Patents by Inventor Chee Soon Law

Chee Soon Law has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module comprising a semiconductor chip
    Patent number: 9379046
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: June 28, 2016
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Module Comprising a Semiconductor Chip
    Publication number: 20150294926
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Application
    Filed: June 26, 2015
    Publication date: October 15, 2015
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Module comprising a semiconductor chip
    Patent number: 9123526
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: September 1, 2015
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Module Comprising a Semiconductor Chip
    Publication number: 20140110829
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Application
    Filed: December 30, 2013
    Publication date: April 24, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Module comprising a semiconductor chip
    Patent number: 8633102
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: January 21, 2014
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Module Comprising a Semiconductor Chip
    Publication number: 20120276693
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Application
    Filed: July 12, 2012
    Publication date: November 1, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Module comprising a semiconductor chip
    Patent number: 8237268
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: August 7, 2012
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law
  • Semiconductor package with ribbon with metal layers
    Patent number: 8022558
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: September 20, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chee Soon Law, Fong Lim, Zakaria Abdullah
  • SEMICONDUCTOR PACKAGE WITH RIBBON WITH METAL LAYERS
    Publication number: 20100207279
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 19, 2010
    Applicant: Infineon Technologies AG
    Inventors: Chee Soon Law, Fong Lim, Abdullah Zakaria
  • Module comprising a semiconductor chip
    Publication number: 20080230928
    Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
    Type: Application
    Filed: March 20, 2007
    Publication date: September 25, 2008
    Inventors: Ralf Otremba, Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law