Patents by Inventor Chee Wai Soong

Chee Wai Soong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to bond two surfaces with precured epoxy and optical subassembly including the same
    Patent number: 10151892
    Abstract: In an example, a method may include dispensing a portion of epoxy on a first surface. The method may also include curing the portion of epoxy to form precured epoxy. The method may also include positioning the first surface and a second surface separated from each other by a gap. The precured epoxy is located within the gap between the first surface and the second surface. The method may also include dispensing bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface. The method may also include curing the bulk epoxy to bond the first surface to the second surface.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: December 11, 2018
    Assignee: Finisar Corporation
    Inventors: Kam Meng Chong, Chiew Loon Siew, Yih Pin Wong, Chee Wai Soong, Sarah Idayu Binti Zainal Arifin, Aziema Binti Mohamad Azizi, Shashipal Singh Dalbir Singh
  • METHOD TO BOND TWO SURFACES WITH PRECURED EPOXY AND OPTICAL SUBASSEMBLY INCLUDING THE SAME
    Publication number: 20170307835
    Abstract: In an example, a method may include dispensing a portion of epoxy on a first surface. The method may also include curing the portion of epoxy to form precured epoxy. The method may also include positioning the first surface and a second surface separated from each other by a gap. The precured epoxy is located within the gap between the first surface and the second surface. The method may also include dispensing bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface. The method may also include curing the bulk epoxy to bond the first surface to the second surface.
    Type: Application
    Filed: April 21, 2017
    Publication date: October 26, 2017
    Inventors: Kam Meng Chong, Chiew Loon Siew, Yih Pin Wong, Chee Wai Soong, Sarah Idayu Binti Zainal Arifin, Aziema Binti Mohamad Azizi, Shashipal Singh Dalbir Singh