Abstract: An isolation device includes a first integrated circuit in electrical communication with first circuitry. The first integrated circuit includes a first light emitter portion to emit a first optical signal based on first electrical signals received at the first integrated circuit from the first circuitry. The isolation device includes a second integrated circuit in electrical communication with second circuitry. The second integrated circuit includes a first light-sensitive area to convert the first optical signal into second electrical signals for communication to the second circuitry. The isolation device includes an isolation material between the first integrated circuit and the second integrated circuit to electrically isolate the first integrated circuit from the second integrated circuit and to pass the first optical signal from the first light emitter portion to the first light-sensitive area.

Abstract: An isolation device includes a first integrated circuit in electrical communication with first circuitry. The first integrated circuit includes a first light emitter portion to emit a first optical signal based on first electrical signals received at the first integrated circuit from the first circuitry. The isolation device includes a second integrated circuit in electrical communication with second circuitry. The second integrated circuit includes a first light-sensitive area to convert the first optical signal into second electrical signals for communication to the second circuitry. The isolation device includes an isolation material between the first integrated circuit and the second integrated circuit to electrically isolate the first integrated circuit from the second integrated circuit and to pass the first optical signal from the first light emitter portion to the first light-sensitive area.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more folded leads that establish an enhanced isolation gap. The enhanced isolation gap increases the creepage distance of the opto-coupler and increases operational voltages that can be accommodated by the opto-coupler.

Abstract: Various embodiments of methods and devices are provided for an optocoupler comprising a layer of dielectric optically semi-reflective and transmissive material disposed between an LED and a first photodetector located above an upper surface of the layer, and a second photodetector located beneath the lower surface of the layer. The layer reflects a first portion of light generated by the LED towards the first photodetector to generate LED feedback control signals, and transmits a second portion of light generated by the LED through the layer for detection by the second photodetector to generate isolated output signals.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more folded leads that establish an enhanced isolation gap. The enhanced isolation gap increases the creepage distance of the opto-coupler and increases operational voltages that can be accommodated by the opto-coupler.

Abstract: Various embodiments of methods and devices are provided for an optocoupler comprising a layer of dielectric optically semi-reflective and transmissive material disposed between an LED and a first photodetector located above an upper surface of the layer, and a second photodetector located beneath the lower surface of the layer. The layer reflects a first portion of light generated by the LED towards the first photodetector to generate LED feedback control signals, and transmits a second portion of light generated by the LED through the layer for detection by the second photodetector to generate isolated output signals.

Abstract: Various embodiments of methods and devices are provided for a thermally-sensitive optocoupler package. A layer in the optocoupler package has an upper surface and a lower surface, and comprises a thermally-sensitive material. In the package, an LED emits infrared or near-infrared light and a photodetector receives at least a portion of such emitted light and in response provides isolated output signals therefrom. The LED is located above the upper surface, and the photodetector is located beneath the lower surface. The thermally-sensitive material is configured such that an amount of light emitted by the LED, incident on the material and the layer, and transmitted through the material and the layer, changes in accordance with changes in ambient temperature or local thermal conditions.

Abstract: Various embodiments of methods and devices are provided for a self-aligning pick and place collet having proximal and distal ends configured for use with a tape and reel machine. A suction area is located at a distal end of the collet. A pick and place collet contact area is located adjacent to and outwardly from the suction area, and comprises tapered sidewalls that depend downwardly and outwardly away from the outer periphery of the suction area. The tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to cause an electronic device to substantially self-align and center itself with respect to the collet when engaged thereby.

Abstract: A galvanic isolator having a transmitter die, a receiver die, and a lead frame is disclosed. The transmitter die includes an LED having first and second contacts for powering the LED, and the receiver die includes a photodetector. The lead frame includes first and second transmitter leads, and first and second receiver leads. The transmitter die is bonded to the first lead, the first contact being connected electrically to the first transmitter lead and the second contact being connected to the second transmitter lead. The receiver die is connected to the first and second receiver leads. The LED and the photodetector are positioned such that light generated by the LED is received by the photodetector. The first and second transmitter leads are capacitively coupled to the first receiver lead. The capacitive couplings are characterized by first and second capacitance values that are substantially the same.

Abstract: A galvanic isolator having a transmitter die, a receiver die, and a lead frame is disclosed. The transmitter die includes an LED having first and second contacts for powering the LED, and the receiver die includes a photodetector. The lead frame includes first and second transmitter leads, and first and second receiver leads. The transmitter die is bonded to the first lead, the first contact being connected electrically to the first transmitter lead and the second contact being connected to the second transmitter lead. The receiver die is connected to the first and second receiver leads. The LED and the photodetector are positioned such that light generated by the LED is received by the photodetector. The first and second transmitter leads are capacitively coupled to the first receiver lead. The capacitive couplings are characterized by first and second capacitance values that are substantially the same.

Abstract: A galvanic isolator having a transmitter die, a receiver die, and a lead frame is disclosed. The transmitter die includes an LED having first and second contacts for powering the LED, and the receiver die includes a photodetector. The lead frame includes first and second transmitter leads, and first and second receiver leads. The transmitter die is bonded to the first lead, the first contact being connected electrically to the first transmitter lead and the second contact being connected to the second transmitter lead. The receiver die is connected to the first and second receiver leads. The LED and the photodetector are positioned such that light generated by the LED is received by the photodetector. The first and second transmitter leads are capacitively coupled to the first receiver lead. The capacitive couplings are characterized by first and second capacitance values that are substantially the same.