Patents by Inventor Chee Min LOH

Chee Min LOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240006786
    Abstract: The present disclosure is directed to a printed circuit board having a composite upper surface with a first section of a first-type of printed circuit board and a second section of a second-type of printed circuit board, for which the first section of the first-type of printed circuit board and the second section of the second-type of printed circuit board are coupled, respectively, to at least one device that is configured to abridge the first and second sections of the composite upper surface. In an aspect, the second-type of printed circuit board is configured to be embedded in the first-type of printed circuit board and the first-type of printed circuit board is configured to receive the second-type of printed circuit board.
    Type: Application
    Filed: July 4, 2022
    Publication date: January 4, 2024
    Inventors: Howe Yin LOO, Tin Poay CHUAH, Jenny Shio Yin ONG, Chee Min LOH, Bok Eng CHEAH, Jackson Chung Peng KONG, Seok Ling LIM, Kooi Chi OOI