Patents by Inventor Chee Wai Siew

Chee Wai Siew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a wire bond with multiple stitch bonds
    Patent number: 7214606
    Abstract: The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.
    Type: Grant
    Filed: March 11, 2004
    Date of Patent: May 8, 2007
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Yam Mo Wong, Chee Wai Siew, Wei Liu, Zuo Cheng Shen