Patents by Inventor Chee Shu Tay

Chee Shu Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal dissipation from a flip chip through an aperture in a flex cable
    Patent number: 7339268
    Abstract: A semiconductor die mounted to a flex cable is provided. The flex cable comprises a heat sink layer and a flex cable substrate having conductive traces disposed thereon. The flex cable substrate includes an aperture aligned with the semiconductor die. A thermal conductor disposed within the aperture contacts both the semiconductor die and the heat sink layer. The thermal conductor can comprise, for example, a set of solder balls.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: March 4, 2008
    Assignee: Western Digital Technologies, Inc.
    Inventors: Shufun Ho, Alex Y. Tsay, Ali Hosseinzadeh, Dennis W. Hogg, Chee Shu Tay