Abstract: There is provided an optical navigation device including a substrate, a light sensor, a first light source, a second light source and a light directing member. The light sensor is arranged on the substrate and has a field of view (FOV) perpendicular to the substrate. The emission light of the first light source forms a first illumination light beam after passing the light directing member. The emission light of the second light source forms a second illumination light beam after passing the light directing member. A first crossover region of the first illumination light beam with the FOV is closer to the substrate than a second crossover region of the second illumination light beam with the FOV.

Abstract: The invention provides an optical sensor package. The optical sensor package includes: a substrate; a sensor disposed on the substrate; a glass cover disposed directly on the sensor; and a cap disposed on the substrate comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The thickness of the cap is 0.20 mm.

Abstract: The invention provides an optical sensor package. The optical sensor package includes: a printed circuit board (PCB); a sensor disposed on the PCB; a glass cover disposed directly on the sensor; and an aperture disposed on the PCB comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The cut-out section of the ceiling is smaller in area than the glass cover. The part of the aperture ceiling which overhangs the glass cover is thicker than the remaining part. The optical sensor package further includes an LED die disposed on the PCB, and Kapton tape placed over the ceiling of the aperture.

Abstract: The invention provides an optical sensor package. The optical sensor package includes: a printed circuit board (PCB); a sensor disposed on the PCB; a glass cover disposed directly on the sensor; and an aperture disposed on the PCB comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The cut-out section of the ceiling is smaller in area than the glass cover. The part of the aperture ceiling which overhangs the glass cover is thicker than the remaining part. The optical sensor package further includes an LED die disposed on the PCB, and Kapton tape placed over the ceiling of the aperture.

Abstract: There is provided a module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

Abstract: An apparatus includes a lens component and an integrated circuit package. The lens component has a lens and a through hole from a specific surface to a bottom surface of the lens component. The integrated circuit package has a sensor and a second portion on a top surface of the integrated circuit package. The first portion on the bottom surface of the lens component is adjacent and attached to the second portion on the top surface of the integrated circuit package by an adhesive material that is injected via the through hole to the first portion and the second portion, for fixing the lens component to the integrated circuit package.

Abstract: An apparatus includes a lens component and an integrated circuit package. The lens component has a lens and a through hole from a specific surface to a bottom surface of the lens component. The integrated circuit package has a sensor and a second portion on a top surface of the integrated circuit package. The first portion on the bottom surface of the lens component is adjacent and attached to the second portion on the top surface of the integrated circuit package by an adhesive material that is injected via the through hole to the first portion and the second portion, for fixing the lens component to the integrated circuit package.

Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.