Patents by Inventor Chee Teong LIM

Chee Teong LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12727306
    Abstract: A semiconductor device is electrically connected to a power source through an electrical contact and at least one bump disposed on the electrical contact. The semiconductor device may be an LED on a CMOS wafer with the electrical contact spaced apart from it and disposed on the wafer. The semiconductor device and the electrical contact have side coating material disposed to surround them, and the at least one bump may be stacked to reach or nearly reach the top surface of the side coating material. The at least one bump may have its top surface exposed by the side coating material.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: September 1, 2026
    Assignee: LUMILEDS SINGAPORE PTE. LTD.
    Inventors: Grigoriy Basin, Chee Ming Thoe, Chee Teong Lim, Chee Jong Loh
  • Publication number: 20230317905
    Abstract: A semiconductor device is electrically connected to a power source through an electrical contact and at least one bump disposed on the electrical contact. The semiconductor device may be an LED on a CMOS wafer with the electrical contact spaced apart from it and disposed on the wafer. The semiconductor device and the electrical contact have side coating material disposed to surround them, and the at least one bump may be stacked to reach or nearly reach the top surface of the side coating material. This allows wire bonding of the semiconductor device to an external power source through the easily accessible bump(s), whose top surface is exposed by the side coating material.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 5, 2023
    Applicant: LUMILEDS LLC
    Inventors: Grigoriy BASIN, Chee Ming THOE, Chee Teong LIM, Chee Jong LOH