 8, 2023Publication date: January 4, 2024Applicant: Infineon Technologies AGInventors: Chee Hong LEE, Soon Lock GOH, Chai Chee LEE, Swee Kah LEE, Luay Kuan ONG, Chee Voon TAN
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Patent number: 11791169Abstract: A method for fabricating an electronic device includes providing an encapsulant having an encapsulation material, providing a first laser beam and forming a trench into a main surface of the encapsulant by removing the encapsulation material by means of the first laser beam, forming a mask along a portion above the edge of the trench, and providing a second laser beam and sweeping the second laser beam over a surface area of the main surface of the encapsulant, wherein the surface area covers at least an area spatially confined by the trench.Type: GrantFiled: August 14, 2020Date of Patent: October 17, 2023Assignee: INFINEON TECHNOLOGIES AGInventors: Pei Luan Pok, Roslie Saini bin Bakar, Chau Fatt Chiang, Chee Hong Lee, Swee Kah Lee, Yu Shien Leong, Jan Sing Loh, Yean Seng Ng
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Publication number: 20230170226Abstract: A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.Type: ApplicationFiled: November 29, 2021Publication date: June 1, 2023Inventors: Chau Fatt Chiang, Thorsten Meyer, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee, Swee Kah Lee, Norliza Morban, Khay Chwan Andrew Saw
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Publication number: 20220375883Abstract: A method for fabricating an electrical or electronic device package includes providing a first plateable encapsulation layer; activating first selective areas on a main surface of the first plateable encapsulation layer; forming a first metallization layer by electrolytic or electroless plating on the first activated areas; and fabricating a passive electrical component on the basis of the first metallization layer.Type: ApplicationFiled: May 11, 2022Publication date: November 24, 2022Inventors: Kok Yau Chua, Paul Armand Asentista Calo, Chee Hong Lee
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Publication number: 20220278085Abstract: The method for fabricating an electrical module is disclosed. In one example, the method includes providing a bottom unit comprising a plateable encapsulant. Selective areas of the bottom unit are activated thereby turning them into electrically conductive regions. At least one electrical device comprising external contact elements is provided. The method includes placing the electrical device on the bottom unit so that the external contact elements are positioned above at least a first subset of the electrically conductive regions, and performing a plating process on the electrically conductive regions for generating plated regions and for electrically connecting the external contact elements with at least a first subset of the plated regions.Type: ApplicationFiled: February 22, 2022Publication date: September 1, 2022Applicant: Infineon Technologies AGInventors: Chau Fatt CHIANG, Paul Armand Asentista CALO, Chan Lam CHA, Kok Yau CHUA, Chee Hong LEE, Swee Kah LEE, Theng Chao LONG, Jayaganasan NARAYANASAMY, Khay Chwan Andrew SAW
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Publication number: 20220102263Abstract: A semiconductor package includes: a carrier having an electrically insulative body and a first contact structure at a first side of the electrically insulative body; and a semiconductor die having a first pad attached to the first contact structure of the carrier, the first pad being at source or emitter potential. The first pad is spaced inward from an edge of the semiconductor die by a first distance. The semiconductor die has an edge termination region between the edge and the first pad. The first contact structure of the carrier is spaced inward from the edge of the semiconductor die by a second distance greater than the first distance such that an electric field that emanates from the edge termination region in a direction of the carrier during normal operation of the semiconductor die does not reach the first contact structure of the carrier. Methods of production are also provided.Type: ApplicationFiled: August 27, 2021Publication date: March 31, 2022Inventors: Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee, Jayaganasan Narayanasamy, Ralf Otremba
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Patent number: 11289436Abstract: Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound having a plurality of laser-activated regions which are plated with an electrically conductive material to form metal pads and/or metal traces at a first side of the laser-activatable mold compound. A semiconductor die embedded in the laser-activatable mold compound has a plurality of die pads. An interconnect electrically connects the plurality of die pads of the semiconductor die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound.Type: GrantFiled: May 28, 2020Date of Patent: March 29, 2022Assignee: Infineon Technologies Austria AGInventors: Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Swee Kah Lee, Chee Yang Ng, Klaus Schiess
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Patent number: 11274984Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.Type: GrantFiled: June 2, 2020Date of Patent: March 15, 2022Assignee: INFINEON TECHNOLOGIES AGInventors: Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee, Swee Kah Lee, Theng Chao Long, Jayaganasan Narayanasamy, Khay Chwan Saw
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Publication number: 20210313294Abstract: A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.Type: ApplicationFiled: March 24, 2021Publication date: October 7, 2021Inventors: Chau Fatt Chiang, Xavier Arokiasamy, Naveendran Chellamuthu, Chee Chiew Chong, Joo Ming Goa, Chee Hong Lee, Muhammat Sanusi Muhammad, Chee Voon Tan, Wee Boon Tay
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Publication number: 20210050227Abstract: A method for fabricating an electronic device includes providing an encapsulant having an encapsulation material, providing a first laser beam and forming a trench into a main surface of the encapsulant by removing the encapsulation material by means of the first laser beam, forming a mask along a portion above the edge of the trench, and providing a second laser beam and sweeping the second laser beam over a surface area of the main surface of the encapsulant, wherein the surface area covers at least an area spatially confined by the trench.Type: ApplicationFiled: August 14, 2020Publication date: February 18, 2021Inventors: Pei Luan Pok, Roslie Saini bin Bakar, Chau Fatt Chiang, Chee Hong Lee, Swee Kah Lee, Yu Shien Leong, Jan Sing Loh, Yean Seng Ng
