Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.

Abstract: A system is configured to run jobs in Kubernetes based on PBS job inputs. The system may convert a PBS input, such as in the form of a PBS job command line input and/or a PBS job script, to a Kubernetes job configuration file. A Kubernetes system may then perform a job according to the Kubernetes job configuration file. Through implementation of the conversion process, PBS users can leverage the capabilities of Kubernetes to have jobs performed without having to know how to use Kubernetes.

Abstract: The present disclosure discloses a method for obtaining optimal variational parameters of a ground state wavefunction for a Hamiltonian system. The method includes initializing a plurality of variational parameters and sending the variational parameters to a quantum computing portion to output a plurality of measurement results. The method includes transmitting the measurement results to a classical computing portion to update the plurality of variational parameters based on the plurality of measurement results and an update rule, and determining whether a measured energy satisfies a convergence rule. When the measured energy does not satisfy the convergence rule, the method includes sending the plurality of updated variational parameters to the quantum computing portion for a next iteration; and when the measured energy satisfies the convergence rule, the method includes obtaining a plurality of optimal variational parameters for the Hamiltonian system.

Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.

Abstract: A system is configured to run jobs in Kubernetes based on PBS job inputs. The system may convert a PBS input, such as in the form of a PBS job command line input and/or a PBS job script, to a Kubernetes job configuration file. A Kubernetes system may then perform a job according to the Kubernetes job configuration file. Through implementation of the conversion process, PBS users can leverage the capabilities of Kubernetes to have jobs performed without having to know how to use Kubernetes.

Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.

Abstract: The present disclosure discloses a method for obtaining optimal variational parameters of a ground state wavefunction for a Hamiltonian system. The method includes initializing a plurality of variational parameters and sending the variational parameters to a quantum computing portion to output a plurality of measurement results. The method includes transmitting the measurement results to a classical computing portion to update the plurality of variational parameters based on the plurality of measurement results and an update rule, and determining whether a measured energy satisfies a convergence rule. When the measured energy does not satisfy the convergence rule, the method includes sending the plurality of updated variational parameters to the quantum computing portion for a next iteration; and when the measured energy satisfies the convergence rule, the method includes obtaining a plurality of optimal variational parameters for the Hamiltonian system.

Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.

Abstract: Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.

Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.

Abstract: An air cavity package includes a dielectric frame that is formed from a polyimide or a liquid crystal polymer (LCP). The dielectric frame is joined to a flange and to electrical leads using a polyimide adhesive.

Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the window covering the opening there-through and attached to the assembly via a solder pre-form.

Abstract: Disclosed in this specification is selectively plated lead frame assembly and a method for the production thereof. A nickel-plated substrate is selectively masked to protect the bottom surface and a central portion of the top surface of the substrate. Gold is then plated on the unmasked portions. A preformed solder ring is soldered to the exposed gold.

Abstract: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.