Patents by Inventor Chee Keong Tan

Chee Keong Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931512
    Abstract: A patient interface including a positioning and stabilizing structure that is configured to maintain a first seal-forming structure and a second seal-forming structure in a therapeutically effective position. The positioning and stabilizing structure comprises a frame coupled to the plenum chamber. The frame includes a central portion coupled to the plenum chamber outside of the cavity. The frame also includes a pair of arms that extend away from the central portion in a posterior direction past the second seal-forming structure. The pair of arms are more flexible than the central portion. The positioning and stabilizing structure also includes headgear straps coupled to the frame, which configured to provide a tensile force to the first seal-forming structure and to the second seal-forming structure into the patient's face via the frame.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: March 19, 2024
    Assignee: ResMed Pty Ltd
    Inventors: Matthew Eves, Andrew James Bate, Sebastien Deubel, Paul Derrick Watson, Matthew Robin Wells, Beng Hai Tan, Chee Keong Ong, Marvin Sugi Hartono, Han Cheng Lin
  • Publication number: 20200035790
    Abstract: A material structure and system for generating a III-Nitride digital alloy.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 30, 2020
    Inventors: Nelson TANSU, Wei SUN, Chee-Keong TAN
  • Patent number: 10347722
    Abstract: A material structure and system for generating a III-Nitride digital alloy.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: July 9, 2019
    Assignee: LEHIGH UNIVERSITY
    Inventors: Nelson Tansu, Wei Sun, Chee-Keong Tan
  • Publication number: 20160260804
    Abstract: A material structure and system for generating a III-Nitride digital alloy.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 8, 2016
    Inventors: Nelson TANSU, Wei SUN, Chee-Keong TAN
  • Patent number: 9402213
    Abstract: The present invention relates to a method of dynamic channel switching in a wireless mesh network that is in conformance with an IEEE 802.11s standard. The method comprises the steps of transmitting a request frame to a node for scanning a channel associated with the node; determining a link quality of the channel; receiving a response frame from the node; and switching to the channel if the switching metric is larger than a switching threshold, wherein if otherwise, remain unswitched. The switching metric integrates the interference, transmission frame size, latency of channel switching and data rate of the node on the channel.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: July 26, 2016
    Assignee: TELEKOM MALAYSIA BERHAD
    Inventors: Chin Kwang Lee, Chee Keong Tan, Chun Yeow Yeoh, Wee Keong Lim, Mohammad Harris Bin Mokhtar
  • Patent number: 9294831
    Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: March 22, 2016
    Assignee: Sennheiser electronic GmbH & Co. KG
    Inventors: Chee Keong Tan, Yuen Shen Wong
  • Publication number: 20160037396
    Abstract: The present invention relates to a method of dynamic channel switching in a wireless mesh network that is in conformance with an IEEE 802.11s standard. The method comprises the steps of transmitting a request frame to a node for scanning a channel associated with the node; determining a link quality of the channel; receiving a response frame from the node; and switching to the channel if the switching metric is larger than a switching threshold, wherein if otherwise, remain unswitched.
    Type: Application
    Filed: July 31, 2014
    Publication date: February 4, 2016
    Inventors: Chin Kwang Lee, Chee Keong Tan, Chun Yeow Yeoh, Wee Keong Lim, Mohammad Harris Bin Mokhtar
  • Publication number: 20150358711
    Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.
    Type: Application
    Filed: August 19, 2015
    Publication date: December 10, 2015
    Inventors: Chee Keong Tan, Yuen Shen Wong
  • Patent number: 9143855
    Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: September 22, 2015
    Assignee: Sennheiser electronic GmbH & Co. KG
    Inventors: Chee Keong Tan, Yuen Shen Wong
  • Patent number: 9071905
    Abstract: An in-ear earphone including a housing having a first end for receiving a cable, and a second end which is placed in a concha of a user. Provided at the second end is a sealing unit which seals off an outer end of the ear canal in the region of the concha. The sealing unit has a first and a second end. The sealing unit further has a portion between the first and second ends, wherein both the inside diameter and also the outside diameter of the second end increase in the direction of the second end.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: June 30, 2015
    Assignee: Sennheiser electronic GmbH & Co. KG
    Inventors: Chee Keong Tan, Mei Ling Tan
  • Publication number: 20150055816
    Abstract: There is provided an in-ear earphone having a housing for receiving an electroacoustic transducer and an expansion adaptor unit which is coupled to the housing of the in-ear earphone. The expansion adaptor unit has an expansion unit with an upper portion having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion to the housing of the in-ear earphone, wherein the expansion unit has at least two flexible legs as coupling elements, wherein one leg is coupled to a first end of the upper portion and a second leg is coupled to a second end of the upper portion.
