Patents by Inventor Chee Wai Albert Lu

Chee Wai Albert Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130168706
    Abstract: An array of light emitting devices and a method for large area fabrication of such is provided. The method includes providing a continuous flexible substrate and printing one or more layers of light emitting devices comprised of layers of transparent conductor, light emitting material, dielectric and electrode on the flexible substrate. The array of light emitting devices includes a flexible substrate and one or more layers of light emitting devices on the flexible substrate. The one or more layers of light emitting devices include layers of transparent conductor, light emitting material, dielectric and electrode.
    Type: Application
    Filed: September 7, 2012
    Publication date: July 4, 2013
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Budiman Salam, Chee Wai Albert Lu, Boon Keng Lok, Lia Lal Wai
  • Patent number: 8159413
    Abstract: In a double-stacked electromagnetic bandgap (EBG) structure, a first conductive plane and a second conductive plane are spaced apart in parallel. At least two EBG layers are embedded in parallel between the first conductive plane and the second conductive plane. The at least two EBG layers have different stopband characteristics. A plurality of vias connect the at least two EBG layers respectively to one of the first and second conductive planes. At least the vias connecting one of the EBG layers pass through via holes in cells of another EBG layer.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: April 17, 2012
    Assignee: Agency for Science, Technology and Research
    Inventors: Jongbae Park, Chee Wai Albert Lu, Joungho Kim
  • Publication number: 20120063973
    Abstract: In an embodiment, a flexible fluid storage and warming bag may be provided. The flexible fluid storage and warming bag may include two flexible main walls, each including a surrounding edge, the two flexible main walls overlapping each other and being fluid-tightly sealed together along the surrounding edges thereof, the bag including a single non-partitioned fluid chamber defined by and between the two flexible main walls and by the sealed surrounding edges; at least one fluid transfer port extending into the single non-partitioned fluid chamber and being configured to allow transfer of the fluid into and out of the bag; and an electrical heating element integrated with at least one of the two flexible main walls of the bag. A fluid storage and warming system may also be provided.
    Type: Application
    Filed: May 21, 2010
    Publication date: March 15, 2012
    Applicant: Agency for Science, Technology and Research
    Inventors: Gim Ching Jenny Ang, Joo Chuan Yeo, Chee Wai Albert Lu, Chee Wai Patrick Shi
  • Patent number: 7705691
    Abstract: A substrate for power decoupling and a method of forming a substrate for power decoupling. The substrate comprises one or more decoupling capacitors; and one or more interconnections to the decoupling capacitors. At least one of the interconnections comprises a lossy material.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: April 27, 2010
    Assignee: Agency for Science, Technology & Research
    Inventors: Chee Wai Albert Lu, Boon Keng Lok, Chee Khuen Stephen Wong, Kai Meng Chua, Lai Lai Wai, Sunnappan Vasudivan
  • Publication number: 20090148962
    Abstract: A substrate structure and method of wideband power decoupling comprising one or more embedded capacitors each comprising a ferroelectric material.
    Type: Application
    Filed: December 30, 2008
    Publication date: June 11, 2009
    Applicant: Agency for Science, Technology and Research
    Inventors: Chee Wai Albert Lu, Boon Keng Lok