Patents by Inventor Chee Keong Tan
Chee Keong Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12120814Abstract: A stretchable interconnect structure for electrically connecting electronic devices and a method of fabricating a stretchable interconnect structure for electrically connecting electronic devices. The method comprises the steps of providing an electrically conductive wire having a 3-dimensional helical form; and embedding the electrically conductive wire in a substrate made from an elastic material.Type: GrantFiled: January 16, 2020Date of Patent: October 15, 2024Assignee: NATIONAL UNIVERSITY OF SINGAPOREInventors: Chee Keong Tee, Yue Zhao, Yu Jun Tan
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Publication number: 20240325669Abstract: A positioning and stabilising structure for a patient interface is arranged to provide a force to hold a seal-forming structure of the patient interface in a therapeutically effective position on a patient's head in use. The positioning and stabilising structure has an expanded configuration and a compact configuration that is more compact in at least one dimension than the expanded configuration, and comprises one or more resilient structures for transforming from the compact configuration to the expanded configuration.Type: ApplicationFiled: July 7, 2022Publication date: October 3, 2024Inventors: Teong Hong CHUAH, Mohankumar Krishnan VALIYAMBATH, Thontira SUPAOPASPHUN, Chee Keong ONG, Beng Hai TAN
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Patent number: 12091538Abstract: A dielectric material, to a device comprising the dielectric material and to use of the dielectric material in the fabrication of a device. One dielectric material may comprise a halogen-based elastomer mixed with a halogen based surfactant and exhibiting electro-mechanical self-healing properties and/or an increased dielectric constant compared to the halogen-based elastomer. Another dielectric material may comprise a halogen-based polymer mixed with a halogen based surfactant and exhibiting an increased dielectric constant compared to the halogen-based polymer.Type: GrantFiled: May 31, 2019Date of Patent: September 17, 2024Assignee: NATIONAL UNIVERSITY OF SINGAPOREInventors: Chee Keong Tee, Yu Jun Tan
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Publication number: 20240279113Abstract: Herein disclosed is an aggregate comprising a cement comprising ordinary Portland cement, a ground granulated blast-furnace slag, and bottom ash, wherein the cement is hydrated in the presence of the ground granulated blast-furnace slag to have a calcium silicate hydrate or derivative thereof formed which encapsulate the bottom ash. A method of producing the aggregate is disclosed herein also, the method comprising mixing the cement and the ground granulated blast-furnace slag with the bottom ash in the presence of water to form pre-coated bottom ash, and granulating the pre-coated bottom ash.Type: ApplicationFiled: July 29, 2022Publication date: August 22, 2024Inventors: Chee Keong GOH, Lok Hing TANG, Soorya Prakash -, Sui Shong LOH, Eik Shuan TAN
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Publication number: 20200035790Abstract: A material structure and system for generating a III-Nitride digital alloy.Type: ApplicationFiled: July 8, 2019Publication date: January 30, 2020Inventors: Nelson TANSU, Wei SUN, Chee-Keong TAN
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Patent number: 10347722Abstract: A material structure and system for generating a III-Nitride digital alloy.Type: GrantFiled: March 4, 2016Date of Patent: July 9, 2019Assignee: LEHIGH UNIVERSITYInventors: Nelson Tansu, Wei Sun, Chee-Keong Tan
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Publication number: 20160260804Abstract: A material structure and system for generating a III-Nitride digital alloy.Type: ApplicationFiled: March 4, 2016Publication date: September 8, 2016Inventors: Nelson TANSU, Wei SUN, Chee-Keong TAN
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Patent number: 9402213Abstract: The present invention relates to a method of dynamic channel switching in a wireless mesh network that is in conformance with an IEEE 802.11s standard. The method comprises the steps of transmitting a request frame to a node for scanning a channel associated with the node; determining a link quality of the channel; receiving a response frame from the node; and switching to the channel if the switching metric is larger than a switching threshold, wherein if otherwise, remain unswitched. The switching metric integrates the interference, transmission frame size, latency of channel switching and data rate of the node on the channel.Type: GrantFiled: July 31, 2014Date of Patent: July 26, 2016Assignee: TELEKOM MALAYSIA BERHADInventors: Chin Kwang Lee, Chee Keong Tan, Chun Yeow Yeoh, Wee Keong Lim, Mohammad Harris Bin Mokhtar
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Patent number: 9294831Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.Type: GrantFiled: August 19, 2015Date of Patent: March 22, 2016Assignee: Sennheiser electronic GmbH & Co. KGInventors: Chee Keong Tan, Yuen Shen Wong
