Patents by Inventor Chee Koang Chen

Chee Koang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit
    Patent number: 7678616
    Abstract: An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part. The first metallic layer is directly placed on top of an exterior surface of the ceiling wall of the integrated heat spreader as well as the back surface of the integrated circuit.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: March 16, 2010
    Assignee: Intel Corporation
    Inventors: Jiun Hann Sir, Chee Koang Chen
  • Integrated circuit thermal management method and apparatus
    Patent number: 7439618
    Abstract: An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part. The first metallic layer is directly placed on top of an exterior surface of the ceiling wall of the integrated heat spreader as well as the back surface of the integrated circuit.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: October 21, 2008
    Assignee: Intel Corporation
    Inventors: Jiun Hann Sir, Chee Koang Chen
  • INTEGRATED CIRCUIT THERMAL MANAGEMENT METHOD AND APPARATUS
    Publication number: 20080254573
    Abstract: An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part. The first metallic layer is directly placed on top of an exterior surface of the ceiling wall of the integrated heat spreader as well as the back surface of the integrated circuit.
    Type: Application
    Filed: June 20, 2008
    Publication date: October 16, 2008
    Inventors: Jiun Hann Sir, Chee Koang Chen
  • Providing a metal layer in a semiconductor package
    Patent number: 7332823
    Abstract: In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer formed on the substrate. In some embodiments, the mold layer is substantially coplanar with the metal layer to improve package performance. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: February 19, 2008
    Assignee: Intel Corporation
    Inventors: Lee Peng Khaw, Chee Koang Chen, Wooi Aun Tan, Tze Yang Hin