Patents by Inventor Chee Kit Chew

Chee Kit Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230058246
    Abstract: Plug and receptacle connectors for improving crosstalk are provided. The plug connector includes a first set of plug terminals, a second set of plug terminals, a first plate-shaped shielding member, and a second plate-shaped shielding member. The first set of plug terminals include first ground terminals and first signal terminals, where the first plate-shaped shielding member is provided below the first set of plug terminals. The first plate-shaped shielding member is welded to the first ground terminals and transversely crosses and covers the first signal terminals without contacting the first signal terminals. The second set of plug terminals include second ground terminals and second signal terminals, where the second plate-shaped shielding member is provided above the second set of plug terminals. The second plate-shaped shielding member is welded to the second ground terminals and transversely crosses and covers the second signal terminals without contacting the second signal terminals.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 23, 2023
    Applicant: Molex, LLC
    Inventors: Weng-Heng LIONG, Chee Kit CHEW
  • Publication number: 20170289410
    Abstract: Techniques and mechanisms for exchanging image data via a three-wire data channel of an interconnect, at least a portion of which is disposed in or on a substrate of a printed circuit board. In an embodiment, three data signals are concurrently exchanged in parallel, each via a different respective trace portion of the data channel. The substrate has disposed therein or thereon three filter structures each to perform filtering of a different respective one of the three signals. The filter structures each include a respective sequence of corrugations to increase a stray capacitance provided by a substrate material. In another embodiment, the interconnect is compatible with a Mobile Industry Processor Interface (MIPI) camera physical layer interface (C-PHY) standard.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 5, 2017
    Inventors: Mohd Muhaiyiddin Bin Abdullah, Chee Kit Chew, Chung-Hao Chen
  • Publication number: 20160173055
    Abstract: Techniques for impedance matching are described herein. The techniques include an apparatus for impedance matching including a trace section having a load impedance. The trace section comprises characteristics generating an impedance match between a main channel impedance and the load impedance.
    Type: Application
    Filed: December 15, 2014
    Publication date: June 16, 2016
    Applicant: INTEL CORPORATION
    Inventors: Michael W. Leddige, Wei Jern Tan, Chee Kit Chew, Natasya Athirah Abdul Khalid, Howard L. Heck