Patents by Inventor Chee Keong Phua

Chee Keong Phua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SHIELDING SILICON FROM EXTERNAL RF INTERFERENCE
    Publication number: 20140151846
    Abstract: Consistent with an example embodiment, there is an integrated circuit device (IC) built on a substrate of a thickness. The IC comprises an active device region of a shape, the active device region having a topside and an underside. Through silicon vias (TSVs) surround the active device region, the TSVs having a depth defined by the substrate thickness. On the underside of and having the shape of the active device region, is an insulating layer. A thin-film conductive shield is on the insulating layer, the conductive shield is in electrical contact with the TSVs.
    Type: Application
    Filed: December 4, 2012
    Publication date: June 5, 2014
    Applicant: NXP B. V.
    Inventor: Chee Keong Phua
  • Shielding silicon from external RF interference
    Patent number: 8729679
    Abstract: Consistent with an example embodiment, there is an integrated circuit device (IC) built on a substrate of a thickness. The IC comprises an active device region of a shape, the active device region having a topside and an underside. Through silicon vias (TSVs) surround the active device region, the TSVs having a depth defined by the substrate thickness. On the underside of and having the shape of the active device region, is an insulating layer. A thin-film conductive shield is on the insulating layer, the conductive shield is in electrical contact with the TSVs.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: May 20, 2014
    Assignee: NXP, B.V.
    Inventor: Chee Keong Phua