    Type: Application
    Filed: October 7, 2014
    Publication date: February 26, 2015
    Inventors: Chee Keong Tan, Yuen Shen Wong
  • Patent number: 8897480
    Abstract: There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: November 25, 2014
    Assignee: Sennheiser electronic GmbH & Co. KG
    Inventors: Chee Keong Tan, Yuen Shen Wong
  • Publication number: 20140037123
    Abstract: An in-ear earphone including a housing having a first end for receiving a cable, and a second end which is placed in a concha of a user. Provided at the second end is a sealing unit which seals off an outer end of the ear canal in the region of the concha. The sealing unit has a first and a second end. The sealing unit further has a portion between the first and second ends, wherein both the inside diameter and also the outside diameter of the second end increase in the direction of the second end.
    Type: Application
    Filed: May 24, 2013
    Publication date: February 6, 2014
    Applicant: Sennheiser electronic GmbH & Co. KG
    Inventors: Chee Keong Tan, Mei Ling Tan
  • Publication number: 20120269375
    Abstract: There is provided an earphone comprising a housing having a fist and a second end. The housing has a first opening at the first end and a second opening at the second end for receiving an electroacoustic reproduction transducer. The earphone further has a second pressure reducing unit which is placed over the second opening to reduce the dynamic water pressure on the second opening, and a first pressure reducing unit which is placed over the first opening to reduce the dynamic water pressure on the first opening. In addition a second water-tight but acoustically transparent film is provided in the interior of the housing over the second opening to water-tightly close the second opening. A first water-tight but acoustically transparent film is placed in the interior of the housing over the first hole to water-tightly close the first hole.
    Type: Application
    Filed: August 24, 2010
    Publication date: October 25, 2012
    Inventors: Chee Keong Tan, Peng Koon Quek, Virgilio Pascua, JR.
  • Publication number: 20110255729
    Abstract: There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).
    Type: Application
    Filed: September 15, 2009
    Publication date: October 20, 2011
    Applicant: Sennheiser Electronic GmbH & Co. KG
    Inventors: Chee Keong Tan, Yuen Shen Wong
  • Publication number: 20110002498
    Abstract: There is provided an in-ear earphone comprising a housing (100), a transducer housing (200) and a support unit (300). The transducer housing (200) serves to receive an electroacoustic transducer. The support unit (300) is connected to the housing (100) and is adapted to be anchored in a concha of a wearer. The support unit (300) is at least partially made from a soft flexible material. In that way it can be ensured that the in-ear earphone can be anchored in any concha of a wearer.
    Type: Application
    Filed: December 15, 2008
    Publication date: January 6, 2011
    Applicant: Sennheiser electronic GmbH & Co., KG
    Inventors: Yuen Shen Wong, Chee Keong Tan
  • Patent number: 6791346
    Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: September 14, 2004
    Assignee: St. Assembly Test Services Pte Ltd
    Inventors: Rajiv Mehta, Liop-Jin Yap, Raymundo M. Camenforte, Chee-Keong Tan
  • Patent number: 6535004
    Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: March 18, 2003
    Assignee: ST Assembly Test Service Ltd.
    Inventors: Rajiv Mehta, Liop-Jin Yap, Raymundo M. Camenforte, Chee-Keong Tan
  • Publication number: 20020125908
    Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.
    Type: Application
    Filed: May 8, 2002
    Publication date: September 12, 2002
    Applicant: ST ASSEMBLY TEST SERVICES PTE LTD.
    Inventors: Rajiv Mehta, Liop-Jin Yap, Raymundo M. Camenforte, Chee-Keong Tan
  • Publication number: 20020125909
    Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.
    Type: Application
    Filed: May 8, 2002
    Publication date: September 12, 2002
    Applicant: ST ASSEMBLY TEST SERVICES PTE LTD
    Inventors: Rajiv Mehta, Liop-Jin Yap, Raymundo M. Camenforte, Chee-Keong Tan