Abstract: Methods and apparatus for measuring and/or controlling the temperature on the surface or inside of microchips are provided, including using thermally responsive polymers.

Abstract: Briefly, in accordance with one embodiment of the invention, a switch structure or the like such as a valve, motor, or optical switch, may be constructed based on a thermoresponsive polymer. At a first temperature the thermoresponsive polymer may be in a first volume state, and at a second temperate the thermoresponsive polymer may be in a second volume state. The change in volume of the thermoresponsive polymer may be operative to push or pull the mechanical structures of the switch, valve, motor, optical switch, and so on, to effectuate operation of the structures.

Abstract: Methods and apparatus for measuring and/or controlling the temperature on the surface or inside of microchips are provided, including using thermally responsive polymers.

Abstract: A system may include an integrated circuit die, an integrated circuit package coupled to a first face of the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an overlayer coupled to the mold compound and to a second face of the integrated circuit die.