Patents by Inventor Chee Kit YUEN

Chee Kit YUEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210098859
    Abstract: The present invention belongs to the field of communication technology and discloses a highly elastic antenna made of bonding wires, which comprises a base plate, a line matched transformer, bonding wires, a primary PCB, a secondary PCB and a line inlet. The upper part of the said base plate is provided with a line matched transformer, a bonding wire, a primary PCB and a secondary PCB, one end of the said primary PCB is connected to the line inlet, a line matched transformer is fixed on the upper part of the primary PCB, and the primary PCB is connected to the secondary PCB via bonding wires. In the present invention, bonding wires are employed as a component of antenna radiant elements. As a radiating antenna, the bonding wire may extend into the third dimensional space via its height, thus reducing the space occupied by the antenna on the PCB. One or more bonding wires may be used for different PCB antennas and the resonant frequency may be adjusted by the length or height of the bonding wire.
    Type: Application
    Filed: October 1, 2019
    Publication date: April 1, 2021
    Inventors: Chee Kit YUEN, Wai Yin MUNG, Ka Ming WU
  • Patent number: 10749561
    Abstract: The utility model belongs to the technical field of headphones, and discloses a headphone transmitting and receiving signals through a feed plate antenna with an L-shaped probe, which comprises a wireless circuit board, a panel, a probe, a plate and a PCB. The bottom of the said PCB is provided with a wireless circuit board, the said PCB is electrically connected to the probe, the top of the said PCB is provided with a panel, and the other end of the said probe is electromagnetically coupled with the plate. The utility model may render different geometric shapes with respect to different designs, and its different characteristic designs may support multiple frequency bands, providing high directivity, so that the headphone product itself transmits and receives signals better. In addition, the antenna can be made part of the appearance, which enables the headphone product itself to transmit and receive signals better.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: August 18, 2020
    Assignee: ACOUSTIC INNOVATION (HUIZHOU) CO. LTD.
    Inventors: Chee Kit Yuen, Wai Yin Mung, Ka Ming Wu
  • Publication number: 20180376248
    Abstract: A micro loudspeaker includes a frame with open top, T-yoke, magnet, washer, diaphragm, voice coil, protective cap and circuit board. The diaphragm includes a dome portion and a corrugated rim portion connected to the dome portion in a circumferential direction of the dome portion. Profiles of cross sections of the dome portion and the corrugated rim portion are each a multi-segment arc. A ring-shaped step for connecting the diaphragm is formed on an inner wall of the frame and above the washer. A height difference between the ring-shaped step and the washer ranges from 0.1 mm to 0.8 mm. The bottom of an edge of the corrugated rim portion is connected to a top surface of the ring-shaped step. The cap is placed over the diaphragm, and is provided with a through hole having a diameter ranging from 1-3 mm at the center opposite to the dome portion.
    Type: Application
    Filed: July 26, 2018
    Publication date: December 27, 2018
    Inventors: Chee Kit Yuen, Lei Zheng, Yuanyuan Li
  • Patent number: 9674600
    Abstract: The utility model relates to an earphone with air release valve, comprising a shell, the shell is provided with an earphone rear cavity for accommodating a sounding unit, the sounding unit is placed in the earphone rear cavity and fixedly connected with the shell, the side of the shell facing the human ear is connected with an ear pad, the earphone is provided with an air release hole on the earphone shell between the earphone rear cavity and the earphone sound chamber cavity, and the air release hole is provided with an air release valve which automatically opens due to the increase of pressure. Therefore, when the people wear the earphone or transmit the earphone, the instantaneous pressure wave produced in the sound chamber cavity can be discharged from the air release valve.
    Type: Grant
    Filed: August 21, 2013
    Date of Patent: June 6, 2017
    Assignee: ACOUSTIC INNOVATION (HUIZHOU) CO., LTD.
    Inventor: Chee Kit Yuen
  • Publication number: 20160212524
    Abstract: The utility model relates to an earphone with air release valve, comprising a shell, the shell is provided with an earphone rear cavity for accommodating a sounding unit, the sounding unit is placed in the earphone rear cavity and fixedly connected with the shell, the side of the shell facing the human ear is connected with an ear pad, the earphone is provided with an air release hole on the earphone shell between the earphone rear cavity and the earphone sound chamber cavity, and the air release hole is provided with an air release valve which automatically opens due to the increase of pressure. Therefore, when the people wear the earphone or transmit the earphone, the instantaneous pressure wave produced in the sound chamber cavity can be discharged from the air release valve.
    Type: Application
    Filed: August 21, 2013
    Publication date: July 21, 2016
    Inventor: Chee Kit YUEN