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Publication number: 20160037396Abstract: The present invention relates to a method of dynamic channel switching in a wireless mesh network that is in conformance with an IEEE 802.11s standard. The method comprises the steps of transmitting a request frame to a node for scanning a channel associated with the node; determining a link quality of the channel; receiving a response frame from the node; and switching to the channel if the switching metric is larger than a switching threshold, wherein if otherwise, remain unswitched.Type: ApplicationFiled: July 31, 2014Publication date: February 4, 2016Inventors: Chin Kwang Lee, Chee Keong Tan, Chun Yeow Yeoh, Wee Keong Lim, Mohammad Harris Bin Mokhtar
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Publication number: 20150358711Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.Type: ApplicationFiled: August 19, 2015Publication date: December 10, 2015Inventors: Chee Keong Tan, Yuen Shen Wong
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Patent number: 9143855Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.Type: GrantFiled: October 7, 2014Date of Patent: September 22, 2015Assignee: Sennheiser electronic GmbH & Co. KGInventors: Chee Keong Tan, Yuen Shen Wong
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Patent number: 9071905Abstract: An in-ear earphone including a housing having a first end for receiving a cable, and a second end which is placed in a concha of a user. Provided at the second end is a sealing unit which seals off an outer end of the ear canal in the region of the concha. The sealing unit has a first and a second end. The sealing unit further has a portion between the first and second ends, wherein both the inside diameter and also the outside diameter of the second end increase in the direction of the second end.Type: GrantFiled: May 24, 2013Date of Patent: June 30, 2015Assignee: Sennheiser electronic GmbH & Co. KGInventors: Chee Keong Tan, Mei Ling Tan
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Publication number: 20150055816Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.Type: ApplicationFiled: October 7, 2014Publication date: February 26, 2015Inventors: Chee Keong Tan, Yuen Shen Wong
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Patent number: 8897480Abstract: There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).Type: GrantFiled: September 15, 2009Date of Patent: November 25, 2014Assignee: Sennheiser electronic GmbH & Co. KGInventors: Chee Keong Tan, Yuen Shen Wong
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Publication number: 20140037123Abstract: An in-ear earphone including a housing having a first end for receiving a cable, and a second end which is placed in a concha of a user. Provided at the second end is a sealing unit which seals off an outer end of the ear canal in the region of the concha. The sealing unit has a first and a second end. The sealing unit further has a portion between the first and second ends, wherein both the inside diameter and also the outside diameter of the second end increase in the direction of the second end.Type: ApplicationFiled: May 24, 2013Publication date: February 6, 2014Applicant: Sennheiser electronic GmbH & Co. KGInventors: Chee Keong Tan, Mei Ling Tan
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Publication number: 20120269375Abstract: There is provided an earphone comprising a housing having a fist and a second end. The housing has a first opening at the first end and a second opening at the second end for receiving an electroacoustic reproduction transducer. The earphone further has a second pressure reducing unit which is placed over the second opening to reduce the dynamic water pressure on the second opening, and a first pressure reducing unit which is placed over the first opening to reduce the dynamic water pressure on the first opening. In addition a second water-tight but acoustically transparent film is provided in the interior of the housing over the second opening to water-tightly close the second opening. A first water-tight but acoustically transparent film is placed in the interior of the housing over the first hole to water-tightly close the first hole.Type: ApplicationFiled: August 24, 2010Publication date: October 25, 2012Inventors: Chee Keong Tan, Peng Koon Quek, Virgilio Pascua, JR.
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Publication number: 20110255729Abstract: There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).Type: ApplicationFiled: September 15, 2009Publication date: October 20, 2011Applicant: Sennheiser Electronic GmbH & Co. KGInventors: Chee Keong Tan, Yuen Shen Wong
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Publication number: 20110002498Abstract: There is provided an in-ear earphone comprising a housing (100), a transducer housing (200) and a support unit (300). The transducer housing (200) serves to receive an electroacoustic transducer. The support unit (300) is connected to the housing (100) and is adapted to be anchored in a concha of a wearer. The support unit (300) is at least partially made from a soft flexible material. In that way it can be ensured that the in-ear earphone can be anchored in any concha of a wearer.Type: ApplicationFiled: December 15, 2008Publication date: January 6, 2011Applicant: Sennheiser electronic GmbH & Co., KGInventors: Yuen Shen Wong, Chee Keong Tan
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Patent number: 6791346Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.Type: GrantFiled: May 8, 2002Date of Patent: September 14, 2004Assignee: St. Assembly Test Services Pte LtdInventors: Rajiv Mehta, Liop-Jin Yap, Raymundo M. Camenforte, Chee-Keong Tan