Patents by Inventor Chee Klang Yew

Chee Klang Yew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin stacked integrated circuit device
    Patent number: 6137164
    Abstract: A thin, stacked face-to-face integrated circuit packaging structure includes a chips attached to both major surfaces of a rigid interposer, and interconnected by printed wiring traces and vias to external solder ball contacts attached to the interposer.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: October 24, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Chee Klang Yew, Siu Waf Low, Min Yu Chan