Abstract: A wafer side edge cleaning apparatus includes: a cleaning device including a fixing element and a wafer brush disposed beneath the fixing element. The wafer brush is in the shape of a frustum. The frustum has a tapered surface contacting with a side edge of a wafer. The top surface of the frustum is larger than the bottom surface of the frustum. When cleaning the side edge of the wafer, the wafer and the wafer brush are rotated in different directions and a cleaning solution flows out from the fixing element rinses and washes the side edge brush.

Abstract: A shielding member applicable in a deposition apparatus is provided. The shielding member includes a base metal and an adhesion promoter layer arc-sprayed on the base metal, wherein adhesion promoter layer has a thickness gradient increasing from an upper end of the shielding member to a lower end of the shielding member. More preferably, no adhesion promoter layer is formed in the upper 10 cm of the shielding member, adjacent to a target layer.