Abstract: A fiber-based, plastic-free drinking cup is formed by providing a fiber-based slurry comprising a hydrophobic additive and a strength additive, then forming a drinking cup component by compressing and drying the fiber-based slurry in a form press assembly having an internal shape characterized by a conic frustum. The fiber-based slurry may include a dry pulp mixture of virgin fiber and recycled fiber, the hydrophobic additive is 1.0-10.0% of the dry pulp weight, and the strength additive is 1.0-10.0% of the dry pulp weight. In particular, the fiber-based slurry may include about 50% bleached hardwood, about 50% bleached softwood, about 2.5% strength additive, and about 3.5% hydrophobic additive by dry pulp weight.

Abstract: The present invention provides nomograms and methods or predicting survival probabilities for patients diagnosed with metastatic pancreatic cancer based upon patient characteristics such as neutrophil to lymphocyte ratio, albumin level, Karnofsky performance status, the sum of the longest diameter of target lesions, liver metastasis, previous Whipple procedure, treatment with nab-paclitaxel, and analgesic use. In some aspects, the nomograms or methods are implemented by a non-transitory computer-readable storage medium.

Abstract: Integrate circuit die terminal arrangements and configurations for mounting an integrate circuit die on a package substrate to reduce package transmission paths. In one embodiment, terminals for signals sensitive to trace length outside a die are arranged at the corners of the die. The die is mounted on a package substrate in an angle with respect to a package substrate to point the corners of the die at the edges of the package substrate to reduce trace length outside the die. The center of the die may or may not coincide with the center of the substrate. In one embodiment, when compare to a centered, non-rotated die mounting position, mounting a die with corners pointing at the edges of the package substrate does not cause significant differences in substrate warpage.

Abstract: An embedded host controller, for use in a USB system comprising a processor and an associated system memory, comprises a DMA controller, and the host controller is adapted such that, in order to retrieve data from the associated system memory, a starting address and block length are sent to the DMA controller, and the DMA controller is adapted such that, on receipt of a starting address and block length sent from the host controller, it retrieves the indicated data from the associated system memory. This has the advantage that the embedded host controller can be used with different host microprocessors, without assuming that PCI functionality is available.

Abstract: A process is disclosed for modifying a parent ligand by attaching to the parent ligand a conjugation agent that is reactive with a moiety of a target receptor to which the parent ligand binds such that a covalent bond is formable between the conjugation agent and the receptor moiety. Also disclosed are compositions, probes and methods of detecting and/or quantifying receptors using the modified ligands of the invention.

Abstract: Integrate circuit die terminal arrangements and configurations for mounting an integrate circuit die on a package substrate to reduce package transmission paths. In one embodiment, terminals for signals sensitive to trace length outside a die are arranged at the corners of the die. The die is mounted on a package substrate in an angle with respect to a package substrate to point the corners of the die at the edges of the package substrate to reduce trace length outside the die. The center of the die may or may not coincide with the center of the substrate. In one embodiment, when compare to a centered, non-rotated die mounting position, mounting a die with corners pointing at the edges of the package substrate does not cause significant differences in substrate warpage.

Abstract: According to embodiments of the present invention, a balun is disposed on a package that is to receive a die. In embodiments, the balun includes a first metal trace disposed on a first base and a second metal trace disposed on a second base. In embodiments, the first metal trace is one-quarter wavelength of an operating wavelength for a radio frequency (RF) signal and the second metal trace is three-quarters wavelength of the wavelength.

Abstract: A patch mechanism is described, which can be used to detect and workaround defects and conditions existing in an integrated circuit chip. The patch mechanism includes a trigger-matching logic incorporated within an integrated circuit chip to capture an incoming request cycle and determine if the captured incoming cycle matches one or more of trigger conditions. The patch mechanism further includes a control logic coupled to the trigger-matching logic to select a set of instructions upon detection of at least one matched trigger condition and to execute operations corresponding to the selected set of instructions. The control logic is configured to select the set of instructions based on the at least one matched trigger condition.

Abstract: A system is described for providing a patch mechanism within an input/output (I/O) controller, which can be used to workaround defects and conditions existing in the I/O controller. The system includes a patch module coupled to a completion queue included in the I/O controller. The patch module is used to sample incoming cycles received by the I/O controller and to determine if the captured incoming cycle matches one or more of preprogrammed trigger conditions. The patch module is capable of working around a captured non-posted request cycle by controlling header information loaded into the completion queue and by instructing the completion queue whether or not to discard a completion received from a designated end-device.