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Publication number: 20210025774Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.Type: ApplicationFiled: June 2, 2020Publication date: January 28, 2021Inventors: Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee, Swee Kah Lee, Theng Chao Long, Jayaganasan Narayanasamy, Khay Chwan Saw
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Publication number: 20200381380Abstract: Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound having a plurality of laser-activated regions which are plated with an electrically conductive material to form metal pads and/or metal traces at a first side of the laser-activatable mold compound. A semiconductor die embedded in the laser-activatable mold compound has a plurality of die pads. An interconnect electrically connects the plurality of die pads of the semiconductor die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound.Type: ApplicationFiled: May 28, 2020Publication date: December 3, 2020Inventors: Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Swee Kah Lee, Chee Yang Ng, Klaus Schiess
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Patent number: 10777536Abstract: Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.Type: GrantFiled: December 7, 2018Date of Patent: September 15, 2020Assignee: Infineon Technologies AGInventors: Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin, Hock Heng Chong, Kok Yau Chua, Hsieh Ting Kuek, Chee Hong Lee, Soon Lee Liew, Nurfarena Othman, Pei Luan Pok, Werner Reiss, Stefan Schmalzl
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Publication number: 20190181120Abstract: Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.Type: ApplicationFiled: December 7, 2018Publication date: June 13, 2019Inventors: Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin, Hock Heng Chong, Kok Yau Chua, Hsieh Ting Kuek, Chee Hong Lee, Soon Lee Liew, Nurfarena Othman, Pei Luan Pok, Werner Reiss, Stefan Schmalzl
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Patent number: 7758359Abstract: A USB plug comprises a shell, a stationary port, upper and lower sliders and a levering device. The shell has an opening formed at a front end thereof and two pairs of terminal pins connected at a rear end thereof. The stationary port extending horizontally is fixed at a middle of the rear end of the shell, each side of the port being provided with two pairs of contacts in electrically connection with the terminal pins. The upper and lower sliders respectively have first sides thereof facing towards each other and second sides thereof being slidable along upper and lower sidewalls of the shell, each one slider having two metal contacts provided on the first side thereof corresponding to the contacts of the stationary port. The levering device is operatively provided between the upper and lower sliders in order to alternately shift the upper and lower sliders by means of an external intrusion force exerted on one of the upper and lower sliders.Type: GrantFiled: April 24, 2009Date of Patent: July 20, 2010Assignee: Thomson LicensingInventors: Ronald Chiu, Chee Hong Lee, Wing Hon Tsang
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Publication number: 20090215314Abstract: A USB plug comprises a shell, a stationary port, upper and lower sliders and a levering device. The shell has an opening formed at a front end thereof and two pairs of terminal pins connected at a rear end thereof. The stationary port extending horizontally is fixed at a middle of the rear end of the shell, each side of the port being provided with two pairs of contacts in electrically connection with the terminal pins. The upper and lower sliders respectively have first sides thereof facing towards each other and second sides thereof being slidable along upper and lower sidewalls of the shell, each one slider having two metal contacts provided on the first side thereof corresponding to the contacts of the stationary port. The levering device is operatively provided between the upper and lower sliders in order to alternately shift the upper and lower sliders by means of an external intrusion force exerted on one of the upper and lower sliders.Type: ApplicationFiled: April 24, 2009Publication date: August 27, 2009Inventors: Ronald Chiu, Chee Hong Lee, Wing Hon Tsang
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Patent number: 7553172Abstract: A USB plug comprises a shell, a stationary port, upper and lower sliders and a levering device. The shell has an opening formed at a front end thereof and two pairs of terminal pins connected at a rear end thereof. The stationary port extending horizontally is fixed at a middle of the rear end of the shell, each side of the port being provided with two pairs of contacts in electrically connection with the terminal pins. The upper and lower sliders respectively have first sides thereof facing towards each other and second sides thereof being slidable along upper and lower sidewalls of the shell, each one slider having two metal contacts provided on the first side thereof corresponding to the contacts of the stationary port. The levering device is operatively provided between the upper and lower sliders in order to alternately shift the upper and lower sliders by means of an external intrusion force exerted on one of the upper and lower sliders.Type: GrantFiled: November 22, 2005Date of Patent: June 30, 2009Assignee: Thomson LicensingInventors: Ronald Chiu, Chee Hong Lee, Wing Hon Tsang
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Publication number: 20080254680Abstract: A USB plug comprises a shell, a stationary port, upper and lower sliders and a levering device. The shell has an opening formed at a front end thereof and two pairs of terminal pins connected at a rear end thereof. The stationary port extending horizontally is fixed at a middle of the rear end of the shell, each side of the port being provided with two pairs of contacts in electrically connection with the terminal pins. The upper and lower sliders respectively have first sides thereof facing towards each other and second sides thereof being slidable along upper and lower sidewalls of the shell, each one slider having two metal contacts provided on the first side thereof corresponding to the contacts of the stationary port. The levering device is operatively provided between the upper and lower sliders in order to alternately shift the upper and lower sliders by means of an external intrusion force exerted on one of the upper and lower sliders.Type: ApplicationFiled: November 22, 2005Publication date: October 16, 2008Inventors: Ronald Chiu, Chee Hong Lee, Wing Hon Tsang